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Class Information
Number: 257/E21.237
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Device having semiconductor body comprising group iv elements or group iii-v compounds with or without impurities, e.g., doping materials (epo) > Treatment of semiconductor body using process other than deposition of semiconductor material on a substrate, diffusion or alloying of impurity material, or radiation treatment (epo) > To change their surface-physical characteristics or shape, e.g., etching, polishing, cutting (epo) > Mechanical treatment, e.g., grinding, polishing, cutting (epo)
Description: This subclass is indented under subclass E21.214. This subclass is substantially the same in scope as ECLA classification H01L21/304.

Sub-classes under this class:

Class Number Class Name Patents
257/E21.238 Making grooves, e.g., cutting (epo) 264
257/E21.239 Using abrasion, e.g., sand-blasting (epo) 33

Patents under this class:
1 2 3 4 5 6 7 8 9 10

Patent Number Title Of Patent Date Issued
8709912 Semiconductor device manufacturing method and device for same Apr. 29, 2014
8709915 Method of manufacturing semiconductor device Apr. 29, 2014
8703583 Fabrication method of semiconductor device Apr. 22, 2014
8679944 Progressive trimming method Mar. 25, 2014
8679945 Backgrind process for integrated circuit wafers Mar. 25, 2014
8664089 Semiconductor die singulation method Mar. 4, 2014
8659113 Embedded semiconductor die package and method of making the same using metal frame carrier Feb. 25, 2014
8633603 Semiconductor device and a method of manufacturing the same Jan. 21, 2014
8629567 Integrated circuit packaging system with contacts and method of manufacture thereof Jan. 14, 2014
8614131 Self-aligned static random access memory (SRAM) on metal gate Dec. 24, 2013
8598015 Laser processing method Dec. 3, 2013
8598720 Semiconductor device and manufacturing method thereof Dec. 3, 2013
8592286 Ultra-thin wafer system and method of manufacture thereof Nov. 26, 2013
8592316 Nitride semiconductor substrate, production method therefor and nitride semiconductor device Nov. 26, 2013
8569148 Final polishing method for silicon single crystal wafer and silicon single crystal wafer Oct. 29, 2013
8563394 Integrated circuit structure having substantially planar N-P step height and methods of forming Oct. 22, 2013
8552510 Semiconductor device having ring-shaped gate electrode, design apparatus, and program Oct. 8, 2013
8546244 Method of manufacturing semiconductor device Oct. 1, 2013
8536025 Resized wafer with a negative photoresist ring and design structures thereof Sep. 17, 2013
8524602 Method for forming vias in a substrate Sep. 3, 2013
8524576 Wafer processing method Sep. 3, 2013
8518801 Substrate dividing method Aug. 27, 2013
8518800 Substrate dividing method Aug. 27, 2013
8497515 LED device with thermoelectric module Jul. 30, 2013
8455983 Microelectronic device wafers and methods of manufacturing Jun. 4, 2013
8450187 Method of cutting semiconductor substrate May. 28, 2013
8445360 Method for manufacturing semiconductor device May. 21, 2013
8421250 Semiconductor device and a method of manufacturing the same Apr. 16, 2013
8420505 Process for manufacture of thin wafer Apr. 16, 2013
8415232 Dividing method for wafer having die bonding film attached to the back side thereof Apr. 9, 2013
8409992 Method for producing a polished semiconductor wafer Apr. 2, 2013
8409968 Method of cutting semiconductor substrate via modified region formation and subsequent sheet expansion Apr. 2, 2013
8409973 Separation apparatus, separation method, and method for manufacturing semiconductor element Apr. 2, 2013
8399980 Electronic component used for wiring and method for manufacturing the same Mar. 19, 2013
8390129 Semiconductor device with a plurality of mark through substrate vias Mar. 5, 2013
8361845 Method for manufacturing semiconductor device Jan. 29, 2013
8361878 Method for preparing cerium oxide, cerium oxide prepared therefrom and CMP slurry comprising the same Jan. 29, 2013
8361883 Laser processing method Jan. 29, 2013
8357567 Manufacturing method of semiconductor device Jan. 22, 2013
8354328 Semiconductor device manufacturing method and semiconductor device Jan. 15, 2013
8354349 Semiconductor device having sealing film and manufacturing method thereof Jan. 15, 2013
8349707 Process for making contact with and housing integrated circuits Jan. 8, 2013
8343852 Method and structure for dividing a substrate into individual devices Jan. 1, 2013
8338271 Laser processing method and chip Dec. 25, 2012
8329559 Damascene process for use in fabricating semiconductor structures having micro/nano gaps Dec. 11, 2012
8329584 Method of manufacturing semiconductor device Dec. 11, 2012
8324079 Method of manufacturing semiconductor device Dec. 4, 2012
8324081 Wafer level surface passivation of stackable integrated circuit chips Dec. 4, 2012
8324082 Method for fabricating conductive substrates for electronic and optoelectronic devices Dec. 4, 2012
8319261 Semiconductor component structure with vertical dielectric layers Nov. 27, 2012

1 2 3 4 5 6 7 8 9 10

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