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Class Information
Number: 257/E21.238
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Device having semiconductor body comprising group iv elements or group iii-v compounds with or without impurities, e.g., doping materials (epo) > Treatment of semiconductor body using process other than deposition of semiconductor material on a substrate, diffusion or alloying of impurity material, or radiation treatment (epo) > To change their surface-physical characteristics or shape, e.g., etching, polishing, cutting (epo) > Mechanical treatment, e.g., grinding, polishing, cutting (epo) > Making grooves, e.g., cutting (epo)
Description: This subclass is indented under subclass E21.237. This subclass is substantially the same in scope as ECLA classification H01L21/304B.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7405144 |
Method for manufacturing probe card |
Jul. 29, 2008 |
| 7391087 |
MOS transistor structure and method of fabrication |
Jun. 24, 2008 |
| 7387971 |
Fabricating method for flat panel display device |
Jun. 17, 2008 |
| 7358156 |
Compound semiconductor device and method of manufacturing the same |
Apr. 15, 2008 |
| 7316965 |
Substrate contact for a capped MEMS and method of making the substrate contact at the wafer level |
Jan. 8, 2008 |
| 7250371 |
Reduction of feature critical dimensions |
Jul. 31, 2007 |
| 7250354 |
Semiconductor device and method for fabricating the same |
Jul. 31, 2007 |
| 7211500 |
Pre-process before cutting a wafer and method of cutting a wafer |
May. 1, 2007 |
| 7198982 |
Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates |
Apr. 3, 2007 |
| 7091624 |
Semiconductor device obtained by dividing semiconductor wafer by use of laser dicing technique and method of manufacturing the same |
Aug. 15, 2006 |
| 7060532 |
Manufacturing method of semiconductor device |
Jun. 13, 2006 |
| 7037758 |
Semiconductor device, method of manufacturing the same, circuit board and electronic apparatus |
May. 2, 2006 |
| 7005317 |
Controlled fracture substrate singulation |
Feb. 28, 2006 |
| 6951801 |
Metal reduction in wafer scribe area |
Oct. 4, 2005 |
| 6916726 |
Method for forming scribed groove and scribing apparatus |
Jul. 12, 2005 |
| 6901924 |
Method of cutting CSP substrates |
Jun. 7, 2005 |
| 6902990 |
Semiconductor device separation using a patterned laser projection |
Jun. 7, 2005 |
| 6897126 |
Semiconductor device manufacturing method using mask slanting from orientation flat |
May. 24, 2005 |
| 6890836 |
Scribe street width reduction by deep trench and shallow saw cut |
May. 10, 2005 |
| 6849524 |
Semiconductor wafer protection and cleaning for device separation using laser ablation |
Feb. 1, 2005 |
| 6797530 |
Semiconductor device-manufacturing method for manufacturing semiconductor devices with improved heat radiating efficiency and similar in size to semiconductor elements |
Sep. 28, 2004 |
| 6790705 |
Manufacturing method for semiconductor apparatus |
Sep. 14, 2004 |
| 6734083 |
Dicing method and dicing apparatus for dicing plate-like workpiece |
May. 11, 2004 |
| 6709953 |
Method of applying a bottom surface protective coating to a wafer, and wafer dicing method |
Mar. 23, 2004 |
| 6699552 |
Silicon wafer break pattern, silicon substrate |
Mar. 2, 2004 |
| 6692633 |
Sacrificial anode for corrosion protection of semiconductor metallization during sawing |
Feb. 17, 2004 |
| 6676491 |
Semiconductor wafer dividing method |
Jan. 13, 2004 |
| 6656819 |
Process for producing semiconductor device |
Dec. 2, 2003 |
| 6653210 |
Method and apparatus for cutting a non-metallic substrate using a laser beam |
Nov. 25, 2003 |
| 6649445 |
Wafer coating and singulation method |
Nov. 18, 2003 |
| 6620735 |
Method for processing substrates |
Sep. 16, 2003 |
| 6606985 |
Dual-cutting method devoid of useless strokes |
Aug. 19, 2003 |
| 6596562 |
Semiconductor wafer singulation method |
Jul. 22, 2003 |
| 6576531 |
Method for cutting semiconductor wafers |
Jun. 10, 2003 |
| 6528864 |
Semiconductor wafer having regular or irregular chip pattern and dicing method for the same |
Mar. 4, 2003 |
| 6498075 |
Dicing method |
Dec. 24, 2002 |
| 6494122 |
Alignment method and apparatus for aligning cutting blade |
Dec. 17, 2002 |
| 6465158 |
Semiconductor wafer dividing method |
Oct. 15, 2002 |
| 6461938 |
Method of producing semiconductor devices |
Oct. 8, 2002 |
| 6420776 |
Structure including electronic components singulated using laser cutting |
Jul. 16, 2002 |
| 6420678 |
Method for separating non-metallic substrates |
Jul. 16, 2002 |
| 6413839 |
Semiconductor device separation using a patterned laser projection |
Jul. 2, 2002 |
| 6412971 |
Light source including an array of light emitting semiconductor devices and control method |
Jul. 2, 2002 |
| 6406979 |
Method for sectioning a substrate wafer into a plurality of substrate chips |
Jun. 18, 2002 |
| 6399464 |
Packaging die preparation |
Jun. 4, 2002 |
| 6348363 |
Method for manufacturing a semiconductor package |
Feb. 19, 2002 |
| 6346034 |
Cutting method |
Feb. 12, 2002 |
| 6337258 |
Method of dividing a wafer |
Jan. 8, 2002 |
| 6319354 |
System and method for dicing semiconductor components |
Nov. 20, 2001 |
| 6303472 |
Process for cutting trenches in a single crystal substrate |
Oct. 16, 2001 |
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