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Class Information
Number: 257/E21.309
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Device having semiconductor body comprising group iv elements or group iii-v compounds with or without impurities, e.g., doping materials (epo) > Treatment of semiconductor body using process other than deposition of semiconductor material on a substrate, diffusion or alloying of impurity material, or radiation treatment (epo) > To change their surface-physical characteristics or shape, e.g., etching, polishing, cutting (epo) > Deposition/post-treatment of noninsulating, e.g., conductive - or resistive - layers on insulating layers (epo) > Post treatment (epo) > Physical or chemical etching of layer, e.g., to produce a patterned layer from pre-deposited extensive layer (epo) > By chemical means only (epo) > By liquid etching only (epo)
Description: This subclass is indented under subclass E21.308. This subclass is substantially the same in scope as ECLA classification H01L21/3213C2.

Patents under this class:
1 2 3 4 5 6 7 8 9 10 11

Patent Number Title Of Patent Date Issued
8674342 Pad-less gate-all around semiconductor nanowire FETs on bulk semiconductor wafers Mar. 18, 2014
8623773 Etchant for metal layer including copper or a copper alloy, method of manufacturing a display substrate using the same and display substrate Jan. 7, 2014
8394652 Method for manufacturing substrate for semiconductor light emitting element and semiconductor light emitting element using the same Mar. 12, 2013
8383437 Echtant and method for manufacturing display device using the same Feb. 26, 2013
8349681 Ultrahigh density monolithic, three dimensional vertical NAND memory device Jan. 8, 2013
8338291 Producing transistor including multiple reentrant profiles Dec. 25, 2012
8293648 Mass production method of semiconductor integrated circuit device and manufacturing method of electronic device Oct. 23, 2012
8236694 Method for manufacturing micromechanical components Aug. 7, 2012
8193099 Protecting exposed metal gate structures from etching processes in integrated circuit manufacturing Jun. 5, 2012
8048689 Semiconductor chip with backside conductor structure Nov. 1, 2011
8043921 Nitride removal while protecting semiconductor surfaces for forming shallow junctions Oct. 25, 2011
8034717 Mass production method of semiconductor integrated circuit device and manufacturing method of electronic device Oct. 11, 2011
7981745 Sacrificial nitride and gate replacement Jul. 19, 2011
7977137 Latching zip-mode actuated mono wafer MEMS switch method Jul. 12, 2011
7977228 Methods for the formation of interconnects separated by air gaps Jul. 12, 2011
7977250 Stripper solution and method of manufacturing liquid crystal display using the same Jul. 12, 2011
7964509 Mass production method of semiconductor integrated circuit device and manufacturing method of electronic device Jun. 21, 2011
7960804 Latching zip-mode actuated mono wafer MEMS switch Jun. 14, 2011
7955989 Texturing semiconductor substrates Jun. 7, 2011
7927500 Poly etch without separate oxide decap Apr. 19, 2011
7927993 Cross-contamination control for semiconductor process flows having metal comprising gate electrodes Apr. 19, 2011
7879735 Cleaning solution for silicon surface and methods of fabricating semiconductor device using the same Feb. 1, 2011
7666781 Interconnect structures with improved electromigration resistance and methods for forming such interconnect structures Feb. 23, 2010
7629266 Etch compositions and methods of processing a substrate Dec. 8, 2009
7596862 Method of making a circuitized substrate Oct. 6, 2009
7592266 Removing solution, cleaning method for semiconductor substrate, and process for production of semiconductor device Sep. 22, 2009
7566666 Composition for removing an insulation material and related methods Jul. 28, 2009
7560380 Chemical dissolution of barrier and adhesion layers Jul. 14, 2009
7482282 Use of dilute hydrochloric acid in advanced interconnect contact clean in nickel semiconductor technologies Jan. 27, 2009
7459793 Methods for forming contact hole, for manufacturing circuit board and for manufacturing electro-optical device Dec. 2, 2008
7427545 Trench memory cells with buried isolation collars, and methods of fabricating same Sep. 23, 2008
7405165 Dual-tank etch method for oxide thickness control Jul. 29, 2008
7381583 MEMS RF switch integrated process Jun. 3, 2008
7358195 Method for fabricating liquid crystal display device Apr. 15, 2008
7358196 Wet chemical treatment to form a thin oxide for high k gate dielectrics Apr. 15, 2008
7325299 Method of making a circuitized substrate Feb. 5, 2008
7309658 Molecular self-assembly in substrate processing Dec. 18, 2007
7279411 Process for forming a redundant structure Oct. 9, 2007
7214597 Electronic components and method of fabricating the same May. 8, 2007
7208831 Semiconductor device having multilayer wiring structure and method, wherein connecting portion and wiring layer are formed of same layer Apr. 24, 2007
7185428 Method of making a circuitized substrate Mar. 6, 2007
7105458 Method of etching semiconductor devices using a hydrogen peroxide-water mixture Sep. 12, 2006
7056648 Method for isotropic etching of copper Jun. 6, 2006
7051742 Cleaning solutions including nucleophilic amine compound having reduction and oxidation potentials May. 30, 2006
7037832 Method of forming a conductive pattern by removing a compound with heat in a substantially inert atmosphere May. 2, 2006
7011981 Method for forming thin film and method for fabricating liquid crystal display using the same Mar. 14, 2006
7008548 Etchant for etching metal wiring layers and method for forming thin film transistor by using the same Mar. 7, 2006
6997988 System for processing a workpiece Feb. 14, 2006
6998347 Method of reworking layers over substrate Feb. 14, 2006
6995089 Method to remove copper without pattern density effect Feb. 7, 2006

1 2 3 4 5 6 7 8 9 10 11

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