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Class Information
Number: 257/E21.241
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Device having semiconductor body comprising group iv elements or group iii-v compounds with or without impurities, e.g., doping materials (epo) > Treatment of semiconductor body using process other than deposition of semiconductor material on a substrate, diffusion or alloying of impurity material, or radiation treatment (epo) > To change their surface-physical characteristics or shape, e.g., etching, polishing, cutting (epo) > To form insulating layer thereon, e.g., for masking or by using photolithographic technique (epo) > Post-treatment (epo)
Description: This subclass is indented under subclass E21.24. This subclass is substantially the same in scope as ECLA classification H01L21/3105.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7569499 |
Semiconductor device made by multiple anneal of stress inducing layer |
Aug. 4, 2009 |
| 7537971 |
Method for fabricating CMOS image sensor |
May. 26, 2009 |
| 7538001 |
Transistor gate forming methods and integrated circuits |
May. 26, 2009 |
| 7507677 |
Removable amorphous carbon CMP stop |
Mar. 24, 2009 |
| 7479465 |
Transfer of stress to a layer |
Jan. 20, 2009 |
| 7459391 |
Semiconductor device and method of fabricating the same |
Dec. 2, 2008 |
| 7405168 |
Plural treatment step process for treating dielectric films |
Jul. 29, 2008 |
| 7396724 |
Dual-hybrid liner formation without exposing silicide layer to photoresist stripping chemicals |
Jul. 8, 2008 |
| 7323729 |
Methods for improving quality of high temperature oxide (HTO) formed from halogen-containing precursor and products thereof and apparatus therefor |
Jan. 29, 2008 |
| 7312138 |
Semiconductor device and method of manufacture thereof |
Dec. 25, 2007 |
| 7262142 |
Semiconductor device fabrication method |
Aug. 28, 2007 |
| 7223705 |
Ambient gas treatment of porous dielectric |
May. 29, 2007 |
| 7074625 |
Semiconductor device and method of manufacturing the same |
Jul. 11, 2006 |
| 7064052 |
Method of processing a transistor gate dielectric film with stem |
Jun. 20, 2006 |
| 7056835 |
Surface preparation prior to deposition |
Jun. 6, 2006 |
| 7052997 |
Method to form etch and/or CMP stop layers |
May. 30, 2006 |
| 7030023 |
Method for simultaneous degas and baking in copper damascene process |
Apr. 18, 2006 |
| 7030009 |
Method for forming metal interconnect in a carbon containing silicon oxide film |
Apr. 18, 2006 |
| 7022602 |
Nitrogen-enriched low-k barrier layer for a copper metallization layer |
Apr. 4, 2006 |
| 7022623 |
Method of fabricating a semiconductor device with a dielectric film using a wet oxidation with steam process |
Apr. 4, 2006 |
| 7015567 |
Method for fabricating a semiconductor structure using a protective layer, and semiconductor structure |
Mar. 21, 2006 |
| 7015150 |
Exposed pore sealing post patterning |
Mar. 21, 2006 |
| 6979649 |
Fabrication method of semiconductor integrated circuit device |
Dec. 27, 2005 |
| 6979848 |
Memory system with conductive structures embedded in foamed insulator |
Dec. 27, 2005 |
| 6962855 |
Method of forming a porous material layer in a semiconductor device |
Nov. 8, 2005 |
| 6958277 |
Surface preparation prior to deposition |
Oct. 25, 2005 |
| 6949477 |
Method of fabricating a capacitive element for a semiconductor device |
Sep. 27, 2005 |
| 6943077 |
Selective spacer layer deposition method for forming spacers with different widths |
Sep. 13, 2005 |
| 6933246 |
Dielectric film |
Aug. 23, 2005 |
| 6921727 |
Method for modifying dielectric characteristics of dielectric layers |
Jul. 26, 2005 |
| 6921712 |
Process for producing integrated circuits including reduction using gaseous organic compounds |
Jul. 26, 2005 |
| 6911405 |
Semiconductor device and method of manufacturing the same |
Jun. 28, 2005 |
| 6911686 |
Semiconductor memory device having planarized upper surface and a SiON moisture barrier |
Jun. 28, 2005 |
| 6900128 |
Activation of oxides for electroless plating |
May. 31, 2005 |
| 6900118 |
Method for preventing contact defects in interlayer dielectric layer |
May. 31, 2005 |
| 6900121 |
Laser thermal annealing to eliminate oxide voiding |
May. 31, 2005 |
| 6893985 |
UV-activated dielectric layer |
May. 17, 2005 |
| 6887795 |
Method of growing electrical conductors |
May. 3, 2005 |
| 6887800 |
Method for making a semiconductor device with a high-k gate dielectric and metal layers that meet at a P/N junction |
May. 3, 2005 |
| 6878628 |
In situ reduction of copper oxide prior to silicon carbide deposition |
Apr. 12, 2005 |
| 6878602 |
Dielectric cure for reducing oxygen vacancies |
Apr. 12, 2005 |
| 6878644 |
Multistep cure technique for spin-on-glass films |
Apr. 12, 2005 |
| 6872671 |
Insulators for high density circuits |
Mar. 29, 2005 |
| 6872979 |
Semiconductor substrate with stacked oxide and SOI layers with a molten or epitaxial layer formed on an edge of the stacked layers |
Mar. 29, 2005 |
| 6869862 |
Method for improving a physical property defect value of a gate dielectric |
Mar. 22, 2005 |
| 6867126 |
Method to increase cracking threshold for low-k materials |
Mar. 15, 2005 |
| 6858923 |
Post-deposition treatment to enhance properties of Si-O-C low films |
Feb. 22, 2005 |
| 6849494 |
Dielectric cure for reducing oxygen vacancies |
Feb. 1, 2005 |
| 6846757 |
Dielectric layer for a semiconductor device and method of producing the same |
Jan. 25, 2005 |
| 6838300 |
Chemical treatment of low-k dielectric films |
Jan. 4, 2005 |
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