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Class Information
Number: 257/E21.295
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Device having semiconductor body comprising group iv elements or group iii-v compounds with or without impurities, e.g., doping materials (epo) > Treatment of semiconductor body using process other than deposition of semiconductor material on a substrate, diffusion or alloying of impurity material, or radiation treatment (epo) > To change their surface-physical characteristics or shape, e.g., etching, polishing, cutting (epo) > Deposition/post-treatment of noninsulating, e.g., conductive - or resistive - layers on insulating layers (epo) > Deposition of layer comprising metal, e.g., metal, alloys, metal compounds (epo)
Description: This subclass is indented under subclass E21.294. This subclass is substantially the same in scope as ECLA classification H01L21/3205M.


Sub-classes under this class:

Class Number Class Name Patents
257/E21.296 Of metal-silicide layer (epo) 139


Patents under this class:
1 2 3 4 5 6 7 8

Patent Number Title Of Patent Date Issued
7582574 Diethylsilane as a silicon source in the deposition of metal silicate films Sep. 1, 2009
7534724 Method for manufacturing wiring, thin film transistor, light emitting device and liquid crystal display device, and droplet discharge apparatus for forming the same May. 19, 2009
7524766 Method for manufacturing semiconductor device and substrate processing apparatus Apr. 28, 2009
7521366 Manufacturing method of electro line for liquid crystal display device Apr. 21, 2009
7435678 Method of depositing noble metal electrode using oxidation-reduction reaction Oct. 14, 2008
7432184 Integrated PVD system using designated PVD chambers Oct. 7, 2008
7416980 Forming a barrier layer in interconnect joints and structures formed thereby Aug. 26, 2008
7410900 Metallisation Aug. 12, 2008
7384800 Method of fabricating metal-insulator-metal (MIM) device with stable data retention Jun. 10, 2008
7332432 Method for manufacturing wiring, thin film transistor, light emitting device and liquid crystal display device, and droplet discharge apparatus for forming the same Feb. 19, 2008
7314768 Formation method of electroconductive pattern, and production method of electron-emitting device, electron source, and image display apparatus using this Jan. 1, 2008
7306962 Electroformed metallization Dec. 11, 2007
7279417 Use of metallocenes to inhibit copper oxidation during semiconductor processing Oct. 9, 2007
7271111 Shadow mask deposition of materials using reconfigurable shadow masks Sep. 18, 2007
7265048 Reduction of copper dewetting by transition metal deposition Sep. 4, 2007
7262125 Method of forming low-resistivity tungsten interconnects Aug. 28, 2007
7186645 Selective plating of package terminals Mar. 6, 2007
7087520 Method for fabricating metal wiring Aug. 8, 2006
7078349 Method to form self-aligned floating gate to diffusion structures in flash Jul. 18, 2006
7067920 Semiconductor device and method of fabricating the same Jun. 27, 2006
7062850 Method of forming electrical interconnects having electromigration-inhibiting segments to a critical length Jun. 20, 2006
7064437 Semiconductor device having aluminum conductors Jun. 20, 2006
7057874 Ferroelectric capacitor Jun. 6, 2006
7034397 Oxygen bridge structures and methods to form oxygen bridge structures Apr. 25, 2006
7029946 Method for manufacturing semiconductor device and semiconductor device Apr. 18, 2006
7018878 Metal structures for integrated circuits and methods for making the same Mar. 28, 2006
7011762 Metal bridging monitor for etch and CMP endpoint detection Mar. 14, 2006
6992346 Integrated circuit devices with metal-insulator-metal capacitors Jan. 31, 2006
6989604 Conformal barrier liner in an integrated circuit interconnect Jan. 24, 2006
6960306 Low Cu percentages for reducing shorts in AlCu lines Nov. 1, 2005
6957624 Apparatus and a method for forming an alloy layer over a substrate Oct. 25, 2005
6953041 Compositions of transition metal species in dense phase carbon dioxide and methods of use thereof Oct. 11, 2005
6951814 Methods for forming a metal wiring layer on an integrated circuit device at reduced temperatures Oct. 4, 2005
6949444 High-frequency line Sep. 27, 2005
6908857 Method of manufacturing semiconductor device Jun. 21, 2005
6908848 Method for forming an electrical interconnection providing improved surface morphology of tungsten Jun. 21, 2005
6904675 Method of forming electrical interconnects having electromigration-inhibiting plugs Jun. 14, 2005
6903017 Integrated circuit metallization using a titanium/aluminum alloy Jun. 7, 2005
6900129 CVD of tantalum and tantalum nitride films from tantalum halide precursors May. 31, 2005
6893980 Semiconductor device and manufacturing method therefor May. 17, 2005
6893905 Method of forming substantially hillock-free aluminum-containing components May. 17, 2005
6873517 Ferroelectric capacitor Mar. 29, 2005
6872580 Method for patching up thin-film transistor circuits on a display panel by local thin-film deposition Mar. 29, 2005
6861355 Metal plating using seed film Mar. 1, 2005
6856021 Semiconductor device having aluminum alloy conductors Feb. 15, 2005
6855996 Electronic device substrate structure and electronic device Feb. 15, 2005
6856018 Semiconductor device and method of manufacture thereof Feb. 15, 2005
6852628 Method of insulating interconnects, and memory cell array with insulated interconnects Feb. 8, 2005
6852579 Method of manufacturing a semiconductor integrated circuit device Feb. 8, 2005
6841878 Integrated circuit with improved RC delay Jan. 11, 2005

1 2 3 4 5 6 7 8


 
 
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