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Class Information
Number: 257/E21.244
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Device having semiconductor body comprising group iv elements or group iii-v compounds with or without impurities, e.g., doping materials (epo) > Treatment of semiconductor body using process other than deposition of semiconductor material on a substrate, diffusion or alloying of impurity material, or radiation treatment (epo) > To change their surface-physical characteristics or shape, e.g., etching, polishing, cutting (epo) > To form insulating layer thereon, e.g., for masking or by using photolithographic technique (epo) > Post-treatment (epo) > Planarization of insulating layer (epo) > Involving dielectric removal step (epo)
Description: This subclass is indented under subclass E21.243. This subclass is substantially the same in scope as ECLA classification H01L21/3105B2.










Sub-classes under this class:

Class Number Class Name Patents
257/E21.245 Removal by chemical etching, e.g., dry etching (epo) 304


Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19

Patent Number Title Of Patent Date Issued
6335556 Semiconductor device and method for manufacturing semiconductor device Jan. 1, 2002
6335285 Method for manufacturing a globally planarized semiconductor device Jan. 1, 2002
6331481 Damascene etchback for low .epsilon. dielectric Dec. 18, 2001
6331488 Planarization process for semiconductor substrates Dec. 18, 2001
6331471 Method for improving peeling issues during fabrication of integrated circuits Dec. 18, 2001
6326309 Semiconductor device manufacturing method Dec. 4, 2001
6322600 Planarization compositions and methods for removing interlayer dielectric films Nov. 27, 2001
6323102 Method of manufacturing a semiconductor device Nov. 27, 2001
6319836 Planarization system Nov. 20, 2001
6316276 Apparatus and method of planarizing a semiconductor wafer that includes a first reflective substance and a second reflective substance Nov. 13, 2001
6316363 Deadhesion method and mechanism for wafer processing Nov. 13, 2001
6313038 Method and apparatus for controlling chemical interactions during planarization of microelectronic substrates Nov. 6, 2001
6312486 Slurry with chelating agent for chemical-mechanical polishing of a semiconductor wafer and methods related thereto Nov. 6, 2001
6309555 Method for determining thickness of material layer and chemical mechanical polishing endpoint Oct. 30, 2001
6305079 Methods of making plate-fin heat exchangers Oct. 23, 2001
6303506 Compositions for and method of reducing/eliminating scratches and defects in silicon dioxide during CMP process Oct. 16, 2001
6302766 System for cleaning a surface of a dielectric material Oct. 16, 2001
6303944 Method of manufacturing a semiconductor device having a monitor pattern, and a semiconductor device manufactured thereby Oct. 16, 2001
6303484 Method of manufacturing dummy pattern Oct. 16, 2001
6300248 On-chip pad conditioning for chemical mechanical polishing Oct. 9, 2001
6294105 Chemical mechanical polishing slurry and method for polishing metal/oxide layers Sep. 25, 2001
6294470 Slurry-less chemical-mechanical polishing Sep. 25, 2001
6294471 Method of eliminating dishing effect in polishing of dielectric film Sep. 25, 2001
6291111 Method of trench polishing Sep. 18, 2001
6288357 Ion milling planarization of semiconductor workpieces Sep. 11, 2001
6284668 Plasma polishing method Sep. 4, 2001
6284091 Unique chemical mechanical planarization approach which utilizes magnetic slurry for polish and magnetic fields for process control Sep. 4, 2001
6284660 Method for improving CMP processing Sep. 4, 2001
6281115 Sidewall protection for a via hole formed in a photosensitive, low dielectric constant layer Aug. 28, 2001
6281114 Planarization after metal chemical mechanical polishing in semiconductor wafer fabrication Aug. 28, 2001
6281049 Semiconductor device mask and method for forming the same Aug. 28, 2001
6280652 Edge polishing composition Aug. 28, 2001
6277725 Method for fabricating passivation layer on metal pad Aug. 21, 2001
6277751 Method of planarization Aug. 21, 2001
6277764 Interlayered dielectric layer of semiconductor device and method of manufacturing the same Aug. 21, 2001
6274498 Methods of forming materials within openings, and method of forming isolation regions Aug. 14, 2001
6274509 Global planarization method for inter-layer-dielectric and inter-metal dielectric Aug. 14, 2001
6274940 Semiconductor wafer, a chemical-mechanical alignment mark, and an apparatus for improving alignment for metal masking in conjunction with oxide and tungsten CMP Aug. 14, 2001
6274478 Method for forming a copper interconnect using a multi-platen chemical mechanical polishing (CMP) process Aug. 14, 2001
6271143 Method for preventing trench fill erosion Aug. 7, 2001
6271138 Chemical mechanical polish (CMP) planarizing method with enhanced chemical mechanical polish (CMP) planarized layer planarity Aug. 7, 2001
6270395 Oxidizing polishing slurries for low dielectric constant materials Aug. 7, 2001
6271119 Method for making semiconductor device Aug. 7, 2001
6267076 Gas phase planarization process for semiconductor wafers Jul. 31, 2001
6268224 Method and apparatus for detecting an ion-implanted polishing endpoint layer within a semiconductor wafer Jul. 31, 2001
6268263 Method of forming a trench type element isolation in semiconductor substrate Jul. 31, 2001
6267644 Fixed abrasive finishing element having aids finishing method Jul. 31, 2001
6265295 Method of preventing tilting over Jul. 24, 2001
6265740 Semiconductor device capacitor using a fill layer and a node on an inner surface of an opening Jul. 24, 2001
6261925 N2O Nitrided-oxide trench sidewalls to prevent boron outdiffusion and decrease stress Jul. 17, 2001

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