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Class Information
Number: 257/E21.161
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Device having semiconductor body comprising group iv elements or group iii-v compounds with or without impurities, e.g., doping materials (epo) > Manufacture of electrode on semiconductor body using process other than by epitaxial growth, diffusion of impurities, alloying of impurity materials, or radiation bombardment (epo) > Deposition of conductive or insulating material for electrode conducting electric current (epo) > From a gas or vapor, e.g., condensation (epo) > Of conductive layer (epo)
Description: This subclass is indented under subclass E21.16. This subclass is substantially the same in scope as ECLA classification H01L21/285B.










Sub-classes under this class:

Class Number Class Name Patents
257/E21.172 On semiconductor body comprising group iii-v compound (epo) 255
257/E21.162 On semiconductor body comprising group iv element (epo) 307


Patents under this class:

Patent Number Title Of Patent Date Issued
8685850 System and method of plating conductive gate contacts on metal gates for self-aligned contact interconnections Apr. 1, 2014
8597978 Method for attaching wide bus memory and serial memory to a processor within a chip scale package footprint Dec. 3, 2013
8592307 Modulated deposition process for stress control in thick TiN films Nov. 26, 2013
8288274 Method of forming noble metal layer using ozone reaction gas Oct. 16, 2012
8288849 Method for attaching wide bus memory and serial memory to a processor within a chip scale package footprint Oct. 16, 2012
8133811 Semiconductor device manufacturing method, semiconductor device manufacturing apparatus, computer program and storage medium Mar. 13, 2012
8062956 Semiconductor on insulator and methods of forming same using temperature gradient in an anodic bonding process Nov. 22, 2011
8022448 Apparatus and methods for evaporation including test wafer holder Sep. 20, 2011
7927996 Tungsten-doped indium oxide structures and methods Apr. 19, 2011
7859059 Semiconductor device and method for manufacturing same Dec. 28, 2010
7855147 Methods and apparatus for engineering an interface between a diffusion barrier layer and a seed layer Dec. 21, 2010
7745332 PVD-based metallization methods for fabrication of interconnections in semiconductor devices Jun. 29, 2010
7713868 Strained metal nitride films and method of forming May. 11, 2010
7622375 Conductive member and process of producing the same Nov. 24, 2009
7611920 Photonic coupling scheme for photodetectors Nov. 3, 2009
7566657 Methods of forming through-substrate interconnects Jul. 28, 2009
7531452 Strained metal silicon nitride films and method of forming May. 12, 2009
7479464 Low temperature aerosol deposition of a plasma resistive layer Jan. 20, 2009
7452827 Gas distribution showerhead featuring exhaust apertures Nov. 18, 2008
7410893 System and method for depositing a seed layer Aug. 12, 2008
7338901 Method of preparing a film layer-by-layer using plasma enhanced atomic layer deposition Mar. 4, 2008
7335590 Method of fabricating semiconductor device by forming diffusion barrier layer selectively and semiconductor device fabricated thereby Feb. 26, 2008
7323783 Electrode, method for producing same and semiconductor device using same Jan. 29, 2008
7314835 Plasma enhanced atomic layer deposition system and method Jan. 1, 2008
7300815 Method for fabricating a gold contact on a microswitch Nov. 27, 2007
7288835 Integrated circuit package-in-package system Oct. 30, 2007
7256121 Contact resistance reduction by new barrier stack process Aug. 14, 2007
7214618 Technique for high efficiency metalorganic chemical vapor deposition May. 8, 2007
6613656 Sequential pulse deposition Sep. 2, 2003
6458698 Controlled-stress stable metallization for electronic and electromechanical devices Oct. 1, 2002
6291345 Controlled-stress stable metallization for electronic and electromechanical devices Sep. 18, 2001
5770026 Semiconductor fabrication apparatus having improved sputtering collimator and wiring method for a semiconductor device using such apparatus Jun. 23, 1998
5221856 Bipolar transistor with floating guard region under extrinsic base Jun. 22, 1993











 
 
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