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Class Information
Number: 257/E21.438
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Device having semiconductor body comprising group iv elements or group iii-v compounds with or without impurities, e.g., doping materials (epo) > Multi-step process for the manufacture of unipolar device (epo) > Field-effect transistor (epo) > With an insulated gate (epo) > Using self-aligned silicidation, i.e., salicide (epo)
Description: This subclass is indented under subclass E21.409. This subclass is substantially the same in scope as ECLA classification H01L21/336M.


Sub-classes under this class:

Class Number Class Name Patents
257/E21.439 Providing different silicide thicknesses on gate and on source or drain (epo) 99


Patents under this class:

Patent Number Title Of Patent Date Issued
7618891 Method for forming self-aligned metal silicide contacts Nov. 17, 2009
7618855 Manufacturing method of semiconductor device Nov. 17, 2009
7595264 Fabrication method of semiconductor device Sep. 29, 2009
7595234 Fabricating method for a metal oxide semiconductor transistor Sep. 29, 2009
7585738 Method of forming a fully silicided semiconductor device with independent gate and source/drain doping and related device Sep. 8, 2009
7582563 Method for fabricating fully silicided gate Sep. 1, 2009
7575989 Method of manufacturing a transistor of a semiconductor device Aug. 18, 2009
7560379 Semiconductive device fabricated using a raised layer to silicide the gate Jul. 14, 2009
7553763 Salicide process utilizing a cluster ion implantation process Jun. 30, 2009
7550396 Method for reducing resist poisoning during patterning of silicon nitride layers in a semiconductor device Jun. 23, 2009
7547608 Polysilicon hard mask for enhanced alignment signal Jun. 16, 2009
7544616 Methods of forming nitride read only memory and word lines thereof Jun. 9, 2009
7544575 Dual metal silicide scheme using a dual spacer process Jun. 9, 2009
7538002 Semiconductor process integrating source/drain stressors and interlevel dielectric layer stressors May. 26, 2009
7534689 Stress enhanced MOS transistor and methods for its fabrication May. 19, 2009
7485572 Method for improved formation of cobalt silicide contacts in semiconductor devices Feb. 3, 2009
7482270 Fully and uniformly silicided gate structure and method for forming same Jan. 27, 2009
7479682 Structure of a field effect transistor having metallic silicide and manufacturing method thereof Jan. 20, 2009
7476617 Semiconductor device with epitaxial C49-titanium silicide (TiSi.sub.2) layer and method for fabricating the same Jan. 13, 2009
7476577 Semiconductor device and method of fabricating the same Jan. 13, 2009
7473627 Semiconducting device having a structure to improve contact processing margin, and method of fabricating the same Jan. 6, 2009
7465976 Tunneling field effect transistor using angled implants for forming asymmetric source/drain regions Dec. 16, 2008
7465634 Method of forming integrated circuit devices having n-MOSFET and p-MOSFET transistors with elevated and silicided source/drain structures Dec. 16, 2008
7446008 Method for fabricating silicide layers for semiconductor device Nov. 4, 2008
7435669 Method of fabricating transistor in semiconductor device Oct. 14, 2008
7432180 Method of fabricating a nickel silicide layer by conducting a thermal annealing process in a silane gas Oct. 7, 2008
7429525 Fabrication process of a semiconductor device Sep. 30, 2008
7422942 Method for fabricating a semiconductor device having an insulation film with reduced water content Sep. 9, 2008
7402520 Edge removal of silicon-on-insulator transfer wafer Jul. 22, 2008
7396764 Manufacturing method for forming all regions of the gate electrode silicided Jul. 8, 2008
7384852 Sub-lithographic gate length transistor using self-assembling polymers Jun. 10, 2008
7371599 Image sensor and method of forming the same May. 13, 2008
7368363 Method of manufacturing semiconductor device and method of treating semiconductor surface May. 6, 2008
7364995 Method of forming reduced short channel field effect transistor Apr. 29, 2008
7348248 CMOS transistor with high drive current and low sheet resistance Mar. 25, 2008
7344984 Technique for enhancing stress transfer into channel regions of NMOS and PMOS transistors Mar. 18, 2008
7344932 Use of silicon block process step to camouflage a false transistor Mar. 18, 2008
7320939 Semiconductor device fabricated by a method of reducing the contact resistance of the connection regions Jan. 22, 2008
7309649 Method of forming closed air gap interconnects and structures formed thereby Dec. 18, 2007
7309637 Method to enhance device performance with selective stress relief Dec. 18, 2007
7256096 Semiconductor device having a dual-damascene gate and manufacturing method thereof Aug. 14, 2007
7244996 Structure of a field effect transistor having metallic silicide and manufacturing method thereof Jul. 17, 2007
7223662 Method of forming an epitaxial layer for raised drain and source regions by removing surface defects of the initial crystal surface May. 29, 2007
7220632 Method of forming a semiconductor device and an optical device and structure thereof May. 22, 2007
7220623 Method for manufacturing silicide and semiconductor with the silicide May. 22, 2007
7217633 Methods for fabricating an STI film of a semiconductor device May. 15, 2007
7217624 Non-volatile memory device with conductive sidewall spacer and method for fabricating the same May. 15, 2007
7211515 Methods of forming silicide layers on source/drain regions of MOS transistors May. 1, 2007
7211491 Method of fabricating gate electrode of semiconductor device May. 1, 2007
7183169 Method and arrangement for reducing source/drain resistance with epitaxial growth Feb. 27, 2007



 
 
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