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Class Information
Number: 257/E21.169
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Device having semiconductor body comprising group iv elements or group iii-v compounds with or without impurities, e.g., doping materials (epo) > Manufacture of electrode on semiconductor body using process other than by epitaxial growth, diffusion of impurities, alloying of impurity materials, or radiation bombardment (epo) > Deposition of conductive or insulating material for electrode conducting electric current (epo) > From a gas or vapor, e.g., condensation (epo) > Of conductive layer (epo) > On semiconductor body comprising group iv element (epo) > By physical means, e.g., sputtering, evaporation (epo)
Description: This subclass is indented under subclass E21.162. This subclass is substantially the same in scope as ECLA classification H01L21/285B4F.










Patents under this class:
1 2 3 4 5 6 7 8

Patent Number Title Of Patent Date Issued
8586471 Seed layers for metallic interconnects and products Nov. 19, 2013
8501559 Semiconductor cells, arrays, devices and systems having a buried conductive line and methods for forming the same Aug. 6, 2013
8486737 Thin film deposition apparatus and method of manufacturing organic light-emitting display device by using the same Jul. 16, 2013
8466557 Solder bump confinement system for an integrated circuit package Jun. 18, 2013
8338249 Semiconductor device and method for manufacturing the same having improved polarization reversal characteristic Dec. 25, 2012
8298936 Multistep method of depositing metal seed layers Oct. 30, 2012
8278212 Method for manufacturing semiconductor memory element and sputtering apparatus Oct. 2, 2012
8216933 Krypton sputtering of low resistivity tungsten Jul. 10, 2012
8198104 Method of manufacturing a semiconductor device Jun. 12, 2012
8158511 Method of depositing a uniform barrier layer and metal seed layer with reduced overhang over a plurality of recessed semiconductor features Apr. 17, 2012
8053364 Closed-loop sputtering controlled to enhance electrical characteristics in deposited layer Nov. 8, 2011
8039394 Methods of forming layers of alpha-tantalum Oct. 18, 2011
8030725 Apparatus and methods for detecting evaporation conditions Oct. 4, 2011
8022448 Apparatus and methods for evaporation including test wafer holder Sep. 20, 2011
8012789 Nonvolatile memory device and method of manufacturing the same Sep. 6, 2011
8008198 Large scale method and furnace system for selenization of thin film photovoltaic materials Aug. 30, 2011
7943506 Semiconductor device and production method therefor May. 17, 2011
7928573 Metal thin film for interconnection of semiconductor device Apr. 19, 2011
7928575 Electronic device, method of manufacture of the same, and sputtering target Apr. 19, 2011
7915157 Chip structure and process for forming the same Mar. 29, 2011
7906433 Semiconductor device having wirings formed by damascene and its manufacture method Mar. 15, 2011
7884032 Thin film deposition Feb. 8, 2011
7855147 Methods and apparatus for engineering an interface between a diffusion barrier layer and a seed layer Dec. 21, 2010
7846824 Methods for forming a titanium nitride layer Dec. 7, 2010
7816191 Wiring material, semiconductor device provided with a wiring using the wiring material and method of manufacturing thereof Oct. 19, 2010
7807568 Methods for reducing damage to substrate layers in deposition processes Oct. 5, 2010
7745332 PVD-based metallization methods for fabrication of interconnections in semiconductor devices Jun. 29, 2010
7727890 High aspect ratio electroplated metal feature and method Jun. 1, 2010
7728431 Electronic component, semiconductor device employing same, and method for manufacturing electronic component Jun. 1, 2010
7723225 Solder bump confinement system for an integrated circuit package May. 25, 2010
7700484 Method and apparatus for a metallic dry-filling process Apr. 20, 2010
7700474 Barrier deposition using ionized physical vapor deposition (iPVD) Apr. 20, 2010
7696520 Organic thin film transistor, method of manufacturing the same, and organic light emitting display device having the same Apr. 13, 2010
7682966 Multistep method of depositing metal seed layers Mar. 23, 2010
7682969 Method of fabricating semiconductor device Mar. 23, 2010
7666781 Interconnect structures with improved electromigration resistance and methods for forming such interconnect structures Feb. 23, 2010
7659204 Oxidized barrier layer Feb. 9, 2010
7645696 Deposition of thin continuous PVD seed layers having improved adhesion to the barrier layer Jan. 12, 2010
7645698 Method for forming barrier layer Jan. 12, 2010
7611990 Deposition methods for barrier and tungsten materials Nov. 3, 2009
7585762 Vapor deposition processes for tantalum carbide nitride materials Sep. 8, 2009
7576002 Multi-step barrier deposition method Aug. 18, 2009
7572658 Method of manufacturing display panel for flexible display device Aug. 11, 2009
7553763 Salicide process utilizing a cluster ion implantation process Jun. 30, 2009
7381657 Biased pulse DC reactive sputtering of oxide films Jun. 3, 2008
7375024 Method for fabricating metal interconnection line with use of barrier metal layer formed in low temperature May. 20, 2008
7256121 Contact resistance reduction by new barrier stack process Aug. 14, 2007
7214619 Method for forming a barrier layer in an integrated circuit in a plasma with source and bias power frequencies applied through the workpiece May. 8, 2007
7071563 Barrier layer for interconnect structures of a semiconductor wafer and method for depositing the barrier layer Jul. 4, 2006
7071096 Method of forming a conductive barrier layer within critical openings by a final deposition step after a re-sputter deposition Jul. 4, 2006

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