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Class Information
Number: 257/E21.261
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Device having semiconductor body comprising group iv elements or group iii-v compounds with or without impurities, e.g., doping materials (epo) > Treatment of semiconductor body using process other than deposition of semiconductor material on a substrate, diffusion or alloying of impurity material, or radiation treatment (epo) > To change their surface-physical characteristics or shape, e.g., etching, polishing, cutting (epo) > To form insulating layer thereon, e.g., for masking or by using photolithographic technique (epo) > Organic layers, e.g., photoresist (epo) > Layer comprising organo-silicon compound (epo) > Layer comprising polysiloxane compound (epo)
Description: This subclass is indented under subclass E21.26. This subclass is substantially the same in scope as ECLA classification H01L21/312B2.










Sub-classes under this class:

Class Number Class Name Patents
257/E21.262 Layer comprising hydrogen silsesquioxane (epo) 133
257/E21.263 Layer comprising silazane compounds (epo) 58


Patents under this class:
1 2 3 4 5 6 7

Patent Number Title Of Patent Date Issued
8530360 Method for low stress flip-chip assembly of fine-pitch semiconductor devices Sep. 10, 2013
8445377 Mechanically robust metal/low-k interconnects May. 21, 2013
8319228 Resin composition for optical semiconductor device, optical-semiconductor-device lead frame obtained using the same, and optical semiconductor device Nov. 27, 2012
8237296 Selective UV-Ozone dry etching of anti-stiction coatings for MEMS device fabrication Aug. 7, 2012
8212345 Holding jig, semiconductor wafer grinding method, semiconductor wafer protecting structure and semiconductor wafer grinding method and semiconductor chip fabrication method using the structure Jul. 3, 2012
8101958 Semiconductor light-emitting device Jan. 24, 2012
8035236 Semiconductor device comprising high performance encapsulation resins Oct. 11, 2011
8017522 Mechanically robust metal/low-.kappa. interconnects Sep. 13, 2011
7898083 Method for low stress flip-chip assembly of fine-pitch semiconductor devices Mar. 1, 2011
7883986 Methods of forming trench isolation and methods of forming arrays of FLASH memory cells Feb. 8, 2011
7875501 Holding jig, semiconductor wafer grinding method, semiconductor wafer protecting structure and semiconductor wafer grinding method and semiconductor chip fabrication method using the structure Jan. 25, 2011
7691736 Minimizing low-k dielectric damage during plasma processing Apr. 6, 2010
7687913 Recovery of hydrophobicity of low-k and ultra low-k organosilicate films used as inter metal dielectrics Mar. 30, 2010
7682977 Methods of forming trench isolation and methods of forming arrays of FLASH memory cells Mar. 23, 2010
7582970 Carbon containing silicon oxide film having high ashing tolerance and adhesion Sep. 1, 2009
7534717 Method of manufacturing semiconductor device May. 19, 2009
7517815 Spin-on glass composition, method of preparing the spin-on glass composition and method of forming a porous silicon oxide layer using the spin-on glass composition Apr. 14, 2009
7501353 Method of formation of a damascene structure utilizing a protective film Mar. 10, 2009
7482676 Compositions for preparing low dielectric materials Jan. 27, 2009
7479462 Thin films and methods for the preparation thereof Jan. 20, 2009
7468317 Method of forming metal line of semiconductor device Dec. 23, 2008
7465682 Method and apparatus for processing organosiloxane film Dec. 16, 2008
7445953 Low temperature curable materials for optical applications Nov. 4, 2008
7429789 Fluoropolymer dielectric composition for use in circuitized substrates and circuitized substrate including same Sep. 30, 2008
7420279 Carbon containing silicon oxide film having high ashing tolerance and adhesion Sep. 2, 2008
7410914 Process for producing low-k dielectric films Aug. 12, 2008
7405153 Method for direct electroplating of copper onto a non-copper plateable layer Jul. 29, 2008
7399715 Organic silica-based film, method of forming the same, composition for forming insulating film for semiconductor device, interconnect structure, and semiconductor device Jul. 15, 2008
7396749 Method for contacting parts of a component integrated into a semiconductor substrate Jul. 8, 2008
7364942 Process for wafer level treatment to reduce stiction and passivate micromachined surfaces and compounds used therefor Apr. 29, 2008
7345351 Coating composition for insulating film production, preparation method of insulation film by using the same, insulation film for semi-conductor device prepared therefrom, and semi-conductor de Mar. 18, 2008
7294585 Compositions for preparing low dielectric materials Nov. 13, 2007
7279728 Variable capacitance device with high accuracy Oct. 9, 2007
7238626 Chemically and electrically stabilized polymer films Jul. 3, 2007
7220614 Process for wafer level treatment to reduce stiction and passivate micromachined surfaces and compounds used therefor May. 22, 2007
7135398 Reliable low-k interconnect structure with hybrid dielectric Nov. 14, 2006
7122880 Compositions for preparing low dielectric materials Oct. 17, 2006
7074489 Low dielectric constant material and method of processing by CVD Jul. 11, 2006
7067437 Structures with improved interfacial strength of SiCOH dielectrics and method for preparing the same Jun. 27, 2006
7064088 Method for forming low-k hard film Jun. 20, 2006
7060635 Method of manufacturing semiconductor device and method of forming pattern Jun. 13, 2006
7060361 Silica-based organic film and method of manufacturing the same, and base material comprising organic film Jun. 13, 2006
7060323 Method of forming interlayer insulating film Jun. 13, 2006
7060637 Methods of forming intermediate semiconductor device structures using spin-on, photopatternable, interlayer dielectric materials Jun. 13, 2006
7061081 Resin composition, heat-resistant resin paste and semiconductor device using them and method for manufacture thereof Jun. 13, 2006
7057002 Siloxane-based resin containing germanium and an interlayer insulating film for a semiconductor device using the same Jun. 6, 2006
7056839 Method of forming a silica insulation film with a reduced dielectric constant Jun. 6, 2006
7056840 Direct photo-patterning of nanoporous organosilicates, and method of use Jun. 6, 2006
7056560 Ultra low dielectric materials based on hybrid system of linear silicon precursor and organic porogen by plasma-enhanced chemical vapor deposition (PECVD) Jun. 6, 2006
7049247 Method for fabricating an ultralow dielectric constant material as an intralevel or interlevel dielectric in a semiconductor device and electronic device made May. 23, 2006

1 2 3 4 5 6 7










 
 
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