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Class Information
Number: 257/E21.175
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Device having semiconductor body comprising group iv elements or group iii-v compounds with or without impurities, e.g., doping materials (epo) > Manufacture of electrode on semiconductor body using process other than by epitaxial growth, diffusion of impurities, alloying of impurity materials, or radiation bombardment (epo) > Deposition of conductive or insulating material for electrode conducting electric current (epo) > From a liquid, e.g., electrolytic deposition (epo) > Using an external electrical current, i.e., electro-deposition (epo)
Description: This subclass is indented under subclass E21.174. This subclass is substantially the same in scope as ECLA classification H01L21/288E.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7608538 |
Formation of vertical devices by electroplating |
Oct. 27, 2009 |
| 7595268 |
Semiconductor package having re-distribution lines for supplying power and a method for manufacturing the same |
Sep. 29, 2009 |
| 7586175 |
Semiconductor wafer having embedded electroplating current paths to provide uniform plating over wafer surface |
Sep. 8, 2009 |
| 7544614 |
Method of forming a coated film, method of forming an electronic device, and method of manufacturing an electron emission element |
Jun. 9, 2009 |
| 7541279 |
Method for manufacturing semiconductor device |
Jun. 2, 2009 |
| 7521361 |
Method for manufacturing wiring substrate |
Apr. 21, 2009 |
| 7485970 |
Semiconductor package substrate having contact pad protective layer formed thereon |
Feb. 3, 2009 |
| 7470619 |
Interconnect with high aspect ratio plugged vias |
Dec. 30, 2008 |
| 7465652 |
Method of forming a catalyst layer on the barrier layer of a conductive interconnect of a semiconductor device |
Dec. 16, 2008 |
| 7459373 |
Method for fabricating and separating semiconductor devices |
Dec. 2, 2008 |
| 7452739 |
Method of separating semiconductor dies |
Nov. 18, 2008 |
| 7417321 |
Via structure and process for forming the same |
Aug. 26, 2008 |
| 7393782 |
Process for producing layer structures for signal distribution |
Jul. 1, 2008 |
| 7385290 |
Electrochemical reaction cell for a combined barrier layer and seed layer |
Jun. 10, 2008 |
| 7317253 |
Cobalt tungsten phosphate used to fill voids arising in a copper metallization process |
Jan. 8, 2008 |
| 7238615 |
Formation method for metal element, production method for semiconductor device, production method for electronic device, semiconductor device, electronic device, and electronic equipment |
Jul. 3, 2007 |
| 7229853 |
Method of making a semiconductor chip assembly using multiple etch steps to form a pillar after forming a routing line |
Jun. 12, 2007 |
| 7229916 |
Method of manufacturing a semiconductor device |
Jun. 12, 2007 |
| 7195700 |
Method of electroplating copper layers with flat topography |
Mar. 27, 2007 |
| 7179741 |
Electroless plating method and semiconductor wafer on which metal plating layer is formed |
Feb. 20, 2007 |
| 7169705 |
Plating method and plating apparatus |
Jan. 30, 2007 |
| 7074721 |
Method for forming thick copper self-aligned dual damascene |
Jul. 11, 2006 |
| 7070687 |
Apparatus and method of surface treatment for electrolytic and electroless plating of metals in integrated circuit manufacturing |
Jul. 4, 2006 |
| 7064068 |
Method to improve planarity of electroplated copper |
Jun. 20, 2006 |
| 7064012 |
Method of making a semiconductor chip assembly with a pillar and a routing line using multiple etch steps |
Jun. 20, 2006 |
| 7060617 |
Method of protecting a seed layer for electroplating |
Jun. 13, 2006 |
| 7060618 |
Semiconductor device, method for manufacturing the same, and plating solution |
Jun. 13, 2006 |
| 7060624 |
Deep filled vias |
Jun. 13, 2006 |
| 7051934 |
Methods of forming metal layers in integrated circuit devices using selective deposition on edges of recesses |
May. 30, 2006 |
| 7048841 |
Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces |
May. 23, 2006 |
| 7049693 |
Electrical contact array for substrate assemblies |
May. 23, 2006 |
| 7041595 |
Method of forming a barrier seed layer with graded nitrogen composition |
May. 9, 2006 |
| 7033464 |
Apparatus for electrochemically depositing a material onto a workpiece surface |
Apr. 25, 2006 |
| 7033463 |
Substrate plating method and apparatus |
Apr. 25, 2006 |
| 7026242 |
Method for filling a hole with a metal |
Apr. 11, 2006 |
| 7025862 |
Plating uniformity control by contact ring shaping |
Apr. 11, 2006 |
| 7025861 |
Contact plating apparatus |
Apr. 11, 2006 |
| 7025860 |
Method and apparatus for the electrochemical deposition and removal of a material on a workpiece surface |
Apr. 11, 2006 |
| 7026239 |
Method for making an anisotropic conductive polymer film on a semiconductor wafer |
Apr. 11, 2006 |
| 7011981 |
Method for forming thin film and method for fabricating liquid crystal display using the same |
Mar. 14, 2006 |
| 7012333 |
Lead free bump and method of forming the same |
Mar. 14, 2006 |
| 7008871 |
Selective capping of copper wiring |
Mar. 7, 2006 |
| 7001492 |
Systems for electroplating metal onto a layer of low conductivity material |
Feb. 21, 2006 |
| 7001471 |
Method and apparatus for low-temperature annealing of metallization microstructures in the production of a microelectronic device |
Feb. 21, 2006 |
| 6998339 |
Method of forming conductor wiring pattern |
Feb. 14, 2006 |
| 6991711 |
Cup type plating apparatus |
Jan. 31, 2006 |
| 6989328 |
Method of manufacturing semiconductor device having damascene interconnection |
Jan. 24, 2006 |
| 6989084 |
Semiconductor wafer plating cell assembly |
Jan. 24, 2006 |
| 6984301 |
Methods of forming capacitor constructions |
Jan. 10, 2006 |
| 6984302 |
Electroplating cell based upon rotational plating solution flow |
Jan. 10, 2006 |
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