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Class Information
Number: 257/E21.3
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Device having semiconductor body comprising group iv elements or group iii-v compounds with or without impurities, e.g., doping materials (epo) > Treatment of semiconductor body using process other than deposition of semiconductor material on a substrate, diffusion or alloying of impurity material, or radiation treatment (epo) > To change their surface-physical characteristics or shape, e.g., etching, polishing, cutting (epo) > Deposition/post-treatment of noninsulating, e.g., conductive - or resistive - layers on insulating layers (epo) > Post treatment (epo)
Description: This subclass is indented under subclass E21.294. This subclass is substantially the same in scope as ECLA classification H01L21/321.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7602006 |
Semiconductor flash device |
Oct. 13, 2009 |
| 7540935 |
Plasma oxidation and removal of oxidized material |
Jun. 2, 2009 |
| 7166543 |
Methods for forming an enriched metal oxide surface for use in a semiconductor device |
Jan. 23, 2007 |
| 7060577 |
Method for forming metal silicide layer in active area of semiconductor device |
Jun. 13, 2006 |
| 7037832 |
Method of forming a conductive pattern by removing a compound with heat in a substantially inert atmosphere |
May. 2, 2006 |
| 7015568 |
System for ultraviolet atmospheric seed layer remediation |
Mar. 21, 2006 |
| 6992388 |
Formation of micro rough polysurface for low sheet resistant salicided sub-quarter micron polylines |
Jan. 31, 2006 |
| 6979848 |
Memory system with conductive structures embedded in foamed insulator |
Dec. 27, 2005 |
| 6979646 |
Hardening of copper to improve copper CMP performance |
Dec. 27, 2005 |
| 6979642 |
Method of self-annealing conductive lines that separates grain size effects from alloy mobility |
Dec. 27, 2005 |
| 6979649 |
Fabrication method of semiconductor integrated circuit device |
Dec. 27, 2005 |
| 6972257 |
Conductive material patterning methods |
Dec. 6, 2005 |
| 6933234 |
Method for manufacturing semiconductor device and polishing apparatus |
Aug. 23, 2005 |
| 6919269 |
Production method for a semiconductor component |
Jul. 19, 2005 |
| 6911405 |
Semiconductor device and method of manufacturing the same |
Jun. 28, 2005 |
| 6909192 |
Hardening of copper to improve copper CMP performance |
Jun. 21, 2005 |
| 6872671 |
Insulators for high density circuits |
Mar. 29, 2005 |
| 6867080 |
Polysilicon tilting to prevent geometry effects during laser thermal annealing |
Mar. 15, 2005 |
| 6867431 |
Semiconductor device and method for manufacturing the same |
Mar. 15, 2005 |
| 6838764 |
Insulators for high density circuits |
Jan. 4, 2005 |
| 6830996 |
Device performance improvement by heavily doped pre-gate and post polysilicon gate clean |
Dec. 14, 2004 |
| 6831008 |
Nickel silicide--silicon nitride adhesion through surface passivation |
Dec. 14, 2004 |
| 6806183 |
Methods for forming capacitors on semiconductor substrates |
Oct. 19, 2004 |
| 6787480 |
Manufacturing method of semicondcutor device |
Sep. 7, 2004 |
| 6787462 |
Method of manufacturing semiconductor device having buried metal wiring |
Sep. 7, 2004 |
| 6774029 |
Method for forming a conductive film and a conductive pattern of a semiconductor device |
Aug. 10, 2004 |
| 6762123 |
Moisture corrosion inhibitor layer for Al-alloy metallization layers, particularly for electronic devices and corresponding manufacturing method |
Jul. 13, 2004 |
| 6723631 |
Fabrication method of semiconductor integrated circuit device |
Apr. 20, 2004 |
| 6713383 |
Semiconductor device manufacturing method |
Mar. 30, 2004 |
| 6692588 |
Method and apparatus for simultaneously cleaning and annealing a workpiece |
Feb. 17, 2004 |
| 6690044 |
Approach to avoid buckling BPSG by using an intermediate barrier layer |
Feb. 10, 2004 |
| 6682659 |
Method for forming corrosion inhibited conductor layer |
Jan. 27, 2004 |
| 6648987 |
Method for producing nanostructures in thin films |
Nov. 18, 2003 |
| 6645803 |
Method for modifying the doping level of a silicon layer |
Nov. 11, 2003 |
| 6620700 |
Silicided undoped polysilicon for capacitor bottom plate |
Sep. 16, 2003 |
| 6617624 |
Metal gate electrode stack with a passivating metal nitride layer |
Sep. 9, 2003 |
| 6602653 |
Conductive material patterning methods |
Aug. 5, 2003 |
| 6573607 |
Semiconductor device and manufacturing method thereof |
Jun. 3, 2003 |
| 6548387 |
Method for reducing hole defects in the polysilicon layer |
Apr. 15, 2003 |
| 6527884 |
Hydrogen annealing process and apparatus therefor |
Mar. 4, 2003 |
| 6525404 |
Moisture corrosion inhibitor layer for Al-alloy metallization layers, particularly for electronic devices and corresponding manufacturing method |
Feb. 25, 2003 |
| 6481616 |
Bump bonding device and bump bonding method |
Nov. 19, 2002 |
| 6479383 |
Method for selective removal of unreacted metal after silicidation |
Nov. 12, 2002 |
| 6423635 |
Method of filling a recess |
Jul. 23, 2002 |
| 6423147 |
Method of cleaning a wafer |
Jul. 23, 2002 |
| 6413866 |
Method of forming a solute-enriched layer in a substrate surface and article formed thereby |
Jul. 2, 2002 |
| 6398943 |
Process for producing a porous layer by an electrochemical etching process |
Jun. 4, 2002 |
| 6383905 |
Formation of micro rough poly surface for low sheet resistance salicided sub-quarter micron poly lines |
May. 7, 2002 |
| 6380609 |
Silicided undoped polysilicon for capacitor bottom plate |
Apr. 30, 2002 |
| 6380094 |
Method for preventing redeposition of etching products onto substrate surfaces during a tungsten re-etching process in the production of LSI circuits |
Apr. 30, 2002 |
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