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Class Information
Number: 257/E21.224
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Device having semiconductor body comprising group iv elements or group iii-v compounds with or without impurities, e.g., doping materials (epo) > Treatment of semiconductor body using process other than deposition of semiconductor material on a substrate, diffusion or alloying of impurity material, or radiation treatment (epo) > To change their surface-physical characteristics or shape, e.g., etching, polishing, cutting (epo) > Chemical or electrical treatment, e.g., electrolytic etching (epo) > Chemical cleaning (epo)
Description: This subclass is indented under subclass E21.215. This subclass is substantially the same in scope as ECLA classification H01L21/306N.

Sub-classes under this class:

Class Number Class Name Patents
257/E21.225 Cleaning diamond or graphite (epo) 4
257/E21.229 Combining dry and wet cleaning steps (epo) 308
257/E21.226 Dry cleaning (epo) 377
257/E21.228 Wet cleaning only (epo) 878

Patents under this class:
1 2 3

Patent Number Title Of Patent Date Issued
7338909 Micro-etching method to replicate alignment marks for semiconductor wafer photolithography Mar. 4, 2008
7320937 Method of reliably electroless-plating integrated circuit die Jan. 22, 2008
7273772 Method for manufacturing thin film transistor array panel Sep. 25, 2007
7262141 Methods for cleaning a semiconductor substrate having a recess channel region Aug. 28, 2007
7208428 Method and apparatus for treating article to be treated Apr. 24, 2007
7157415 Post etch cleaning composition for dual damascene system Jan. 2, 2007
7125799 Method and device for processing substrate, and apparatus for manufacturing semiconductor device Oct. 24, 2006
6881687 Method for laser cleaning of a substrate surface using a solid sacrificial film Apr. 19, 2005
6858089 Apparatus and method for semiconductor wafer cleaning Feb. 22, 2005
6844259 Method for forming contact plug in semiconductor device Jan. 18, 2005
6750147 Process for integration of a trench for capacitors and removal of black silicon Jun. 15, 2004
6677247 Method of increasing the etch selectivity of a contact sidewall to a preclean etchant Jan. 13, 2004
6566169 Method and apparatus for local vectorial particle cleaning May. 20, 2003
6562699 Process for manufacturing semiconductor device May. 13, 2003
6500605 Removal of photoresist and residue from substrate using supercritical carbon dioxide process Dec. 31, 2002
6491836 Semiconductor wafer and production method therefor Dec. 10, 2002
6432212 Substrate washing method Aug. 13, 2002
6403498 Method and device for treating substrate Jun. 11, 2002
6274512 Method for manufacturing a semiconductor device Aug. 14, 2001
6258637 Method for thin film deposition on single-crystal semiconductor substrates Jul. 10, 2001
6175983 Substrate washing apparatus and method Jan. 23, 2001
6177356 Semiconductor cleaning apparatus Jan. 23, 2001
6140659 Method and apparatus for removing residual dirt adhered on dies Oct. 31, 2000
6110840 Method of passivating the surface of a Si substrate Aug. 29, 2000
6057557 Semiconductor substrate semiconductor device and liquid crystal display device May. 2, 2000
6037271 Low haze wafer treatment process Mar. 14, 2000
6036581 Substrate cleaning method and apparatus Mar. 14, 2000
5967156 Processing a surface Oct. 19, 1999
5961732 Treating substrates by producing and controlling a cryogenic aerosol Oct. 5, 1999
5956596 Method of forming and cleaning a laser marking region at a round zone of a semiconductor wafer Sep. 21, 1999
5902678 Pressure-sensitive adhesive or pressure-sensitive adhesive tape for foreign-matter removal May. 11, 1999
5804494 Method of fabricating bonded wafer Sep. 8, 1998
5795399 Semiconductor device manufacturing apparatus, method for removing reaction product, and method of suppressing deposition of reaction product Aug. 18, 1998
5796111 Apparatus for cleaning contaminated surfaces using energetic cluster beams Aug. 18, 1998
5776296 Apparatus for the treatment of semiconductor wafers in a fluid Jul. 7, 1998
5766369 Method to reduce particulates in device manufacture Jun. 16, 1998
5753563 Method of removing particles by adhesive May. 19, 1998
5747387 Removal method of organic matter and system for the same May. 5, 1998
5716873 Method for cleaning waste matter from the backside of a semiconductor wafer substrate Feb. 10, 1998
5512106 Surface cleaning with argon Apr. 30, 1996
5496506 Process for removing fine particles Mar. 5, 1996
5464480 Process and apparatus for the treatment of semiconductor wafers in a fluid Nov. 7, 1995
5361449 Cleaning apparatus for cleaning reverse surface of semiconductor wafer Nov. 8, 1994
5320706 Removing slurry residue from semiconductor wafer planarization Jun. 14, 1994
5273589 Method for low pressure rinsing and drying in a process chamber Dec. 28, 1993
5244535 Method of manufacturing a semiconductor device including plasma treatment of contact holes Sep. 14, 1993
5238871 Method of manufacturing a semiconductor device Aug. 24, 1993
5229334 Method of forming a gate insulating film involving a step of cleaning using an ammonia-peroxide solution Jul. 20, 1993
5217925 Apparatus and method for cleaning semiconductor wafers Jun. 8, 1993
5178682 Method for forming a thin layer on a semiconductor substrate and apparatus therefor Jan. 12, 1993

1 2 3

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