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Class Information
Number: 257/E21.25
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Device having semiconductor body comprising group iv elements or group iii-v compounds with or without impurities, e.g., doping materials (epo) > Treatment of semiconductor body using process other than deposition of semiconductor material on a substrate, diffusion or alloying of impurity material, or radiation treatment (epo) > To change their surface-physical characteristics or shape, e.g., etching, polishing, cutting (epo) > To form insulating layer thereon, e.g., for masking or by using photolithographic technique (epo) > Post-treatment (epo) > Etching insulating layer by chemical or physical means (epo) > Etching inorganic layer (epo)
Description: This subclass is indented under subclass E21.249. This subclass is substantially the same in scope as ECLA classification H01L21/311B.

Sub-classes under this class:

Class Number Class Name Patents
257/E21.251 By chemical means (epo) 554

Patents under this class:
1 2

Patent Number Title Of Patent Date Issued
8669190 Method for manufacturing semiconductor device and semiconductor wafer Mar. 11, 2014
8647989 Method of forming opening on semiconductor substrate Feb. 11, 2014
8569080 Method for packaging light emitting diode Oct. 29, 2013
8513135 Methods of modifying oxide spacers Aug. 20, 2013
8501605 Methods and apparatus for conformal doping Aug. 6, 2013
8460996 Semiconductor devices with different dielectric thicknesses Jun. 11, 2013
8389412 Finishing method for a silicon on insulator substrate Mar. 5, 2013
8383437 Echtant and method for manufacturing display device using the same Feb. 26, 2013
8236694 Method for manufacturing micromechanical components Aug. 7, 2012
7902001 Method of fabricating thin film device Mar. 8, 2011
7851372 Composition for removing an insulation material, method of removing an insulation layer and method of recycling a substrate using the same Dec. 14, 2010
7718540 Pitch reduced patterns relative to photolithography features May. 18, 2010
7659206 Removal of silicon oxycarbide from substrates Feb. 9, 2010
7651950 Method for forming a pattern of a semiconductor device Jan. 26, 2010
7537708 Procedure for etching of materials at the surface with focussed electron beam induced chemical reactions at said surface May. 26, 2009
7521275 Free-standing electrostatically-doped carbon nanotube device and method for making same Apr. 21, 2009
7354863 Methods of selectively removing silicon Apr. 8, 2008
7260444 Real-time management systems and methods for manufacturing management and yield rate analysis integration Aug. 21, 2007
7253118 Pitch reduced patterns relative to photolithography features Aug. 7, 2007
7229928 Method for processing a layered stack in the production of a semiconductor device Jun. 12, 2007
7199012 Method of forming a trench in a semiconductor device Apr. 3, 2007
7037848 Methods of etching insulative materials, of forming electrical devices, and of forming capacitors May. 2, 2006
7018925 Post high voltage gate oxide pattern high-vacuum outgas surface treatment Mar. 28, 2006
7015089 Method to improve etching of resist protective oxide (RPO) to prevent photo-resist peeling Mar. 21, 2006
6884736 Method of forming contact plug on silicide structure Apr. 26, 2005
6878639 Borderless interconnection process Apr. 12, 2005
6855622 Method and apparatus for forming a cavity in a semiconductor substrate using a charged particle beam Feb. 15, 2005
6852639 Etching processing method for a material layer Feb. 8, 2005
6846756 Method for preventing low-k dielectric layer cracking in multi-layered dual damascene metallization layers Jan. 25, 2005
6815326 Method of manufacturing semiconductor electrode and semiconductor device provided with electrodes manufactured by the method Nov. 9, 2004
6762125 Modified facet etch to prevent blown gate oxide and increase etch chamber life Jul. 13, 2004
6753262 Methods of etching insulative materials, of forming electrical devices, and of forming capacitors Jun. 22, 2004
6707114 Semiconductor wafer arrangement of a semiconductor wafer Mar. 16, 2004
6620735 Method for processing substrates Sep. 16, 2003
6596088 Method for removing the circumferential edge of a dielectric layer Jul. 22, 2003
6579803 Removal of copper oxides from integrated interconnects Jun. 17, 2003
6576548 Method of manufacturing a semiconductor device with reliable contacts/vias Jun. 10, 2003
6528429 Methods of etching insulative materials, of forming electrical devices, and of forming capacitors Mar. 4, 2003
6521520 Semiconductor wafer arrangement and method of processing a semiconductor wafer Feb. 18, 2003
6383410 Selective silicon oxide etchant formulation including fluoride salt, chelating agent, and glycol solvent May. 7, 2002
6358857 Methods of etching insulative materials, of forming electrical devices, and of forming capacitors Mar. 19, 2002
6348125 Removal of copper oxides from integrated interconnects Feb. 19, 2002
6303499 Process for preparing semiconductor device Oct. 16, 2001
6281140 Method of reducing the roughness of a gate insulator layer after exposure of the gate insulator layer to a threshold voltage implantation procedure Aug. 28, 2001
6280651 Selective silicon oxide etchant formulation including fluoride salt, chelating agent, and glycol solvent Aug. 28, 2001
6254719 Method for controlled removal of material from a solid surface Jul. 3, 2001
6255718 Laser ablateable material Jul. 3, 2001
6242361 Plasma treatment to improve DUV photoresist process Jun. 5, 2001
6068964 Method for patterning an insulator film and installing a grounding pin through electron beam irradiation May. 30, 2000
6069079 Exposure of desired node in a multi-layer integrated circuit using FIB and RIE May. 30, 2000

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