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Class Information
Number: 257/E21.303
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Device having semiconductor body comprising group iv elements or group iii-v compounds with or without impurities, e.g., doping materials (epo) > Treatment of semiconductor body using process other than deposition of semiconductor material on a substrate, diffusion or alloying of impurity material, or radiation treatment (epo) > To change their surface-physical characteristics or shape, e.g., etching, polishing, cutting (epo) > Deposition/post-treatment of noninsulating, e.g., conductive - or resistive - layers on insulating layers (epo) > Post treatment (epo) > Planarization (epo)
Description: This subclass is indented under subclass E21.3. This subclass is substantially the same in scope as ECLA classification H01L21/321P.










Sub-classes under this class:

Class Number Class Name Patents
257/E21.304 By chemical mechanical polishing (cmp) (epo) 1,250


Patents under this class:
1 2 3

Patent Number Title Of Patent Date Issued
8598039 Barrier layer removal method and apparatus Dec. 3, 2013
8569164 Through substrate structure, device package having the same, and methods for manufacturing the same Oct. 29, 2013
8551886 CMP process for processing STI on two distinct silicon planes Oct. 8, 2013
8552510 Semiconductor device having ring-shaped gate electrode, design apparatus, and program Oct. 8, 2013
8501620 Method for depositing tungsten film having low resistivity, low roughness and high reflectivity Aug. 6, 2013
8129270 Method for depositing tungsten film having low resistivity, low roughness and high reflectivity Mar. 6, 2012
8008165 Nitride semiconductor wafer and method of processing nitride semiconductor wafer Aug. 30, 2011
7994034 Temperature and pressure control methods to fill features with programmable resistance and switching devices Aug. 9, 2011
7709403 Silicon carbide-oxide layered structure, production method thereof, and semiconductor device May. 4, 2010
7682976 Methods of forming a phase-change material layer pattern, methods of manufacturing a phase-change memory device and related slurry compositions Mar. 23, 2010
7560380 Chemical dissolution of barrier and adhesion layers Jul. 14, 2009
7535082 Nitride semiconductor wafer and method of processing nitride semiconductor wafer May. 19, 2009
7510972 Method of processing substrate, post-chemical mechanical polishing cleaning method, and method of and program for manufacturing electronic device Mar. 31, 2009
7473607 Method of manufacturing a multi-workfunction gates for a CMOS circuit Jan. 6, 2009
7446045 Method of manufacturing nitride substrate for semiconductors Nov. 4, 2008
7399649 Semiconductor light-emitting device and fabrication method thereof Jul. 15, 2008
7375023 Method and apparatus for chemical mechanical polishing of semiconductor substrates May. 20, 2008
7307021 Method for planarizing a thin film Dec. 11, 2007
7247555 Method to control dual damascene trench etch profile and trench depth uniformity Jul. 24, 2007
7229926 Method of manufacturing nitride substrate for semiconductors, and nitride semiconductor substrate Jun. 12, 2007
7208831 Semiconductor device having multilayer wiring structure and method, wherein connecting portion and wiring layer are formed of same layer Apr. 24, 2007
7064057 Method and apparatus for localized material removal by electrochemical polishing Jun. 20, 2006
6995089 Method to remove copper without pattern density effect Feb. 7, 2006
6939795 Selective dry etching of tantalum and tantalum nitride Sep. 6, 2005
6939796 System, method and apparatus for improved global dual-damascene planarization Sep. 6, 2005
6881664 Process for planarizing upper surface of damascene wiring structure for integrated circuit structures Apr. 19, 2005
6881656 Production process for semiconductor apparatus Apr. 19, 2005
6875675 Method for manufacturing a semiconductor film having a planarized surface Apr. 5, 2005
6872668 Multi-step tungsten etchback process to preserve barrier integrity in an integrated circuit structure Mar. 29, 2005
6867137 Fabrication method for a semiconductor structure having a partly filled trench Mar. 15, 2005
6858512 Semiconductor device and method of producing the same Feb. 22, 2005
6852630 Electroetching process and system Feb. 8, 2005
6848975 Electrochemical planarization of metal feature surfaces Feb. 1, 2005
6837984 Methods and apparatus for electropolishing metal interconnections on semiconductor devices Jan. 4, 2005
6830993 Surface planarization of thin silicon films during and after processing by the sequential lateral solidification method Dec. 14, 2004
6821899 System, method and apparatus for improved local dual-damascene planarization Nov. 23, 2004
6811658 Apparatus for forming interconnects Nov. 2, 2004
6808617 Electrolytic polishing method Oct. 26, 2004
6805807 Adaptive GCIB for smoothing surfaces Oct. 19, 2004
6797583 Method of manufacturing capacitor in semiconductor devices Sep. 28, 2004
6783658 Electropolishing method Aug. 31, 2004
6780772 Method and system to provide electroplanarization of a workpiece with a conducting material layer Aug. 24, 2004
6770565 System for planarizing metal conductive layers Aug. 3, 2004
6713398 Method of planarizing polysillicon plug Mar. 30, 2004
6709979 Method of manufacturing a semiconductor device Mar. 23, 2004
6696358 Viscous protective overlayers for planarization of integrated circuits Feb. 24, 2004
6695962 Anode designs for planar metal deposits with enhanced electrolyte solution blending and process of supplying electrolyte solution using such designs Feb. 24, 2004
6670226 Planarizing method for fabricating gate electrodes Dec. 30, 2003
6645869 Etching back process to improve topographic planarization of a polysilicon layer Nov. 11, 2003
6613240 Method and apparatus for smoothing thin conductive films by gas cluster ion beam Sep. 2, 2003

1 2 3










 
 
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