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Class Information
Number: 257/E21.244
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Device having semiconductor body comprising group iv elements or group iii-v compounds with or without impurities, e.g., doping materials (epo) > Treatment of semiconductor body using process other than deposition of semiconductor material on a substrate, diffusion or alloying of impurity material, or radiation treatment (epo) > To change their surface-physical characteristics or shape, e.g., etching, polishing, cutting (epo) > To form insulating layer thereon, e.g., for masking or by using photolithographic technique (epo) > Post-treatment (epo) > Planarization of insulating layer (epo) > Involving dielectric removal step (epo)
Description: This subclass is indented under subclass E21.243. This subclass is substantially the same in scope as ECLA classification H01L21/3105B2.










Sub-classes under this class:

Class Number Class Name Patents
257/E21.245 Removal by chemical etching, e.g., dry etching (epo) 304


Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19

Patent Number Title Of Patent Date Issued
7045073 Pre-etch implantation damage for the removal of thin film layers May. 16, 2006
7045435 Shallow trench isolation method for a semiconductor wafer May. 16, 2006
7040966 Carbonation of pH controlled KOH solution for improved polishing of oxide films on semiconductor wafers May. 9, 2006
7040956 Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life May. 9, 2006
7041600 Methods of planarization May. 9, 2006
7037821 Method for forming contact of semiconductor device May. 2, 2006
7037179 Methods and apparatuses for making and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates May. 2, 2006
7037840 Methods of forming planarized surfaces over semiconductor substrates May. 2, 2006
7033941 Method of producing semiconductor devices using chemical mechanical polishing Apr. 25, 2006
7033943 Etching solution, etching method and method for manufacturing semiconductor device Apr. 25, 2006
7034367 Semiconductor device having an STI structure and a dummy pattern with a rectangular shape Apr. 25, 2006
7029509 CMP slurry composition and a method for planarizing semiconductor device using the same Apr. 18, 2006
7029596 Computer integrated manufacturing control system for oxide chemical mechanical polishing Apr. 18, 2006
7030017 Method for the planarization of a semiconductor structure Apr. 18, 2006
7026245 Polishing agent and polishing method Apr. 11, 2006
7018924 CMP slurry compositions for oxide films and methods for forming metal line contact plugs using the same Mar. 28, 2006
7018560 Composition for polishing semiconductor layers Mar. 28, 2006
7017133 Designing a semiconductor device layout using polishing regions Mar. 21, 2006
7011574 Polyelectrolyte dispensing polishing pad Mar. 14, 2006
7009233 Semiconductor integrated circuit device including dummy patterns located to reduce dishing Mar. 7, 2006
7008840 Method for manufacturing semiconductor device with capacitor elements Mar. 7, 2006
7005384 Chemical mechanical polishing method, and washing/rinsing method associated therewith Feb. 28, 2006
7001713 Method of forming partial reverse active mask Feb. 21, 2006
6997785 Wafer planarization composition and method of use Feb. 14, 2006
6995090 Polishing slurry for use in CMP of SiC series compound, polishing method, and method of manufacturing semiconductor device Feb. 7, 2006
6991993 Method of fabricating trench isolation structure of a semiconductor device Jan. 31, 2006
6992003 Integration of ultra low K dielectric in a semiconductor fabrication process Jan. 31, 2006
6986798 Cerium-based abrasive, production process thereof Jan. 17, 2006
6979650 Fabrication method of semiconductor integrated circuit device Dec. 27, 2005
6974777 CMP compositions for low-k dielectric materials Dec. 13, 2005
6969684 Method of making a planarized semiconductor structure Nov. 29, 2005
6967375 Reduction of chemical mechanical planarization (CMP) scratches with sacrificial dielectric polish stop Nov. 22, 2005
6964598 Polishing apparatus and method for forming an integrated circuit Nov. 15, 2005
6964600 High selectivity colloidal silica slurry Nov. 15, 2005
6964923 Selective polishing with slurries containing polyelectrolytes Nov. 15, 2005
6964924 Integrated circuit process monitoring and metrology system Nov. 15, 2005
6955987 Comparison of chemical-mechanical polishing processes Oct. 18, 2005
6946359 Method for fabricating trench isolations with high aspect ratio Sep. 20, 2005
6943114 Integration scheme for metal gap fill, with fixed abrasive CMP Sep. 13, 2005
6936480 Method of controlling the chemical mechanical polishing of stacked layers having a surface topology Aug. 30, 2005
6936543 CMP method utilizing amphiphilic nonionic surfactants Aug. 30, 2005
6927168 Method for manufacturing semiconductor device Aug. 9, 2005
6924238 Edge peeling improvement of low-k dielectric materials stack by adjusting EBR resistance Aug. 2, 2005
6919277 Deliberate semiconductor film variation to compensate for radial processing differences, determine optimal device characteristics, or produce small productions Jul. 19, 2005
6919267 Method for forming wiring structure Jul. 19, 2005
6916525 Method of using films having optimized optical properties for chemical mechanical polishing endpoint detection Jul. 12, 2005
6916742 Modular barrier removal polishing slurry Jul. 12, 2005
6913993 Chemical-mechanical polishing method Jul. 5, 2005
6914000 Polishing method, polishing system and process-managing system Jul. 5, 2005
6914001 Chemical/mechanical polishing slurry, and chemical mechanical polishing process and shallow trench isolation process employing the same Jul. 5, 2005

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