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Class Information
Number: 257/E21.295
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Device having semiconductor body comprising group iv elements or group iii-v compounds with or without impurities, e.g., doping materials (epo) > Treatment of semiconductor body using process other than deposition of semiconductor material on a substrate, diffusion or alloying of impurity material, or radiation treatment (epo) > To change their surface-physical characteristics or shape, e.g., etching, polishing, cutting (epo) > Deposition/post-treatment of noninsulating, e.g., conductive - or resistive - layers on insulating layers (epo) > Deposition of layer comprising metal, e.g., metal, alloys, metal compounds (epo)
Description: This subclass is indented under subclass E21.294. This subclass is substantially the same in scope as ECLA classification H01L21/3205M.

Sub-classes under this class:

Class Number Class Name Patents
257/E21.296 Of metal-silicide layer (epo) 166

Patents under this class:
1 2 3 4 5 6 7 8 9 10

Patent Number Title Of Patent Date Issued
8685866 Method of manufacturing semiconductor device and substrate processing apparatus Apr. 1, 2014
8685849 Semiconductor device with buffer layer Apr. 1, 2014
8647918 Formation of graphene on a surface Feb. 11, 2014
8637396 Dielectric barrier deposition using oxygen containing precursor Jan. 28, 2014
8637925 Nickel-silicide formation with differential Pt composition Jan. 28, 2014
8623733 Methods for depositing ultra thin low resistivity tungsten film for small critical dimension contacts and interconnects Jan. 7, 2014
8623764 Composition and methods for forming metal films on semiconductor substrates using supercritical solvents Jan. 7, 2014
8592312 Method for depositing a conductive capping layer on metal lines Nov. 26, 2013
8580672 Methods of forming bump structures that include a protection layer Nov. 12, 2013
8580671 Method of manufacturing semiconductor device and substrate processing apparatus Nov. 12, 2013
8546945 Pillar structure having a non-planar surface for semiconductor devices Oct. 1, 2013
8541276 Methods of forming an insulating metal oxide Sep. 24, 2013
8541307 Treatment method for reducing particles in dual damascene silicon nitride process Sep. 24, 2013
8501531 Method of forming graphene on a surface Aug. 6, 2013
8497142 Methods of forming conductive layer patterns using gas phase cleaning process and methods of manufacturing semiconductor devices Jul. 30, 2013
8399313 Method of manufacturing semiconductor device having first conductive layer including aluminum Mar. 19, 2013
8389393 Nanoparticle synthesis Mar. 5, 2013
8354337 Metal oxide film formation method and apparatus Jan. 15, 2013
8349738 Metal precursors for deposition of metal-containing films Jan. 8, 2013
8334208 Film-forming method and film-forming apparatus Dec. 18, 2012
8329569 Deposition of ruthenium or ruthenium dioxide Dec. 11, 2012
8328585 Modulated deposition process for stress control in thick TiN films Dec. 11, 2012
8318581 Micro-electromechanical system devices Nov. 27, 2012
8318596 Pillar structure having a non-planar surface for semiconductor devices Nov. 27, 2012
8274151 Object including a graphic element transferred on a support and method for making such an object Sep. 25, 2012
8242017 Method and structure for copper gap fill plating of interconnect structures for semiconductor integrated circuits Aug. 14, 2012
8232154 Method for fabricating semiconductor device Jul. 31, 2012
8193083 Method of manufacturing semiconductor device and substrate processing apparatus Jun. 5, 2012
8125085 Semiconductor device having wiring with oxide layer of impurity from the wiring Feb. 28, 2012
8114741 Oxygen-rich layers underlying BPSG Feb. 14, 2012
8105867 Self-aligned three-dimensional non-volatile memory fabrication Jan. 31, 2012
8105945 Method for manufacturing wiring, thin film transistor, light emitting device and liquid crystal display device, and droplet discharge apparatus for forming the same Jan. 31, 2012
8101507 Semiconductor device manufacturing method and semiconductor device manufacturing apparatus Jan. 24, 2012
8084370 Hafnium tantalum oxynitride dielectric Dec. 27, 2011
8076240 Techniques to improve characteristics of processed semiconductor substrates Dec. 13, 2011
8076243 Metal precursors for deposition of metal-containing films Dec. 13, 2011
8076777 Glass compositions used in conductors for photovoltaic cells Dec. 13, 2011
8053265 Mitigation of high stress areas in vertically offset structures Nov. 8, 2011
8043944 Process for enhancing solubility and reaction rates in supercritical fluids Oct. 25, 2011
8039958 Semiconductor device including a reduced stress configuration for metal pillars Oct. 18, 2011
8030695 Structure and manufacturing method of semiconductor memory device Oct. 4, 2011
8030725 Apparatus and methods for detecting evaporation conditions Oct. 4, 2011
8021982 Method of silicide formation by adding graded amount of impurity during metal deposition Sep. 20, 2011
8022448 Apparatus and methods for evaporation including test wafer holder Sep. 20, 2011
8012866 Method of bonding semiconductor devices utilizing solder balls Sep. 6, 2011
8003449 Method of manufacturing a semiconductor device having a reverse staggered thin film transistor Aug. 23, 2011
7972959 Self aligned double patterning flow with non-sacrificial features Jul. 5, 2011
7927993 Cross-contamination control for semiconductor process flows having metal comprising gate electrodes Apr. 19, 2011
7928009 Method for making semiconductor electrodes Apr. 19, 2011
7919411 Method for manufacturing wiring, thin film transistor, light emitting device and liquid crystal display device, and droplet discharge apparatus for forming the same Apr. 5, 2011

1 2 3 4 5 6 7 8 9 10

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