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Class Information
Number: 257/E21.175
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Device having semiconductor body comprising group iv elements or group iii-v compounds with or without impurities, e.g., doping materials (epo) > Manufacture of electrode on semiconductor body using process other than by epitaxial growth, diffusion of impurities, alloying of impurity materials, or radiation bombardment (epo) > Deposition of conductive or insulating material for electrode conducting electric current (epo) > From a liquid, e.g., electrolytic deposition (epo) > Using an external electrical current, i.e., electro-deposition (epo)
Description: This subclass is indented under subclass E21.174. This subclass is substantially the same in scope as ECLA classification H01L21/288E.

Patents under this class:
1 2 3 4 5 6 7 8 9 10 11

Patent Number Title Of Patent Date Issued
8691597 Method for manufacturing a semiconductor device including application of a plating voltage Apr. 8, 2014
8680682 Barrier for through-silicon via Mar. 25, 2014
8546275 Atomic layer deposition of hafnium and zirconium oxides for memory applications Oct. 1, 2013
8518826 Metallization processes, mixtures, and electronic devices Aug. 27, 2013
8513750 Forming inductor and transformer structures with magnetic materials using damascene processing for integrated circuits Aug. 20, 2013
8492216 Semiconductor structure with contact structure and manufacturing method of the same Jul. 23, 2013
8344513 Barrier for through-silicon via Jan. 1, 2013
8318534 Non-volatile resistive-switching memories formed using anodization Nov. 27, 2012
8298936 Multistep method of depositing metal seed layers Oct. 30, 2012
8288297 Atomic layer deposition of metal oxide materials for memory applications Oct. 16, 2012
8247905 Formation of vertical devices by electroplating Aug. 21, 2012
8129745 Method of manufacturing an instant pulse filter using anodic oxidation and instant pulse filter manufactured by said method Mar. 6, 2012
8076241 Methods for multi-step copper plating on a continuous ruthenium film in recessed features Dec. 13, 2011
8076786 Semiconductor package and method for packaging a semiconductor package Dec. 13, 2011
7977152 Non-volatile resistive-switching memories formed using anodization Jul. 12, 2011
7968379 Method of separating semiconductor dies Jun. 28, 2011
7815786 Copper electrodeposition in microelectronics Oct. 19, 2010
7807572 Micropad formation for a semiconductor Oct. 5, 2010
RE41538 Method for making integrated circuit including interconnects with enhanced electromigration resistance using doped seed layer and integrated circuits produced thereby Aug. 17, 2010
7736928 Precision printing electroplating through plating mask on a solar cell substrate Jun. 15, 2010
7732926 Semiconductor device having a through electrode with a low resistance and method of manufacturing the same Jun. 8, 2010
7718522 Method and apparatus for plating a semiconductor package May. 18, 2010
7682966 Multistep method of depositing metal seed layers Mar. 23, 2010
7642156 Three-dimensional flash memory cell Jan. 5, 2010
7638431 Composite nanostructure apparatus and method Dec. 29, 2009
7633161 Semiconductor device and method of forming metal interconnection layer thereof Dec. 15, 2009
7625815 Reduced leakage interconnect structure Dec. 1, 2009
7608538 Formation of vertical devices by electroplating Oct. 27, 2009
7595268 Semiconductor package having re-distribution lines for supplying power and a method for manufacturing the same Sep. 29, 2009
7586175 Semiconductor wafer having embedded electroplating current paths to provide uniform plating over wafer surface Sep. 8, 2009
7544614 Method of forming a coated film, method of forming an electronic device, and method of manufacturing an electron emission element Jun. 9, 2009
7541279 Method for manufacturing semiconductor device Jun. 2, 2009
7521361 Method for manufacturing wiring substrate Apr. 21, 2009
7485970 Semiconductor package substrate having contact pad protective layer formed thereon Feb. 3, 2009
7470619 Interconnect with high aspect ratio plugged vias Dec. 30, 2008
7465652 Method of forming a catalyst layer on the barrier layer of a conductive interconnect of a semiconductor device Dec. 16, 2008
7459373 Method for fabricating and separating semiconductor devices Dec. 2, 2008
7452739 Method of separating semiconductor dies Nov. 18, 2008
7417321 Via structure and process for forming the same Aug. 26, 2008
7393782 Process for producing layer structures for signal distribution Jul. 1, 2008
7385290 Electrochemical reaction cell for a combined barrier layer and seed layer Jun. 10, 2008
7317253 Cobalt tungsten phosphate used to fill voids arising in a copper metallization process Jan. 8, 2008
7238615 Formation method for metal element, production method for semiconductor device, production method for electronic device, semiconductor device, electronic device, and electronic equipment Jul. 3, 2007
7229853 Method of making a semiconductor chip assembly using multiple etch steps to form a pillar after forming a routing line Jun. 12, 2007
7229916 Method of manufacturing a semiconductor device Jun. 12, 2007
7195700 Method of electroplating copper layers with flat topography Mar. 27, 2007
7179741 Electroless plating method and semiconductor wafer on which metal plating layer is formed Feb. 20, 2007
7169705 Plating method and plating apparatus Jan. 30, 2007
7074721 Method for forming thick copper self-aligned dual damascene Jul. 11, 2006
7070687 Apparatus and method of surface treatment for electrolytic and electroless plating of metals in integrated circuit manufacturing Jul. 4, 2006

1 2 3 4 5 6 7 8 9 10 11

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