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Class Information
Number: 257/E21.239
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Device having semiconductor body comprising group iv elements or group iii-v compounds with or without impurities, e.g., doping materials (epo) > Treatment of semiconductor body using process other than deposition of semiconductor material on a substrate, diffusion or alloying of impurity material, or radiation treatment (epo) > To change their surface-physical characteristics or shape, e.g., etching, polishing, cutting (epo) > Mechanical treatment, e.g., grinding, polishing, cutting (epo) > Using abrasion, e.g., sand-blasting (epo)
Description: This subclass is indented under subclass E21.237. This subclass is substantially the same in scope as ECLA classification H01L21/304D.

Patents under this class:

Patent Number Title Of Patent Date Issued
8592948 Substrate, epitaxial layer provided substrate, method for producing substrate, and method for producing epitaxial layer provided substrate Nov. 26, 2013
8420503 Method for producing SOI substrate Apr. 16, 2013
8288251 Method for preparing SOI substrate having backside sandblasted Oct. 16, 2012
8268643 Substrate, epitaxial layer provided substrate, method for producing substrate, and method for producing epitaxial layer provided substrate Sep. 18, 2012
8183669 Nitride semiconductor wafer having a chamfered edge May. 22, 2012
8039314 Metal adhesion by induced surface roughness Oct. 18, 2011
7977234 Fabrication method of semiconductor integrated circuit device Jul. 12, 2011
7919343 Group III nitride crystal and method for surface treatment thereof, group III nitride stack and manufacturing method thereof, and group III nitride semiconductor device and manufacturing metho Apr. 5, 2011
7872331 Nitride semiconductor wafer Jan. 18, 2011
7800150 Semiconductor device Sep. 21, 2010
7718526 Fabrication method of semiconductor integrated circuit device May. 18, 2010
7666689 Method to remove circuit patterns from a wafer Feb. 23, 2010
7662239 Method of producing group 3 nitride substrate wafers and group 3 nitride substrate wafers Feb. 16, 2010
7485492 Process for manufacturing a non-volatile memory structure via soft lithography Feb. 3, 2009
7371685 Low stress barrier layer removal May. 13, 2008
6620735 Method for processing substrates Sep. 16, 2003
6582280 Sandblasting agent, wafer treated with the same, and method of treatment with the same Jun. 24, 2003
6508693 Method of manufacturing a semiconductor device Jan. 21, 2003
6406923 Process for reclaiming wafer substrates Jun. 18, 2002
6276992 Method of forming a groove in a surface of a mother substrate Aug. 21, 2001
5747385 Method of planarizing interlayer dielectric May. 5, 1998
5401690 Method for making circular diode chips through glass passivation Mar. 28, 1995
5348893 Method for treatment of semiconductor wafer Sep. 20, 1994
5132769 Semiconductor device with high withstand voltage Jul. 21, 1992
5051375 Method of producing semiconductor wafer through gettering using spherical abrasives Sep. 24, 1991
4782029 Method of gettering semiconductor wafers with an excimer laser beam Nov. 1, 1988
4769108 System for the production of semiconductor component elements Sep. 6, 1988
4312012 Nucleate boiling surface for increasing the heat transfer from a silicon device to a liquid coolant Jan. 19, 1982
4247579 Method for metallizing a semiconductor element Jan. 27, 1981
4027323 Photodetector array delineation method May. 31, 1977
3987479 Semiconductor power component Oct. 19, 1976
3965567 Method for producing diffused contacted and surface passivated semiconductor chips for semiconductor devices Jun. 29, 1976
3953941 Method and apparatus for making a groove in a semi-conductor element May. 4, 1976

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