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Class Information
Number: 257/E21.214
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Device having semiconductor body comprising group iv elements or group iii-v compounds with or without impurities, e.g., doping materials (epo) > Treatment of semiconductor body using process other than deposition of semiconductor material on a substrate, diffusion or alloying of impurity material, or radiation treatment (epo) > To change their surface-physical characteristics or shape, e.g., etching, polishing, cutting (epo)
Description: This subclass is indented under subclass E21.211. This subclass is substantially the same in scope as ECLA classification H01L21/302.

Sub-classes under this class:

Class Number Class Name Patents
257/E21.215 Chemical or electrical treatment, e.g., electrolytic etching (epo) 226
257/E21.237 Mechanical treatment, e.g., grinding, polishing, cutting (epo) 469
257/E21.24 To form insulating layer thereon, e.g., for masking or by using photolithographic technique (epo) 170
257/E21.294 Deposition/post-treatment of noninsulating, e.g., conductive - or resistive - layers on insulating layers (epo) 109

Patents under this class:
1 2 3 4 5 6 7 8 9 10

Patent Number Title Of Patent Date Issued
8709915 Method of manufacturing semiconductor device Apr. 29, 2014
8709947 Method for forming pattern Apr. 29, 2014
8703551 Process flow to reduce hole defects in P-active regions and to reduce across-wafer threshold voltage scatter Apr. 22, 2014
8703618 Method of forming micropattern, die formed by this method of forming micropattern, transfer method and micropattern forming method using this die Apr. 22, 2014
8691666 Method for producing chip with adhesive applied Apr. 8, 2014
8685856 Solid-state imaging device, fabrication method thereof, imaging apparatus, and fabrication method of anti-reflection structure Apr. 1, 2014
8685862 Method of forming micropattern, die formed by this method of forming micropattern, transfer method and micropattern forming method using this die Apr. 1, 2014
8679940 Methods for fabricating semiconductor devices with isolation regions having uniform stepheights Mar. 25, 2014
8673780 Methods of processing semiconductor substrates in forming scribe line alignment marks Mar. 18, 2014
8668833 Method of forming a nanostructure Mar. 11, 2014
8664089 Semiconductor die singulation method Mar. 4, 2014
8664116 Heat treatment method for growing silicide Mar. 4, 2014
8652360 Semiconductor nanocrystals Feb. 18, 2014
8652869 Method for roughening substrate surface and method for manufacturing photovoltaic device Feb. 18, 2014
8647990 Method of patterning a low-K dielectric film Feb. 11, 2014
8647901 Method for forming a nitride semiconductor layer and method for separating the nitride semiconductor layer from the substrate Feb. 11, 2014
8642483 Substrate processing with shrink etching step Feb. 4, 2014
8643137 Short channel lateral MOSFET Feb. 4, 2014
8637399 Etching composition, method of forming a metal pattern and method of manufacturing a display substrate Jan. 28, 2014
8637403 Locally tailoring chemical mechanical polishing (CMP) polish rate for dielectrics Jan. 28, 2014
8633114 Methods for manufacturing high dielectric constant films Jan. 21, 2014
8633113 Method for fabricating a bottom oxide layer in a trench Jan. 21, 2014
8632687 Method for electron beam induced etching of layers contaminated with gallium Jan. 21, 2014
8617953 Memory having a vertical access device Dec. 31, 2013
8604564 Semiconductor structures and methods of manufacturing the same Dec. 10, 2013
8604584 Semiconductor device and method of manufacturing semiconductor device Dec. 10, 2013
8592316 Nitride semiconductor substrate, production method therefor and nitride semiconductor device Nov. 26, 2013
8580604 Method for preparing OLED by imprinting process Nov. 12, 2013
8569092 Method for fabricating a microelectromechanical sensor with a piezoresistive type readout Oct. 29, 2013
8563441 Methods for fabricating memory cells having fin structures with smooth sidewalls and rounded top corners and edges Oct. 22, 2013
8563440 Method for chemically treating a substrate Oct. 22, 2013
8563381 Method for manufacturing a power semiconductor device Oct. 22, 2013
8557718 Method for blister-free passivation of a silicon surface Oct. 15, 2013
8558396 Bond pad configurations for semiconductor dies Oct. 15, 2013
8551886 CMP process for processing STI on two distinct silicon planes Oct. 8, 2013
8546265 Method, apparatus and program for manufacturing silicon structure Oct. 1, 2013
8546244 Method of manufacturing semiconductor device Oct. 1, 2013
8546232 Method of manufacturing a semiconductor device having a laminated structure comprising a boron-doped silicon germanium film and a metal film Oct. 1, 2013
8541306 Semiconductor device and method of double photolithography process for forming patterns of the semiconductor device Sep. 24, 2013
8541792 Method of treating the surface of a soda lime silica glass substrate, surface-treated glass substrate, and device incorporating the same Sep. 24, 2013
8536025 Resized wafer with a negative photoresist ring and design structures thereof Sep. 17, 2013
8531007 Semiconductor device and the method for manufacturing the same Sep. 10, 2013
8530350 Apparatuses including stair-step structures and methods of forming the same Sep. 10, 2013
8530327 Nitride shallow trench isolation (STI) structures and methods for forming the same Sep. 10, 2013
8529315 Method for producing a semiconductor wafer Sep. 10, 2013
8528405 Flexure assemblies and methods for manufacturing and using the same Sep. 10, 2013
8524608 Method for fabricating a patterned structure of a semiconductor device Sep. 3, 2013
8525279 Single element three terminal piezoresistive pressure sensor Sep. 3, 2013
8501028 Method for grinding a semiconductor wafer Aug. 6, 2013
8497180 Transistor with boot shaped source/drain regions Jul. 30, 2013

1 2 3 4 5 6 7 8 9 10

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