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Class Information
Number: 257/E21.476
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Device having semiconductor body other than carbon, si, ge, sic, se, te, cu 2 o, cui, and group iii-v compounds with or without impurities, e.g., doping materials (epo) > Manufacture of electrodes on semiconductor bodies using processes or apparatus other than epitaxial growth, e.g., coating, diffusion, or alloying, or radiation treatment (epo)
Description: This subclass is indented under subclass E21.459. This subclass is substantially the same in scope as ECLA classification H01L21/44.










Sub-classes under this class:

Class Number Class Name Patents
257/E21.477 Deposition of conductive or insulating materials for electrode (epo) 71
257/E21.481 Including application of mechanical vibration, e.g., ultrasonic vibration (epo) 6
257/E21.48 Involving application of pressure, e.g., thermo compression bonding (epo) 32


Patents under this class:
1 2 3 4 5

Patent Number Title Of Patent Date Issued
8704216 Semiconductor device and manufacturing method thereof Apr. 22, 2014
8679970 Structure and process for conductive contact integration Mar. 25, 2014
8673727 Flexible non-volatile memory Mar. 18, 2014
8674351 Semiconductor device and semiconductor memory device Mar. 18, 2014
8642462 Interconnection designs and materials having improved strength and fatigue life Feb. 4, 2014
8633492 Semiconductor device and method for manufacturing the same Jan. 21, 2014
8629062 Method for forming tungsten film having low resistivity and good surface roughness and method for forming wiring of semiconductor device using the same Jan. 14, 2014
8618538 Thin film transistor array panel and manufacturing method thereof Dec. 31, 2013
8614106 Liner-free tungsten contact Dec. 24, 2013
8614107 Liner-free tungsten contact Dec. 24, 2013
8610119 Stability enhancements in metal oxide semiconductor thin film transistors Dec. 17, 2013
8603672 Semiconductor-covered cathode active material and lithium secondary battery using the same Dec. 10, 2013
8603918 Semiconductor devices and methods of manufacture thereof Dec. 10, 2013
8597992 Transistor and manufacturing method of the same Dec. 3, 2013
8592297 Wafer and method of processing wafer Nov. 26, 2013
8586474 Method to form a via Nov. 19, 2013
8581412 Semiconductor device comprising an electromagnetic waveguide Nov. 12, 2013
8563431 Method for manufacturing semiconductor device Oct. 22, 2013
8558350 Metal-oxide-metal capacitor structure Oct. 15, 2013
8551880 Ammonia-based plasma treatment for metal fill in narrow features Oct. 8, 2013
8552564 Hybrid-core through holes and vias Oct. 8, 2013
8552536 Flexible integrated circuit device layers and processes Oct. 8, 2013
8551824 Method for manufacturing semiconductor device Oct. 8, 2013
8546935 Semiconductor packages Oct. 1, 2013
8530346 Process of forming an electronic device including a conductive stud over a bonding pad region Sep. 10, 2013
8519485 Pillar structure for memory device and method Aug. 27, 2013
8518755 Method for manufacturing semiconductor device Aug. 27, 2013
8492758 Oxide semiconductor film and semiconductor device Jul. 23, 2013
8487447 Semiconductor structure having offset passivation to reduce electromigration Jul. 16, 2013
8481422 Prevention and reduction of solvent and solution penetration into porous dielectrics using a thin barrier layer Jul. 9, 2013
8476773 Electrical interconnect structure Jul. 2, 2013
8460966 Thin film transistor and method for fabricating thin film transistor Jun. 11, 2013
8455969 Semiconductor device and method for manufacturing the same Jun. 4, 2013
8455976 Semiconductor device and method of blowing fuse thereof Jun. 4, 2013
8446005 Semiconductor device having a bus configuration which reduces electromigration May. 21, 2013
8446007 Non-uniform alignment of wafer bumps with substrate solders May. 21, 2013
8445301 Thin-film transistor substrate, method of manufacturing the same, and display device including the same May. 21, 2013
8440560 Method for fabricating tungsten line and method for fabricating gate of semiconductor device using the same May. 14, 2013
8426868 Semiconductor device and method for manufacturing the same Apr. 23, 2013
8409914 Method for fabricating resistive memory device Apr. 2, 2013
8405191 Semiconductor device structures Mar. 26, 2013
8389310 Method for manufacturing oxide thin film transistor and method for manufacturing display device Mar. 5, 2013
8384082 Transistor using derivative polymethyl-methacrylate thin film as gate insulator and passivation layer, and fabrication method thereof Feb. 26, 2013
8378343 Semiconductor device and manufacturing method thereof Feb. 19, 2013
8367546 Methods for forming all tungsten contacts and lines Feb. 5, 2013
8354338 Carrier board structure with embedded semiconductor chip and fabrication method thereof Jan. 15, 2013
8354754 Layered chip for use in soldering Jan. 15, 2013
8338954 Semiconductor apparatus and fabrication method thereof Dec. 25, 2012
8318609 Method of depositing materials on a non-planar surface Nov. 27, 2012
8318540 Method of manufacturing a semiconductor structure Nov. 27, 2012

1 2 3 4 5










 
 
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