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Class Information
Number: 257/E21.306
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Device having semiconductor body comprising group iv elements or group iii-v compounds with or without impurities, e.g., doping materials (epo) > Treatment of semiconductor body using process other than deposition of semiconductor material on a substrate, diffusion or alloying of impurity material, or radiation treatment (epo) > To change their surface-physical characteristics or shape, e.g., etching, polishing, cutting (epo) > Deposition/post-treatment of noninsulating, e.g., conductive - or resistive - layers on insulating layers (epo) > Post treatment (epo) > Physical or chemical etching of layer, e.g., to produce a patterned layer from pre-deposited extensive layer (epo) > By physical means only (epo)
Description: This subclass is indented under subclass E21.305. This subclass is substantially the same in scope as ECLA classification H01L21/3213B.

Sub-classes under this class:

Class Number Class Name Patents
257/E21.307 Of silicon-containing layer (epo) 20

Patents under this class:
1 2

Patent Number Title Of Patent Date Issued
7855132 Method of manufacturing bonded wafer Dec. 21, 2010
7767472 Substrate processing method and substrate processing apparatus Aug. 3, 2010
7670952 Method of manufacturing metal silicide contacts Mar. 2, 2010
7579202 Method for fabricating light emitting diode element Aug. 25, 2009
7071095 Barrier metal re-distribution process for resistivity reduction Jul. 4, 2006
7060196 FIB milling of copper over organic dielectrics Jun. 13, 2006
7037848 Methods of etching insulative materials, of forming electrical devices, and of forming capacitors May. 2, 2006
7008803 Method of reworking structures incorporating low-k dielectric materials Mar. 7, 2006
6903026 Sputter etch methods Jun. 7, 2005
6900137 Dry etch process to edit copper lines May. 31, 2005
6872669 PZT (111) texture through Ir texture improvement Mar. 29, 2005
6863787 Dummy copper deprocessing Mar. 8, 2005
6770566 Methods of forming semiconductor structures, and articles and devices formed thereby Aug. 3, 2004
6755945 Ionized PVD with sequential deposition and etching Jun. 29, 2004
6753262 Methods of etching insulative materials, of forming electrical devices, and of forming capacitors Jun. 22, 2004
6720522 Apparatus and method for laser beam machining, and method for manufacturing semiconductor devices using laser beam machining Apr. 13, 2004
6645872 Chemically enhanced focused ion beam micro-machining of copper Nov. 11, 2003
6528429 Methods of etching insulative materials, of forming electrical devices, and of forming capacitors Mar. 4, 2003
6514866 Chemically enhanced focused ion beam micro-machining of copper Feb. 4, 2003
6500758 Method for selective metal film layer removal using carbon dioxide jet spray Dec. 31, 2002
6488862 Etched patterned copper features free from etch process residue Dec. 3, 2002
6306779 Method for nano-structuring amorphous carbon layers Oct. 23, 2001
6251488 Precision spray processes for direct write electronic components Jun. 26, 2001
6140655 Method for water vapor enhanced charged-particle-beam machining Oct. 31, 2000
6068964 Method for patterning an insulator film and installing a grounding pin through electron beam irradiation May. 30, 2000
6069079 Exposure of desired node in a multi-layer integrated circuit using FIB and RIE May. 30, 2000
6057173 Ablative bond pad formation May. 2, 2000
6042738 Pattern film repair using a focused particle beam system Mar. 28, 2000
6010603 Patterned copper etch for micron and submicron features, using enhanced physical bombardment Jan. 4, 2000
5958799 Method for water vapor enhanced charged-particle-beam machining Sep. 28, 1999
5846875 Method of producing a semiconductor device Dec. 8, 1998
5693557 Method of fabricating a semiconductor device Dec. 2, 1997
5661068 Method of fabricating a semiconductor device Aug. 26, 1997
5474949 Method of fabricating capacitor or contact for semiconductor device by forming uneven oxide film and reacting silicon with metal containing gas Dec. 12, 1995
5221426 Laser etch-back process for forming a metal feature on a non-metal substrate Jun. 22, 1993
4999318 Method for forming metal layer interconnects using stepped via walls Mar. 12, 1991
4940508 Apparatus and method for forming die sites in a high density electrical interconnecting structure Jul. 10, 1990
4684437 Selective metal etching in metal/polymer structures Aug. 4, 1987
4680855 Electronic device manufacturing methods Jul. 21, 1987
4650543 Method of forming electrode pattern of semiconductor device Mar. 17, 1987
4584079 Step shape tailoring by phase angle variation RF bias sputtering Apr. 22, 1986
4470874 Planarization of multi-level interconnected metallization system Sep. 11, 1984
4396479 Ion etching process with minimized redeposition Aug. 2, 1983
4337132 Ion etching process with minimized redeposition Jun. 29, 1982
4335506 Method of forming aluminum/copper alloy conductors Jun. 22, 1982
4248688 Ion milling of thin metal films Feb. 3, 1981
4214966 Process useful in the fabrication of articles with metallized surfaces Jul. 29, 1980
4176016 Forming electrically insulating layers by sputter deposition Nov. 27, 1979
RE29947 Semiconductor pattern delineation by sputter etching process Mar. 27, 1979
4140572 Process for selective etching of polymeric materials embodying silicones therein Feb. 20, 1979

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