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Class Information
Number: 257/E21.244
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Device having semiconductor body comprising group iv elements or group iii-v compounds with or without impurities, e.g., doping materials (epo) > Treatment of semiconductor body using process other than deposition of semiconductor material on a substrate, diffusion or alloying of impurity material, or radiation treatment (epo) > To change their surface-physical characteristics or shape, e.g., etching, polishing, cutting (epo) > To form insulating layer thereon, e.g., for masking or by using photolithographic technique (epo) > Post-treatment (epo) > Planarization of insulating layer (epo) > Involving dielectric removal step (epo)
Description: This subclass is indented under subclass E21.243. This subclass is substantially the same in scope as ECLA classification H01L21/3105B2.










Sub-classes under this class:

Class Number Class Name Patents
257/E21.245 Removal by chemical etching, e.g., dry etching (epo) 304


Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19

Patent Number Title Of Patent Date Issued
8647986 Semiconductor process Feb. 11, 2014
8637403 Locally tailoring chemical mechanical polishing (CMP) polish rate for dielectrics Jan. 28, 2014
8563373 Semiconductor device having vertical channels and method of manufacturing the same Oct. 22, 2013
8551886 CMP process for processing STI on two distinct silicon planes Oct. 8, 2013
8513033 Method, design apparatus, and design program of semiconductor device, and semiconductor device Aug. 20, 2013
8415232 Dividing method for wafer having die bonding film attached to the back side thereof Apr. 9, 2013
8329552 Semiconductor device and method of manufacture Dec. 11, 2012
8124535 Method of fabricating solar cell Feb. 28, 2012
8093678 Semiconductor device and method of fabricating the same Jan. 10, 2012
8017464 Semiconductor integrated circuit device and a method for manufacturing a semiconductor integrated circuit device Sep. 13, 2011
7993960 Electronic device and method of manufacturing the same Aug. 9, 2011
7960821 Dummy vias for damascene process Jun. 14, 2011
7943470 Chip-stacked semiconductor device and manufacturing method thereof May. 17, 2011
7897488 Dividing method for wafer having film on the front side thereof Mar. 1, 2011
7825029 Method for the production of structured layers on substrates Nov. 2, 2010
7759763 Semiconductor device and a method of manufacturing the same Jul. 20, 2010
7736948 Method of manufacturing a plurality of semiconductor devices and carrier substrate Jun. 15, 2010
7670938 Methods of forming contact openings Mar. 2, 2010
7601607 Protruded contact and insertion of inter-layer-dielectric material to match damascene hardmask to improve undercut for low-k interconnects Oct. 13, 2009
7575995 Method of forming fine metal pattern and method of forming metal line using the same Aug. 18, 2009
7572697 Method of manufacturing flash memory device Aug. 11, 2009
7564114 Semiconductor devices and methods of manufacture thereof Jul. 21, 2009
7560329 Semiconductor device and method for fabricating the same Jul. 14, 2009
7544618 Two-step chemical mechanical polishing process Jun. 9, 2009
7537971 Method for fabricating CMOS image sensor May. 26, 2009
7528059 Method for reducing polish-induced damage in a contact structure by forming a capping layer May. 5, 2009
7510972 Method of processing substrate, post-chemical mechanical polishing cleaning method, and method of and program for manufacturing electronic device Mar. 31, 2009
7459720 Single crystal wafer and solar battery cell Dec. 2, 2008
7419909 Methods of forming a semiconductor device that allow patterns in different regions that have different pitches to be connected Sep. 2, 2008
7396737 Method of forming shallow trench isolation Jul. 8, 2008
7393737 Semiconductor device and a method of manufacturing the same Jul. 1, 2008
7393789 Protective coating for planarization Jul. 1, 2008
7361598 Method for fabricating semiconductor device capable of preventing scratch Apr. 22, 2008
7358196 Wet chemical treatment to form a thin oxide for high k gate dielectrics Apr. 15, 2008
7358587 Semiconductor structures Apr. 15, 2008
7338905 Semiconductor device manufacture method Mar. 4, 2008
7282434 Method of manufacturing a semiconductor device Oct. 16, 2007
7276426 Methods of forming semiconductor constructions Oct. 2, 2007
7271100 Slurry composition, polishing method using the slurry composition and method of forming a gate pattern using the slurry composition Sep. 18, 2007
7148103 Multilevel poly-Si tiling for semiconductor circuit manufacture Dec. 12, 2006
7074625 Semiconductor device and method of manufacturing the same Jul. 11, 2006
7071106 Method for CMP removal rate compensation Jul. 4, 2006
7071105 Method of polishing a silicon-containing dielectric Jul. 4, 2006
7071074 Structure and method for placement, sizing and shaping of dummy structures Jul. 4, 2006
7066790 Chemical-mechanical polishing methods Jun. 27, 2006
7064053 Process for fabricating an electrical circuit comprising a polishing step Jun. 20, 2006
7061068 Shallow trench isolation structures having uniform and smooth topography Jun. 13, 2006
7052997 Method to form etch and/or CMP stop layers May. 30, 2006
7052625 Slurry and use thereof for polishing May. 30, 2006
7048612 Method of chemical mechanical polishing May. 23, 2006

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