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Class Information
Number: 257/E21.224
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Device having semiconductor body comprising group iv elements or group iii-v compounds with or without impurities, e.g., doping materials (epo) > Treatment of semiconductor body using process other than deposition of semiconductor material on a substrate, diffusion or alloying of impurity material, or radiation treatment (epo) > To change their surface-physical characteristics or shape, e.g., etching, polishing, cutting (epo) > Chemical or electrical treatment, e.g., electrolytic etching (epo) > Chemical cleaning (epo)
Description: This subclass is indented under subclass E21.215. This subclass is substantially the same in scope as ECLA classification H01L21/306N.

Sub-classes under this class:

Class Number Class Name Patents
257/E21.225 Cleaning diamond or graphite (epo) 4
257/E21.229 Combining dry and wet cleaning steps (epo) 308
257/E21.226 Dry cleaning (epo) 377
257/E21.228 Wet cleaning only (epo) 878

Patents under this class:
1 2 3

Patent Number Title Of Patent Date Issued
5081068 Method of treating surface of substrate with ice particles and hydrogen peroxide Jan. 14, 1992
5035750 Processing method for semiconductor wafers Jul. 30, 1991
5028560 Method for forming a thin layer on a semiconductor substrate Jul. 2, 1991
5025597 Processing apparatus for semiconductor wafers Jun. 25, 1991
5013693 Formation of microstructures with removal of liquid by freezing and sublimation May. 7, 1991
4972677 Method of cleaning wafers or the like Nov. 27, 1990
4962776 Process for surface and fluid cleaning Oct. 16, 1990
4932168 Processing apparatus for semiconductor wafers Jun. 12, 1990
4885056 Method of reducing defects on semiconductor wafers Dec. 5, 1989
4883775 Process for cleaning and protecting semiconductor substrates Nov. 28, 1989
4777804 Method and apparatus for easing surface particle removal by size increase Oct. 18, 1988
4521951 Method of reduction of a compound forming a layer on a substrate and the application of said method to the fabrication of a field-effect semiconducting structure Jun. 11, 1985
4280885 Method of and apparatus for active electro-chemical water and similar environmental contaminant elimination in semi-conductor and other electronic and electrical devices and the like Jul. 28, 1981
4129457 Post-polishing cleaning of semiconductor surfaces Dec. 12, 1978
4050954 Surface treatment of semiconductor substrates Sep. 27, 1977

1 2 3

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