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Class Information
Number: 257/E21.276
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Device having semiconductor body comprising group iv elements or group iii-v compounds with or without impurities, e.g., doping materials (epo) > Treatment of semiconductor body using process other than deposition of semiconductor material on a substrate, diffusion or alloying of impurity material, or radiation treatment (epo) > To change their surface-physical characteristics or shape, e.g., etching, polishing, cutting (epo) > To form insulating layer thereon, e.g., for masking or by using photolithographic technique (epo) > Inorganic layer (epo) > Composed of oxide or glassy oxide or oxide based glass (epo) > Deposition from gas or vapor (epo) > Deposition of halogen doped silicon oxide, e.g., fluorine doped silicon oxide (epo)
Description: This subclass is indented under subclass E21.274. This subclass is substantially the same in scope as ECLA classification H01L21/316B6.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7390757 |
Methods for improving low k FSG film gap-fill characteristics |
Jun. 24, 2008 |
| 7247939 |
Metal filled semiconductor features with improved structural stability |
Jul. 24, 2007 |
| 7226875 |
Method for enhancing FSG film stability |
Jun. 5, 2007 |
| 7199041 |
Methods for fabricating an interlayer dielectric layer of a semiconductor device |
Apr. 3, 2007 |
| 7060323 |
Method of forming interlayer insulating film |
Jun. 13, 2006 |
| 7060193 |
Method to form both high and low-k materials over the same dielectric region, and their application in mixed mode circuits |
Jun. 13, 2006 |
| 7052552 |
Gas chemistry cycling to achieve high aspect ratio gapfill with HDP-CVD |
May. 30, 2006 |
| 7037855 |
Method of forming fluorine-doped low-dielectric-constant insulating film |
May. 2, 2006 |
| 7026257 |
Method of manufacturing low dielectric film by a vacuum ultraviolet chemical vapor deposition |
Apr. 11, 2006 |
| 7015168 |
Low dielectric constant fluorine and carbon-containing silicon oxide dielectric material characterized by improved resistance to oxidation |
Mar. 21, 2006 |
| 7001854 |
Hydrogen-based phosphosilicate glass process for gap fill of high aspect ratio structures |
Feb. 21, 2006 |
| 6998340 |
Method of manufacturing semiconductor device |
Feb. 14, 2006 |
| 6984436 |
Graded material and method for synthesis thereof and method for processing thereof |
Jan. 10, 2006 |
| 6964919 |
Low-k dielectric film with good mechanical strength |
Nov. 15, 2005 |
| 6962883 |
Integrated circuit insulator and method |
Nov. 8, 2005 |
| 6960812 |
Method of forming an oxide film |
Nov. 1, 2005 |
| 6953608 |
Solution for FSG induced metal corrosion & metal peeling defects with extra bias liner and smooth RF bias ramp up |
Oct. 11, 2005 |
| 6924238 |
Edge peeling improvement of low-k dielectric materials stack by adjusting EBR resistance |
Aug. 2, 2005 |
| 6914016 |
HDP-CVD deposition process for filling high aspect ratio gaps |
Jul. 5, 2005 |
| 6914015 |
HDP process for high aspect ratio gap filling |
Jul. 5, 2005 |
| 6911397 |
Method of forming dual damascene interconnection using low-k dielectric |
Jun. 28, 2005 |
| 6909195 |
Trench etch process for low-k dielectrics |
Jun. 21, 2005 |
| 6905968 |
Process for selectively etching dielectric layers |
Jun. 14, 2005 |
| 6905787 |
Light emitting element |
Jun. 14, 2005 |
| 6905938 |
Method of forming interconnect structure with low dielectric constant |
Jun. 14, 2005 |
| 6903029 |
Method of reducing thick film stress of spin-on dielectric and the resulting sandwich dielectric structure |
Jun. 7, 2005 |
| 6888189 |
Dielectric element including oxide-based dielectric film and method of fabricating the same |
May. 3, 2005 |
| 6875699 |
Method for patterning multilevel interconnects |
Apr. 5, 2005 |
| 6856018 |
Semiconductor device and method of manufacture thereof |
Feb. 15, 2005 |
| 6853003 |
Semiconductor devices with capacitors of metal/insulator/metal structure and methods for forming the same |
Feb. 8, 2005 |
| 6849536 |
Inter-metal dielectric patterns and method of forming the same |
Feb. 1, 2005 |
| 6846745 |
High-density plasma process for filling high aspect ratio structures |
Jan. 25, 2005 |
| 6838124 |
Deposition of fluorosilsesquioxane films |
Jan. 4, 2005 |
| 6838300 |
Chemical treatment of low-k dielectric films |
Jan. 4, 2005 |
| 6828255 |
Crack inhibited composite dielectric layer |
Dec. 7, 2004 |
| 6818990 |
Fluorine diffusion barriers for fluorinated dielectrics in integrated circuits |
Nov. 16, 2004 |
| 6812156 |
Method to reduce residual particulate contamination in CVD and PVD semiconductor wafer manufacturing |
Nov. 2, 2004 |
| 6803325 |
Apparatus for improving barrier layer adhesion to HDP-FSG thin films |
Oct. 12, 2004 |
| 6800940 |
Low k dielectric composite layer for integrated circuit structure which provides void-free low k dielectric material between metal lines while mitigating via poisoning |
Oct. 5, 2004 |
| 6797646 |
Method of nitrogen doping of fluorinated silicate glass (FSG) while removing the photoresist layer |
Sep. 28, 2004 |
| 6794700 |
Capacitor having a dielectric layer including a group 17 element |
Sep. 21, 2004 |
| 6794295 |
Method to improve stability and reliability of CVD low K dielectric |
Sep. 21, 2004 |
| 6794293 |
Trench etch process for low-k dielectrics |
Sep. 21, 2004 |
| 6787483 |
Gap fill for high aspect ratio structures |
Sep. 7, 2004 |
| 6787477 |
Methods of forming dielectric layers and methods of forming capacitors |
Sep. 7, 2004 |
| 6780793 |
Production method of semiconductor device |
Aug. 24, 2004 |
| 6774461 |
Method of reducing thick film stress of spin-on dielectric and the resulting sandwich dielectric structure |
Aug. 10, 2004 |
| 6767829 |
Plasma deposition method and system |
Jul. 27, 2004 |
| 6762500 |
Barrier-metal-free copper damascene technology using atomic hydrogen enhanced reflow |
Jul. 13, 2004 |
| 6759321 |
Stabilization of fluorine-containing low-k dielectrics in a metal/insulator wiring structure by ultraviolet irradiation |
Jul. 6, 2004 |
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