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Class Information
Number: 257/E21.242
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Device having semiconductor body comprising group iv elements or group iii-v compounds with or without impurities, e.g., doping materials (epo) > Treatment of semiconductor body using process other than deposition of semiconductor material on a substrate, diffusion or alloying of impurity material, or radiation treatment (epo) > To change their surface-physical characteristics or shape, e.g., etching, polishing, cutting (epo) > To form insulating layer thereon, e.g., for masking or by using photolithographic technique (epo) > Post-treatment (epo) > Of organic layer (epo)
Description: This subclass is indented under subclass E21.241. This subclass is substantially the same in scope as ECLA classification H01L21/3105P.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7498263 |
Method of planarizing an inter-metal insulation film |
Mar. 3, 2009 |
| 7405168 |
Plural treatment step process for treating dielectric films |
Jul. 29, 2008 |
| 7358597 |
UV-activated dielectric layer |
Apr. 15, 2008 |
| 7306969 |
Methods to minimize contact resistance |
Dec. 11, 2007 |
| 7285501 |
Method of forming a solution processed device |
Oct. 23, 2007 |
| 7244642 |
Method to obtain fully silicided gate electrodes |
Jul. 17, 2007 |
| 7224026 |
Nanoelectronic devices and circuits |
May. 29, 2007 |
| 7195936 |
Thin film processing method and system |
Mar. 27, 2007 |
| 7094661 |
Single and dual damascene techniques utilizing composite polymer dielectric film |
Aug. 22, 2006 |
| 7060323 |
Method of forming interlayer insulating film |
Jun. 13, 2006 |
| 7056560 |
Ultra low dielectric materials based on hybrid system of linear silicon precursor and organic porogen by plasma-enhanced chemical vapor deposition (PECVD) |
Jun. 6, 2006 |
| 7056825 |
Method for manufacturing a semiconductor device that includes plasma treating an insulating film with a mixture of helium and argon gases |
Jun. 6, 2006 |
| 7056837 |
Process of insulating a semiconductor device using a polymeric material |
Jun. 6, 2006 |
| 7037839 |
Method for polishing organic film on semiconductor substrate by use of resin particles, and slurry |
May. 2, 2006 |
| 7022624 |
Semiconductor device and method of fabricating the same |
Apr. 4, 2006 |
| 7014786 |
Methods and apparatus for forming submicron patterns on films |
Mar. 21, 2006 |
| 6989230 |
Producing low k inter-layer dielectric films using Si-containing resists |
Jan. 24, 2006 |
| 6979848 |
Memory system with conductive structures embedded in foamed insulator |
Dec. 27, 2005 |
| 6958544 |
Semiconductor device and method of manufacturing the same |
Oct. 25, 2005 |
| 6955998 |
Method for forming low dielectric layer of semiconductor device |
Oct. 18, 2005 |
| 6939817 |
Removal of carbon from an insulative layer using ozone |
Sep. 6, 2005 |
| 6939792 |
Low-k dielectric layer with overlying adhesion layer |
Sep. 6, 2005 |
| 6936551 |
Methods and apparatus for E-beam treatment used to fabricate integrated circuit devices |
Aug. 30, 2005 |
| 6930056 |
Plasma treatment of low dielectric constant dielectric material to form structures useful in formation of metal interconnects and/or filled vias for integrated circuit structure |
Aug. 16, 2005 |
| 6921727 |
Method for modifying dielectric characteristics of dielectric layers |
Jul. 26, 2005 |
| 6913992 |
Method of modifying interlayer adhesion |
Jul. 5, 2005 |
| 6902999 |
Pattern formation method |
Jun. 7, 2005 |
| 6902771 |
Process for producing silica-based film, silica-based film, insulating film, and semiconductor device |
Jun. 7, 2005 |
| 6893726 |
Substrate coated with silica-containing film with low-dielectric constant |
May. 17, 2005 |
| 6893985 |
UV-activated dielectric layer |
May. 17, 2005 |
| 6890848 |
Fabrication process of a semiconductor device |
May. 10, 2005 |
| 6875709 |
Application of a supercritical CO2 system for curing low k dielectric materials |
Apr. 5, 2005 |
| 6872671 |
Insulators for high density circuits |
Mar. 29, 2005 |
| 6869888 |
E-beam flood exposure of spin-on material to eliminate voids in vias |
Mar. 22, 2005 |
| 6841479 |
Method of reducing in-trench smearing during polishing |
Jan. 11, 2005 |
| 6838764 |
Insulators for high density circuits |
Jan. 4, 2005 |
| 6830503 |
Catalyst/oxidizer-based CMP system for organic polymer films |
Dec. 14, 2004 |
| 6828227 |
Method for applying uniform pressurized film across wafer |
Dec. 7, 2004 |
| 6797605 |
Method to improve adhesion of dielectric films in damascene interconnects |
Sep. 28, 2004 |
| 6790769 |
CMP slurry and method of manufacturing semiconductor device |
Sep. 14, 2004 |
| 6790790 |
High modulus filler for low k materials |
Sep. 14, 2004 |
| 6790784 |
Plasma treatment of low dielectric constant dielectric material to form structures useful in formation of metal interconnects and/or filled vias for intergrated circuit structure |
Sep. 14, 2004 |
| 6786974 |
Insulating film forming method and insulating film forming apparatus |
Sep. 7, 2004 |
| 6780778 |
Method for fabricating semiconductor device |
Aug. 24, 2004 |
| 6774044 |
Reducing photoresist shrinkage via plasma treatment |
Aug. 10, 2004 |
| 6759321 |
Stabilization of fluorine-containing low-k dielectrics in a metal/insulator wiring structure by ultraviolet irradiation |
Jul. 6, 2004 |
| 6756308 |
Chemical-mechanical planarization using ozone |
Jun. 29, 2004 |
| 6737363 |
Method of manufacturing semiconductor device |
May. 18, 2004 |
| 6734118 |
Dielectric material treatment |
May. 11, 2004 |
| 6726529 |
Low temperature chemical mechanical polishing of dielectric materials |
Apr. 27, 2004 |
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