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Class Information
Number: 257/E21.313
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Device having semiconductor body comprising group iv elements or group iii-v compounds with or without impurities, e.g., doping materials (epo) > Treatment of semiconductor body using process other than deposition of semiconductor material on a substrate, diffusion or alloying of impurity material, or radiation treatment (epo) > To change their surface-physical characteristics or shape, e.g., etching, polishing, cutting (epo) > Deposition/post-treatment of noninsulating, e.g., conductive - or resistive - layers on insulating layers (epo) > Post treatment (epo) > Physical or chemical etching of layer, e.g., to produce a patterned layer from pre-deposited extensive layer (epo) > By chemical means only (epo) > By vapor etching only (epo) > Pre- or post-treatment, e.g., anti-corrosion process (epo)
Description: This subclass is indented under subclass E21.31. This subclass is substantially the same in scope as ECLA classification H01L21/3213C4D.

Patents under this class:
1 2 3 4 5 6 7 8 9

Patent Number Title Of Patent Date Issued
8524552 Normally-off power JFET and manufacturing method thereof Sep. 3, 2013
8026171 Method of fabricating metal interconnection and method of fabricating image sensor using the same Sep. 27, 2011
7825026 Method for processing copper surface, method for forming copper pattern wiring and semiconductor device manufactured using such method Nov. 2, 2010
7670952 Method of manufacturing metal silicide contacts Mar. 2, 2010
7514365 Method of fabricating opening and plug Apr. 7, 2009
7208424 Method of forming a semiconductor device having a metal layer Apr. 24, 2007
7129185 Substrate processing method and a computer readable storage medium storing a program for controlling same Oct. 31, 2006
7125796 Plasma etch process for multilayer vias having an organic layer with vertical sidewalls Oct. 24, 2006
7071114 Method and apparatus for dry etching Jul. 4, 2006
7064079 Method of removing polymer and apparatus for doing the same Jun. 20, 2006
7055532 Method to remove fluorine residue from bond pads Jun. 6, 2006
7051742 Cleaning solutions including nucleophilic amine compound having reduction and oxidation potentials May. 30, 2006
7037852 Composition for stripping photoresist and method of preparing the same May. 2, 2006
7026246 Method of cleaning semiconductor substrates after forming tungsten patterns Apr. 11, 2006
7022610 Wet cleaning method to eliminate copper corrosion Apr. 4, 2006
7018937 Compositions for removal of processing byproducts and method for using same Mar. 28, 2006
7012051 Inhibition of titanium corrosion Mar. 14, 2006
7005239 Method of forming metal line Feb. 28, 2006
6984585 Method for removal of residue from a magneto-resistive random access memory (MRAM) film stack using a sacrificial mask layer Jan. 10, 2006
6977215 Tungsten plug corrosion prevention method using gas sparged water Dec. 20, 2005
6964928 Method for removing residue from a magneto-resistive random access memory (MRAM) film stack using a dual mask Nov. 15, 2005
6951823 Plasma ashing process Oct. 4, 2005
6946401 Plasma treatment for copper oxide reduction Sep. 20, 2005
6943142 Aqueous stripping and cleaning composition Sep. 13, 2005
6936544 Method of removing metal etching residues following a metal etchback process to improve a CMP process Aug. 30, 2005
6929713 In-situ photoresist removal by an attachable chamber with light source Aug. 16, 2005
6919272 Method for patterning densely packed metal segments in a semiconductor die and related structure Jul. 19, 2005
6918819 Method for defect reduction Jul. 19, 2005
6905969 Plasma etch reactor and method Jun. 14, 2005
6903015 Method of manufacturing a semiconductor device using a wet process Jun. 7, 2005
6890391 Method of manufacturing semiconductor device and apparatus for cleaning substrate May. 10, 2005
6875706 Cleaning solution and method of cleaning a semiconductor device using the same Apr. 5, 2005
6872322 Multiple stage process for cleaning process chambers Mar. 29, 2005
6867148 Removal of organic material in integrated circuit fabrication using ozonated organic acid solutions Mar. 15, 2005
6858539 Post-CMP treating liquid and method for manufacturing semiconductor device Feb. 22, 2005
6852595 Method of manufacturing a flash memory cell Feb. 8, 2005
6851432 Cleaning compositions Feb. 8, 2005
6852636 Insitu post etch process to remove remaining photoresist and residual sidewall passivation Feb. 8, 2005
6849153 Removal of post-rie polymer on A1/CU metal line Feb. 1, 2005
6841484 Method of fabricating a magneto-resistive random access memory (MRAM) device Jan. 11, 2005
6841525 Dilute cleaning composition and method for using same Jan. 11, 2005
6837943 Method and apparatus for cleaning a semiconductor substrate Jan. 4, 2005
6838015 Liquid or supercritical carbon dioxide composition Jan. 4, 2005
6835644 Method for making interconnect structures Dec. 28, 2004
6833081 Method of metal etching post cleaning Dec. 21, 2004
6830649 Apparatus and method for producing semiconductors Dec. 14, 2004
6821352 Compositions for removing etching residue and use thereof Nov. 23, 2004
6797188 Self-cleaning process for etching silicon-containing material Sep. 28, 2004
6797682 Resist stripper Sep. 28, 2004
6790734 Manufacturing method of semiconductor device Sep. 14, 2004

1 2 3 4 5 6 7 8 9

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