 |
|
 |
| |
 |
|
Class Information
Number: 257/E21.251
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Device having semiconductor body comprising group iv elements or group iii-v compounds with or without impurities, e.g., doping materials (epo) > Treatment of semiconductor body using process other than deposition of semiconductor material on a substrate, diffusion or alloying of impurity material, or radiation treatment (epo) > To change their surface-physical characteristics or shape, e.g., etching, polishing, cutting (epo) > To form insulating layer thereon, e.g., for masking or by using photolithographic technique (epo) > Post-treatment (epo) > Etching insulating layer by chemical or physical means (epo) > Etching inorganic layer (epo) > By chemical means (epo)
Description: This subclass is indented under subclass E21.25. This subclass is substantially the same in scope as ECLA classification H01L21/311B2.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7622390 |
Method for treating a dielectric film to reduce damage |
Nov. 24, 2009 |
| 7598168 |
Method of fabricating dual damascene interconnection and etchant for stripping sacrificial layer |
Oct. 6, 2009 |
| 7456086 |
Semiconductor having structure with openings |
Nov. 25, 2008 |
| 7427545 |
Trench memory cells with buried isolation collars, and methods of fabricating same |
Sep. 23, 2008 |
| 7378355 |
System and methods for polishing a wafer |
May. 27, 2008 |
| 7361610 |
Method of etching a glass substrate |
Apr. 22, 2008 |
| 7358196 |
Wet chemical treatment to form a thin oxide for high k gate dielectrics |
Apr. 15, 2008 |
| 7338910 |
Method of fabricating semiconductor devices and method of removing a spacer |
Mar. 4, 2008 |
| 7309658 |
Molecular self-assembly in substrate processing |
Dec. 18, 2007 |
| 7151058 |
Etchant for etching nitride and method for removing a nitride layer using the same |
Dec. 19, 2006 |
| 7132683 |
Dual purpose test structure for gate-body current measurement in PD/SOI and for direct extraction of physical gate length in scaled CMOS technologies |
Nov. 7, 2006 |
| 7071107 |
Method for manufacturing a semiconductor device |
Jul. 4, 2006 |
| 7067434 |
Hydrogen free integration of high-k gate dielectrics |
Jun. 27, 2006 |
| 7060638 |
Method of forming low dielectric constant porous films |
Jun. 13, 2006 |
| 7056836 |
Manufacturing method for a semiconductor device |
Jun. 6, 2006 |
| 7052627 |
Etching solution, etched article and method for etched article |
May. 30, 2006 |
| 7049242 |
Post high voltage gate dielectric pattern plasma surface treatment |
May. 23, 2006 |
| 7037822 |
Method of forming metal line in semiconductor device |
May. 2, 2006 |
| 7037845 |
Selective etch process for making a semiconductor device having a high-k gate dielectric |
May. 2, 2006 |
| 7030034 |
Methods of etching silicon nitride substantially selectively relative to an oxide of aluminum |
Apr. 18, 2006 |
| 7030024 |
Dual-gate structure and method of fabricating integrated circuits having dual-gate structures |
Apr. 18, 2006 |
| 7026253 |
Method for fabricating semiconductor device using ArF photolithography capable of protecting tapered profile of hard mask |
Apr. 11, 2006 |
| 7021320 |
Method of removing a via fence |
Apr. 4, 2006 |
| 7018927 |
Method for forming isolation film for semiconductor devices |
Mar. 28, 2006 |
| 7018925 |
Post high voltage gate oxide pattern high-vacuum outgas surface treatment |
Mar. 28, 2006 |
| 7008803 |
Method of reworking structures incorporating low-k dielectric materials |
Mar. 7, 2006 |
| 7001838 |
Method of wet etching an inorganic antireflection layer |
Feb. 21, 2006 |
| 6996479 |
Method and apparatus for measuring and controlling the water content of a water-containing liquid mixture |
Feb. 7, 2006 |
| 6992014 |
Method and apparatus for etch rate uniformity control |
Jan. 31, 2006 |
| 6987064 |
Method and composition to improve a nitride/oxide wet etching selectivity |
Jan. 17, 2006 |
| 6987062 |
Manufacturing method of semiconductor device |
Jan. 17, 2006 |
| 6987321 |
Copper diffusion deterrent interface |
Jan. 17, 2006 |
| 6977418 |
Low resistance semiconductor process and structures |
Dec. 20, 2005 |
| 6974756 |
Methods of forming shallow trench isolation |
Dec. 13, 2005 |
| 6972262 |
Method for fabricating semiconductor device with improved tolerance to wet cleaning process |
Dec. 6, 2005 |
| 6964929 |
Method of forming a narrow gate, and product produced thereby |
Nov. 15, 2005 |
| 6941956 |
Substrate treating method and apparatus |
Sep. 13, 2005 |
| 6921727 |
Method for modifying dielectric characteristics of dielectric layers |
Jul. 26, 2005 |
| 6921721 |
Post plasma clean process for a hardmask |
Jul. 26, 2005 |
| 6900104 |
Method of forming offset spacer manufacturing for critical dimension precision |
May. 31, 2005 |
| 6897108 |
Process for planarizing array top oxide in vertical MOSFET DRAM arrays |
May. 24, 2005 |
| 6890452 |
Fluorinated surfactants for aqueous acid etch solutions |
May. 10, 2005 |
| 6890865 |
Low k film application for interlevel dielectric and method of cleaning etched features |
May. 10, 2005 |
| 6891245 |
Integrated circuit formed by removing undesirable second oxide while minimally affecting a desirable first oxide |
May. 10, 2005 |
| 6887796 |
Method of wet etching a silicon and nitrogen containing material |
May. 3, 2005 |
| 6872621 |
Method for removal of hemispherical grained silicon in a deep trench |
Mar. 29, 2005 |
| 6864148 |
Corner protection to reduce wrap around |
Mar. 8, 2005 |
| 6864180 |
Method for reworking low-k polymers used in semiconductor structures |
Mar. 8, 2005 |
| 6861359 |
Process for semiconductor apparatus including forming an insulator and a semiconductor film on the backside of the wafer and removing the semiconductor film from the backside |
Mar. 1, 2005 |
| 6858091 |
Method for controlling galvanic corrosion effects on a single-wafer cleaning system |
Feb. 22, 2005 |
|
|
|
 |
|
 |
|
| |
Randomly Featured Patents |
|
