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Class Information
Number: 257/E21.23
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Device having semiconductor body comprising group iv elements or group iii-v compounds with or without impurities, e.g., doping materials (epo) > Treatment of semiconductor body using process other than deposition of semiconductor material on a substrate, diffusion or alloying of impurity material, or radiation treatment (epo) > To change their surface-physical characteristics or shape, e.g., etching, polishing, cutting (epo) > Chemical or electrical treatment, e.g., electrolytic etching (epo) > With simultaneous mechanical treatment, e.g., chemical-mechanical polishing (epo)
Description: This subclass is indented under subclass E21.215. This subclass is substantially the same in scope as ECLA classification H01L21/306P.

Patents under this class:
1 2 3 4 5 6 7 8 9 10 11

Patent Number Title Of Patent Date Issued
8709915 Method of manufacturing semiconductor device Apr. 29, 2014
8702472 Polishing composition and polishing method using the same Apr. 22, 2014
8703004 Method for chemical planarization and chemical planarization apparatus Apr. 22, 2014
8674382 Semiconductor light emitting device comprising heterojunction Mar. 18, 2014
8647965 Radiographic image detector, method of producing the same, and protective member Feb. 11, 2014
8647986 Semiconductor process Feb. 11, 2014
8637403 Locally tailoring chemical mechanical polishing (CMP) polish rate for dielectrics Jan. 28, 2014
8623766 Composition and method for polishing aluminum semiconductor substrates Jan. 7, 2014
8603916 CMP techniques for overlapping layer removal Dec. 10, 2013
8592316 Nitride semiconductor substrate, production method therefor and nitride semiconductor device Nov. 26, 2013
8592317 Polishing solution for CMP and polishing method using the polishing solution Nov. 26, 2013
8580690 Process of planarizing a wafer with a large step height and/or surface area features Nov. 12, 2013
8575030 Semiconductor device manufacturing method Nov. 5, 2013
8569148 Final polishing method for silicon single crystal wafer and silicon single crystal wafer Oct. 29, 2013
8563335 Method of controlling polishing using in-situ optical monitoring and fourier transform Oct. 22, 2013
8546261 Slurry for polishing and planarization method of insulating layer using the same Oct. 1, 2013
8540894 Polishing composition Sep. 24, 2013
8536073 Hardmask materials Sep. 17, 2013
8524035 Method and apparatus for conformable polishing Sep. 3, 2013
8518297 Polishing composition and polishing method using the same Aug. 27, 2013
8506831 Combination, method, and composition for chemical mechanical planarization of a tungsten-containing substrate Aug. 13, 2013
8445360 Method for manufacturing semiconductor device May. 21, 2013
8445386 Smoothing method for semiconductor material and wafers produced by same May. 21, 2013
8431490 Method of chemical mechanical polishing a substrate with polishing composition adapted to enhance silicon oxide removal Apr. 30, 2013
8420505 Process for manufacture of thin wafer Apr. 16, 2013
8420550 Method for cleaning backside etch during manufacture of integrated circuits Apr. 16, 2013
8394719 System and method for implementing multi-resolution advanced process control Mar. 12, 2013
8389417 Semiconductor device and manufacturing method thereof Mar. 5, 2013
8367552 Method for fabrication of in-laid metal interconnects Feb. 5, 2013
8367553 Method for manufacturing through-silicon via Feb. 5, 2013
8334190 Single step CMP for polishing three or more layer film stacks Dec. 18, 2012
8314031 Planarization process for pre-damascene structure including metal hard mask Nov. 20, 2012
8309468 Chemical mechanical polishing composition and method for polishing germanium-antimony-tellurium alloys Nov. 13, 2012
8304346 Abrasive composition and method for manufacturing semiconductor integrated circuit device Nov. 6, 2012
8304342 Sacrificial CMP etch stop layer Nov. 6, 2012
8268675 Passivation layer for semiconductor device packaging Sep. 18, 2012
8252682 Method for thinning a wafer Aug. 28, 2012
8252689 Chemical-mechanical planarization method and method for fabricating metal gate in gate-last process Aug. 28, 2012
8247332 Hardmask materials Aug. 21, 2012
8232559 Controlling diamond film surfaces and layering Jul. 31, 2012
8227351 Fabrication of magnetic tunnel junction (MTJ) devices with reduced surface roughness for magnetic random access memory (MRAM) Jul. 24, 2012
8227350 Controlling diamond film surfaces and layering Jul. 24, 2012
8222144 Method for manufacturing semiconductor device, and polishing apparatus Jul. 17, 2012
8187907 Solder structures for fabrication of inverted metamorphic multijunction solar cells May. 29, 2012
8178439 Surface cleaning and selective deposition of metal-containing cap layers for semiconductor devices May. 15, 2012
8129278 Chemical mechanical polishing process Mar. 6, 2012
8119517 Chemical mechanical polishing method and method of manufacturing semiconductor device Feb. 21, 2012
8084361 Semiconductor fabrication method suitable for MEMS Dec. 27, 2011
8071480 Method and apparatuses for removing polysilicon from semiconductor workpieces Dec. 6, 2011
8008742 Semiconductor memory device and method of fabricating the same Aug. 30, 2011

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