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Class Information
Number: 257/E21.166
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Device having semiconductor body comprising group iv elements or group iii-v compounds with or without impurities, e.g., doping materials (epo) > Manufacture of electrode on semiconductor body using process other than by epitaxial growth, diffusion of impurities, alloying of impurity materials, or radiation bombardment (epo) > Deposition of conductive or insulating material for electrode conducting electric current (epo) > From a gas or vapor, e.g., condensation (epo) > Of conductive layer (epo) > On semiconductor body comprising group iv element (epo) > Conductive layer comprising semiconducting material (epo)
Description: This subclass is indented under subclass E21.162. This subclass is substantially the same in scope as ECLA classification H01L21/285B4B.

Sub-classes under this class:

Class Number Class Name Patents
257/E21.167 Making of side-wall contact (epo) 16

Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14

Patent Number Title Of Patent Date Issued
8597978 Method for attaching wide bus memory and serial memory to a processor within a chip scale package footprint Dec. 3, 2013
8551889 Manufacture method for photovoltaic module Oct. 8, 2013
8524564 Full silicidation prevention via dual nickel deposition approach Sep. 3, 2013
8405185 Semiconductor device and semiconductor module including the same Mar. 26, 2013
8361821 Pixel designs of improving the aperture ratio in an LCD Jan. 29, 2013
8324099 Method of fabricating a landing plug in a semiconductor device Dec. 4, 2012
8288849 Method for attaching wide bus memory and serial memory to a processor within a chip scale package footprint Oct. 16, 2012
8232137 Heat conduction for chip stacks and 3-D circuits Jul. 31, 2012
8187982 Manufacture method for photovoltaic module May. 29, 2012
8110501 Method of fabricating landing plug with varied doping concentration in semiconductor device Feb. 7, 2012
7838983 Packaged semiconductor device and method of manufacturing the packaged semiconductor device Nov. 23, 2010
7790588 Dual gate of semiconductor device capable of forming a layer doped in high concentration over a recessed portion of substrate for forming dual gate with recess channel structure and method for Sep. 7, 2010
7700431 Method for manufacturing a semiconductor device having polysilicon plugs Apr. 20, 2010
7666781 Interconnect structures with improved electromigration resistance and methods for forming such interconnect structures Feb. 23, 2010
7659199 Air break for improved silicide formation with composite caps Feb. 9, 2010
7541207 Light emitting device and method of manufacturing the same Jun. 2, 2009
7537976 Manufacturing method of thin film transistor May. 26, 2009
7517772 Selective etch for patterning a semiconductor film deposited non-selectively Apr. 14, 2009
7514374 Method for manufacturing flat substrates Apr. 7, 2009
7479688 STI stress modification by nitrogen plasma treatment for improving performance in small width devices Jan. 20, 2009
7417290 Air break for improved silicide formation with composite caps Aug. 26, 2008
7381612 Method for manufacturing semiconductor device with recess channels and asymmetrical junctions Jun. 3, 2008
7374977 Droplet discharge device, and method for forming pattern, and method for manufacturing display device May. 20, 2008
7361597 Semiconductor device and method of fabricating the same Apr. 22, 2008
7319068 Method of depositing low k barrier layers Jan. 15, 2008
7314792 Method for fabricating transistor of semiconductor device Jan. 1, 2008
7307018 Method of fabricating conductive lines Dec. 11, 2007
7226854 Methods of forming metal lines in semiconductor devices Jun. 5, 2007
7205208 Method of manufacturing a semiconductor device Apr. 17, 2007
7199043 Method of forming copper wiring in semiconductor device Apr. 3, 2007
7148143 Semiconductor device having a fully silicided gate electrode and method of manufacture therefor Dec. 12, 2006
7119030 Process for lining a surface using an organic film Oct. 10, 2006
7112512 Method of manufacturing liquid crystal display Sep. 26, 2006
7109115 Methods of providing ohmic contact Sep. 19, 2006
7074684 Elevated source drain disposable spacer CMOS Jul. 11, 2006
7049230 Method of forming a contact plug in a semiconductor device May. 23, 2006
7049231 Methods of forming capacitors May. 23, 2006
7037775 Applying epitaxial silicon in disposable spacer flow May. 2, 2006
7009257 Methods of manufacturing integrated circuit devices having reduced contact resistance between a substrate and a contact pad while maintaining separation of the substrate and the contact pad an Mar. 7, 2006
6979611 Method for fabricating semiconductor device Dec. 27, 2005
6958253 Process for deposition of semiconductor films Oct. 25, 2005
6953741 Methods of fabricating contacts for semiconductor devices utilizing a pre-flow process Oct. 11, 2005
6933228 Method of manufacturing of contact plug in a contact hole on a silicon substrate Aug. 23, 2005
6914309 Semiconductor device with double sidewall spacer and layered contact Jul. 5, 2005
6908853 Method of fabricating a semiconductor device having reduced contact resistance Jun. 21, 2005
6900143 Strained silicon MOSFETs having improved thermal dissipation May. 31, 2005
6900115 Deposition over mixed substrates May. 31, 2005
6900130 Method for locally heating a region in a semiconductor substrate May. 31, 2005
6890826 Method of making bipolar transistor with integrated base contact and field plate May. 10, 2005
6891244 Plug structure having low contact resistance and method of manufacturing May. 10, 2005

1 2 3 4 5 6 7 8 9 10 11 12 13 14

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