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Class Information
Number: 257/E21.238
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Device having semiconductor body comprising group iv elements or group iii-v compounds with or without impurities, e.g., doping materials (epo) > Treatment of semiconductor body using process other than deposition of semiconductor material on a substrate, diffusion or alloying of impurity material, or radiation treatment (epo) > To change their surface-physical characteristics or shape, e.g., etching, polishing, cutting (epo) > Mechanical treatment, e.g., grinding, polishing, cutting (epo) > Making grooves, e.g., cutting (epo)
Description: This subclass is indented under subclass E21.237. This subclass is substantially the same in scope as ECLA classification H01L21/304B.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8709916 Laser processing method and apparatus Apr. 29, 2014
8673742 Method for manufacturing semiconductor device Mar. 18, 2014
8669190 Method for manufacturing semiconductor device and semiconductor wafer Mar. 11, 2014
8664089 Semiconductor die singulation method Mar. 4, 2014
8563343 Method of manufacturing laser diode device Oct. 22, 2013
8536025 Resized wafer with a negative photoresist ring and design structures thereof Sep. 17, 2013
8518804 Semiconductor device manufacturing method and manufacturing apparatus Aug. 27, 2013
8492255 Trenched Schottky diode and method of forming a trenched Schottky diode Jul. 23, 2013
8431440 Chip manufacturing method Apr. 30, 2013
8426293 IC chip and its manufacturing method Apr. 23, 2013
8420418 Light-emitting device and manufacturing method thereof Apr. 16, 2013
8404566 Light emitting diode and method for manufacturing the same Mar. 26, 2013
8390129 Semiconductor device with a plurality of mark through substrate vias Mar. 5, 2013
8389312 Group-III nitride semiconductor laser device, and method of fabricating group-III nitride semiconductor laser device Mar. 5, 2013
8357567 Manufacturing method of semiconductor device Jan. 22, 2013
8343805 Mems device and fabrication method Jan. 1, 2013
8334173 Method for manufacturing semiconductor apparatus Dec. 18, 2012
8324081 Wafer level surface passivation of stackable integrated circuit chips Dec. 4, 2012
8309433 Method of manufacturing optical sensor Nov. 13, 2012
8309435 Crack stops for semiconductor devices Nov. 13, 2012
8304920 Energy ray-curable polymer, an energy ray-curable adhesive composition, an adhesive sheet and a processing method of a semiconductor wafer Nov. 6, 2012
8298862 Method of manufacturing layered chip package Oct. 30, 2012
8298916 Process for fabricating a multilayer structure with post-grinding trimming Oct. 30, 2012
8293584 Integrated circuit package system with filled wafer recess Oct. 23, 2012
8268656 Optical device wafer processing method Sep. 18, 2012
8257985 MEMS device and fabrication method Sep. 4, 2012
8241960 Semiconductor device manufacturing equipment and semiconductor device manufacturing method Aug. 14, 2012
8227277 Group-III nitride semiconductor laser device, and method of fabricating group-III nitride semiconductor laser device Jul. 24, 2012
8227287 Partially transmitted imaged laser beam for scribing solar cell structures Jul. 24, 2012
8222101 Method of fabricating a MOS transistor having a gate insulation layer with a lateral portion and a vertical portion Jul. 17, 2012
8217499 Structure to reduce etching residue Jul. 10, 2012
8212345 Holding jig, semiconductor wafer grinding method, semiconductor wafer protecting structure and semiconductor wafer grinding method and semiconductor chip fabrication method using the structure Jul. 3, 2012
8211781 Semiconductor manufacturing method Jul. 3, 2012
8207018 Semiconductor package Jun. 26, 2012
8198175 Processing method for package substrate Jun. 12, 2012
8193016 Semiconductor laser device and method of manufacturing the same Jun. 5, 2012
8178425 Optical device wafer processing method May. 15, 2012
8178423 Laser beam machining method and laser beam machining apparatus May. 15, 2012
8148184 Optical device wafer processing method Apr. 3, 2012
8148240 Method of manufacturing semiconductor chips Apr. 3, 2012
8143112 Method for removing semiconductor street material Mar. 27, 2012
8139619 Group-III nitride semiconductor laser device, and method for fabricating group-III nitride semiconductor laser device Mar. 20, 2012
8088649 Radiation-emitting semiconductor body with carrier substrate and method for the producing the same Jan. 3, 2012
8084333 Object cutting method Dec. 27, 2011
8076167 Group-III nitride semiconductor laser device, and method for fabricating group-III nitride semiconductor laser device Dec. 13, 2011
8071405 Group-III nitride semiconductor laser device, and method for fabricating group-III nitride semiconductor laser device Dec. 6, 2011
8071429 Wafer dicing using scribe line etch Dec. 6, 2011
8071481 Method for forming highly strained source/drain trenches Dec. 6, 2011
8062960 Compound semiconductor device and method of manufacturing compound semiconductor device Nov. 22, 2011
8058151 Methods of die sawing Nov. 15, 2011

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