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Class Information
Number: 257/E21.254
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Device having semiconductor body comprising group iv elements or group iii-v compounds with or without impurities, e.g., doping materials (epo) > Treatment of semiconductor body using process other than deposition of semiconductor material on a substrate, diffusion or alloying of impurity material, or radiation treatment (epo) > To change their surface-physical characteristics or shape, e.g., etching, polishing, cutting (epo) > To form insulating layer thereon, e.g., for masking or by using photolithographic technique (epo) > Post-treatment (epo) > Etching insulating layer by chemical or physical means (epo) > Etching organic layer (epo)
Description: This subclass is indented under subclass E21.249. This subclass is substantially the same in scope as ECLA classification H01L21/311C.










Sub-classes under this class:

Class Number Class Name Patents
257/E21.255 By chemical means (epo) 253


Patents under this class:

Patent Number Title Of Patent Date Issued
8592246 Methods of manufacturing a solar cell module Nov. 26, 2013
8558234 Low voltage low light imager and photodetector Oct. 15, 2013
8541257 Aligned polymers for an organic TFT Sep. 24, 2013
8513142 Method of manufacturing non-photosensitive polyimide passivation layer Aug. 20, 2013
8486830 Via forming method and method of manufacturing multi-chip package using the same Jul. 16, 2013
8354296 Semiconductor structure and circuit including ordered arrangement of graphene nanoribbons, and methods of forming same Jan. 15, 2013
8211804 Methods of forming a hole having a vertical profile and semiconductor devices having a vertical hole Jul. 3, 2012
8143168 Etching method and manufacturing method of semiconductor device Mar. 27, 2012
8129287 Method for manufacturing semiconductor device and semiconductor device Mar. 6, 2012
7985699 Substrate processing method and storage medium Jul. 26, 2011
7883919 Negative thermal expansion system (NTEs) device for TCE compensation in elastomer compsites and conductive elastomer interconnects in microelectronic packaging Feb. 8, 2011
7749915 Protection of polymer surfaces during micro-fabrication Jul. 6, 2010
7556979 Negative thermal expansion system (NTEs) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging Jul. 7, 2009
7008803 Method of reworking structures incorporating low-k dielectric materials Mar. 7, 2006
6861332 Air gap interconnect method Mar. 1, 2005
6846756 Method for preventing low-k dielectric layer cracking in multi-layered dual damascene metallization layers Jan. 25, 2005
6251542 Semiconductor wafer etching method Jun. 26, 2001
6242361 Plasma treatment to improve DUV photoresist process Jun. 5, 2001
6133131 Method of forming a gate spacer on a semiconductor wafer Oct. 17, 2000
6092537 Post-treatment method for dry etching Jul. 25, 2000
6040110 Process and apparatus for the removal of resist Mar. 21, 2000
6009888 Photoresist and polymer removal by UV laser aqueous oxidant Jan. 4, 2000
5895272 Ion-implanted resist removal method Apr. 20, 1999
5874365 Semiconductor wafer etching method Feb. 23, 1999
5817182 Hydrofluoric etch quenching via a colder rinse process Oct. 6, 1998
5651860 Ion-implanted resist removal method Jul. 29, 1997
5270231 Method of manufacturing device having ferroelectric film Dec. 14, 1993
5169678 Laser ablatable polymer dielectrics and methods Dec. 8, 1992
5114834 Photoresist removal May. 19, 1992
4894115 Laser beam scanning method for forming via holes in polymer materials Jan. 16, 1990
4857382 Apparatus and method for photoetching of polyimides, polycarbonates and polyetherimides Aug. 15, 1989
4764485 Method for producing via holes in polymer dielectrics Aug. 16, 1988
4684437 Selective metal etching in metal/polymer structures Aug. 4, 1987
4617085 Process for removing organic material in a patterned manner from an organic film Oct. 14, 1986
4414059 Far UV patterning of resist materials Nov. 8, 1983











 
 
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