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Class Information
Number: 257/E21.321
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Device having semiconductor body comprising group iv elements or group iii-v compounds with or without impurities, e.g., doping materials (epo) > Treatment of semiconductor body using process other than deposition of semiconductor material on a substrate, diffusion or alloying of impurity material, or radiation treatment (epo) > To modify their internal properties, e.g., to produce internal imperfections (epo) > Of silicon body, e.g., for gettering (epo) > Thermally inducing defects using oxygen present in silicon body for intrinsic gettering (epo)
Description: This subclass is indented under subclass E21.318. This subclass is substantially the same in scope as ECLA classification H01L21/322B8.


Patents under this class:
1 2 3 4

Patent Number Title Of Patent Date Issued
7621996 Silicon wafer and method for producing same Nov. 24, 2009
7585683 Methods of fabricating ferroelectric devices Sep. 8, 2009
7538008 Method for producing a layer structure May. 26, 2009
7507640 Method for producing silicon wafer Mar. 24, 2009
7485929 Semiconductor-on-insulator (SOI) strained active areas Feb. 3, 2009
7485928 Arsenic and phosphorus doped silicon wafer substrates having intrinsic gettering Feb. 3, 2009
7422634 Three inch silicon carbide wafer with low warp, bow, and TTV Sep. 9, 2008
7410877 Method for manufacturing SIMOX wafer and SIMOX wafer Aug. 12, 2008
7397063 Semiconductor device Jul. 8, 2008
7368823 Semiconductor device and method of manufacturing the same May. 6, 2008
7326658 Method for preparing nitrogen-doped annealed wafer and nitrogen-doped and annealed wafer Feb. 5, 2008
7242075 Silicon wafers and method of fabricating the same Jul. 10, 2007
7071079 Epitaxial wafer and a method for producing it Jul. 4, 2006
7033962 Methods for manufacturing silicon wafer and silicone epitaxial wafer, and silicon epitaxial wafer Apr. 25, 2006
7011717 Method for heat treatment of silicon wafers and silicon wafer Mar. 14, 2006
6958092 Epitaxial silicon wafer with intrinsic gettering and a method for the preparation thereof Oct. 25, 2005
6896728 Process for producing low defect density, ideal oxygen precipitating silicon May. 24, 2005
6897084 Control of oxygen precipitate formation in high resistivity CZ silicon May. 24, 2005
6893944 Method of manufacturing a semiconductor wafer May. 17, 2005
6878645 Method for manufacturing silicon wafer Apr. 12, 2005
6858094 Silicon wafer and silicon epitaxial wafer and production methods therefor Feb. 22, 2005
6849119 Ideal oxygen precipitating silicon wafers and oxygen out-diffusion-less process therefor Feb. 1, 2005
6849901 Device layer of a silicon-on-insulator structure having vacancy dominated and substantially free of agglomerated vacancy-type defects Feb. 1, 2005
6843847 Silicon single crystal wafer and production method thereof and soi wafer Jan. 18, 2005
6840997 Vacancy, dominsated, defect-free silicon Jan. 11, 2005
6833195 Low temperature germanium transfer Dec. 21, 2004
6821344 Czochralski pullers including heat shield housings having sloping top and bottom Nov. 23, 2004
6818197 Epitaxial wafer Nov. 16, 2004
6809015 Method for heat treatment of silicon wafers and silicon wafer Oct. 26, 2004
6809011 Adjusting of defect profiles in crystal or crystalline-like structures Oct. 26, 2004
6808781 Silicon wafers with stabilized oxygen precipitate nucleation centers and process for making the same Oct. 26, 2004
6805742 Silicon semiconductor substrate and process for producing the same Oct. 19, 2004
6805743 Method for manufacturing single-crystal-silicon wafers Oct. 19, 2004
6803331 Process for the heat treatment of a silicon wafer, and silicon wafer produced Oct. 12, 2004
6803242 Evaluation method of IG effectivity in semiconductor silicon substrates Oct. 12, 2004
6780238 Argon/ammonia rapid thermal annealing for silicon wafers Aug. 24, 2004
6743289 Thermal annealing process for producing low defect density single crystal silicon Jun. 1, 2004
6713370 Process for the preparation of an ideal oxygen precipitating silicon wafer capable of forming an enhanced denuded zone Mar. 30, 2004
6709511 Process for suppressing oxygen precipitation in vacancy dominated silicon Mar. 23, 2004
6686260 Process for producing thermally annealed wafers having improved internal gettering Feb. 3, 2004
6676753 Czochralski pullers for manufacturing monocrystalline silicon ingots, including heat shield having sloped portions Jan. 13, 2004
6670261 Production method for annealed wafer Dec. 30, 2003
6666915 Method for the preparation of an epitaxial silicon wafer with intrinsic gettering Dec. 23, 2003
6645834 Method for manufacturing annealed wafer and annealed wafer Nov. 11, 2003
6638357 Method for revealing agglomerated intrinsic point defects in semiconductor crystals Oct. 28, 2003
6632278 Low defect density epitaxial wafer and a process for the preparation thereof Oct. 14, 2003
6605150 Low defect density regions of self-interstitial dominated silicon Aug. 12, 2003
6599815 Method and apparatus for forming a silicon wafer with a denuded zone Jul. 29, 2003
6599816 Method of manufacturing silicon epitaxial wafer Jul. 29, 2003
6586068 Ideal oxygen precipitating silicon wafer having an asymmetrical vacancy concentration profile and a process for the preparation thereof Jul. 1, 2003

1 2 3 4


 
 
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