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Class Information
Number: 257/E21.244
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Device having semiconductor body comprising group iv elements or group iii-v compounds with or without impurities, e.g., doping materials (epo) > Treatment of semiconductor body using process other than deposition of semiconductor material on a substrate, diffusion or alloying of impurity material, or radiation treatment (epo) > To change their surface-physical characteristics or shape, e.g., etching, polishing, cutting (epo) > To form insulating layer thereon, e.g., for masking or by using photolithographic technique (epo) > Post-treatment (epo) > Planarization of insulating layer (epo) > Involving dielectric removal step (epo)
Description: This subclass is indented under subclass E21.243. This subclass is substantially the same in scope as ECLA classification H01L21/3105B2.

Sub-classes under this class:

Class Number Class Name Patents
257/E21.245 Removal by chemical etching, e.g., dry etching (epo) 304

Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19

Patent Number Title Of Patent Date Issued
6720266 Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies Apr. 13, 2004
6716773 Process for producing semiconductor substrates Apr. 6, 2004
6716756 Method for forming capacitor of semiconductor device Apr. 6, 2004
6716647 Deliberate semiconductor film variation to compensate for radial processing differences, determine optimal device characteristics, or produce small productions runs Apr. 6, 2004
6709317 Method and apparatus for uniformly planarizing a microelectronic substrate Mar. 23, 2004
6707134 Semiconductor structure having an improved pre-metal dielectric stack and method for forming the same Mar. 16, 2004
6703287 Production method for shallow trench insulation Mar. 9, 2004
6703270 Method of manufacturing a semiconductor device Mar. 9, 2004
6700143 Dummy structures that protect circuit elements during polishing Mar. 2, 2004
6699799 Method of forming a semiconductor device Mar. 2, 2004
6699791 Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies Mar. 2, 2004
6699725 Methods of fabricating ferroelectric memory devices having a ferroelectric planarization layer Mar. 2, 2004
6699299 Composition and method for polishing in metal CMP Mar. 2, 2004
6699766 Method of fabricating an integral capacitor and gate transistor having nitride and oxide polish stop layers using chemical mechanical polishing elimination Mar. 2, 2004
6696759 Semiconductor device with diamond-like carbon layer as a polish-stop layer Feb. 24, 2004
6693315 Semiconductor device with an active region and plural dummy regions Feb. 17, 2004
6693034 Deadhesion method and mechanism for wafer processing Feb. 17, 2004
6693357 Methods and semiconductor devices with wiring layer fill structures to improve planarization uniformity Feb. 17, 2004
6688969 Method for planarizing a dielectric layer of a flash memory device Feb. 10, 2004
6690045 Semiconductor device with reduced CMP dishing Feb. 10, 2004
6686265 Method of producing a capacitor electrode with a barrier structure Feb. 3, 2004
6682985 Semiconductor device and manufacturing method thereof Jan. 27, 2004
6682617 Method for making wallboard or backerboard sheets including aerated concrete Jan. 27, 2004
6669748 Dispersion liquid of silica particles for polishing, method of producing the same, and polishing agent Dec. 30, 2003
RE38363 Method of forming trench isolation having polishing step and method of manufacturing semiconductor device Dec. 23, 2003
6663468 Method for polishing surface of semiconductor device substrate Dec. 16, 2003
6664190 Pre STI-CMP planarization scheme Dec. 16, 2003
6660641 Method for forming crack resistant planarizing layer within microelectronic fabrication Dec. 9, 2003
6653202 Method of shallow trench isolation (STI) formation using amorphous carbon Nov. 25, 2003
6653717 Enhancement in throughput and planarity during CMP using a dielectric stack containing an HDP oxide Nov. 25, 2003
6653722 Method for applying uniform pressurized film across wafer Nov. 25, 2003
6652363 Method and apparatus for uniformly planarizing a microelectronic substrate Nov. 25, 2003
6653671 Semiconductor device Nov. 25, 2003
6652764 Methods and apparatuses for making and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates Nov. 25, 2003
6649253 Method of using films having optimized optical properties for chemical mechanical polishing endpoint detection Nov. 18, 2003
6645865 Methods, apparatuses and substrate assembly structures for fabricating microelectronic components using mechanical and chemical-mechanical planarization processes Nov. 11, 2003
6643186 Nonvolatile memory structures and fabrication methods Nov. 4, 2003
6642598 Semiconductor device Nov. 4, 2003
6638145 Constant pH polish and scrub Oct. 28, 2003
6639285 Method for fabricating a semiconductor device Oct. 28, 2003
6638895 Method for fabricating high aspect ratio structures in perovskite material Oct. 28, 2003
6638866 Chemical-mechanical polishing (CMP) process for shallow trench isolation Oct. 28, 2003
6635574 Method of removing material from a semiconductor substrate Oct. 21, 2003
6635548 Capacitor and method for forming same Oct. 21, 2003
6633082 Semiconductor device and method for manufacturing the semiconductor device Oct. 14, 2003
6630390 Method of forming a semiconductor device using a carbon doped oxide layer to control the chemical mechanical polishing of a dielectric layer Oct. 7, 2003
6630739 Planarization structure and method for dielectric layers Oct. 7, 2003
6627551 Method for avoiding microscratch in interlevel dielectric layer chemical mechanical polishing process Sep. 30, 2003
6626968 Slurry for chemical mechanical polishing process and method of manufacturing semiconductor device using the same Sep. 30, 2003
6623993 Method of determining the time for polishing the surface of an integrated circuit wafer Sep. 23, 2003

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19

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