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Class Information
Number: 257/E21.159
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Device having semiconductor body comprising group iv elements or group iii-v compounds with or without impurities, e.g., doping materials (epo) > Manufacture of electrode on semiconductor body using process other than by epitaxial growth, diffusion of impurities, alloying of impurity materials, or radiation bombardment (epo) > Deposition of conductive or insulating material for electrode conducting electric current (epo)
Description: This subclass is indented under subclass E21.158. This subclass is substantially the same in scope as ECLA classification H01L21/283.










Sub-classes under this class:

Class Number Class Name Patents
257/E21.16 From a gas or vapor, e.g., condensation (epo) 43
257/E21.174 From a liquid, e.g., electrolytic deposition (epo) 463


Patents under this class:
1 2 3 4

Patent Number Title Of Patent Date Issued
8703612 Process for forming contact plugs Apr. 22, 2014
8692284 Interposer and manufacturing method thereof Apr. 8, 2014
8679969 System for self-aligned contacts Mar. 25, 2014
8664103 Metal gate stack formation for replacement gate technology Mar. 4, 2014
8652965 Production method for thick film metal electrode and production method for thick film resist Feb. 18, 2014
8637941 Self-aligned contact employing a dielectric metal oxide spacer Jan. 28, 2014
8623756 Reflow system and method for conductive connections Jan. 7, 2014
8617988 Through-substrate vias Dec. 31, 2013
8618658 Semiconductor device and fabricating method thereof Dec. 31, 2013
8609535 Semiconductor package having through electrodes that reduce leakage current and method for manufacturing the same Dec. 17, 2013
8598018 Forming an electrode having reduced corrosion and water decomposition on surface using a custom oxide layer Dec. 3, 2013
8586462 Method of manufacturing a field-effect transistor Nov. 19, 2013
8587120 Semiconductor device and method of forming interconnect structure over seed layer on contact pad of semiconductor die without undercutting seed layer beneath interconnect structure Nov. 19, 2013
8581337 Semiconductor device for increasing bit line contact area, and module and system including the same Nov. 12, 2013
8575000 Copper interconnects separated by air gaps and method of making thereof Nov. 5, 2013
8564030 Self-aligned trench contact and local interconnect with replacement gate process Oct. 22, 2013
8558299 Semiconductor device with gate electrode stack including low resistivity tungsten and method of forming Oct. 15, 2013
8558396 Bond pad configurations for semiconductor dies Oct. 15, 2013
8552565 Chip package and method for forming the same Oct. 8, 2013
8546256 Method of forming semiconductor device Oct. 1, 2013
8546275 Atomic layer deposition of hafnium and zirconium oxides for memory applications Oct. 1, 2013
8546892 Semiconductor device and method for manufacturing semiconductor device Oct. 1, 2013
8541882 Stacked IC device with recessed conductive layers adjacent to interlevel conductors Sep. 24, 2013
8524600 Post deposition treatments for CVD cobalt films Sep. 3, 2013
8518813 Semiconductor device and method of manufacturing semiconductor device Aug. 27, 2013
8513754 Solar cell, method of forming emitter layer of solar cell, and method of manufacturing solar cell Aug. 20, 2013
8501618 Semiconductor device and method of forming RDL wider than contact pad along first axis and narrower than contact pad along second axis Aug. 6, 2013
8497420 Thick-film pastes containing lead- and tellurium-oxides, and their use in the manufacture of semiconductor devices Jul. 30, 2013
8492223 Methods of manufacturing flash memory devices by selective removal of nitrogen atoms Jul. 23, 2013
8486830 Via forming method and method of manufacturing multi-chip package using the same Jul. 16, 2013
8486826 Process of forming a grid electrode on the front-side of a silicon wafer Jul. 16, 2013
8481389 Method of removing high-K dielectric layer on sidewalls of gate structure Jul. 9, 2013
8481998 Display device and method for manufacturing the same Jul. 9, 2013
8476126 Gate stack for high-K/metal gate last process Jul. 2, 2013
8470695 Method of manufacturing micromachine having spatial portion within Jun. 25, 2013
8455330 Devices with gate-to-gate isolation structures and methods of manufacture Jun. 4, 2013
8450217 Method for making holes using a fluid jet May. 28, 2013
8450208 Semiconductor device manufacturing method May. 28, 2013
8445312 Method of manufacturing crystalline silicon solar cells using co diffusion of Boron and Phosphorus May. 21, 2013
8440578 GCIB process for reducing interfacial roughness following pre-amorphization May. 14, 2013
8415714 Programmable nanotube interconnect Apr. 9, 2013
8415780 Package carrier and manufacturing method thereof Apr. 9, 2013
8410600 Semiconductor device with protecting film and method of fabricating the semiconductor device with protecting film Apr. 2, 2013
8404560 Devices with gate-to-gate isolation structures and methods of manufacture Mar. 26, 2013
8404574 Method for manufacturing silicon carbide semiconductor device Mar. 26, 2013
8405091 Display device and method of manufacturing the same Mar. 26, 2013
8399317 Transistor having an etch stop layer including a metal compound that is selectively formed over a metal gate, and method therefor Mar. 19, 2013
8399320 Electronic apparatus containing lanthanide yttrium aluminum oxide Mar. 19, 2013
8389324 Method of manufacturing solar cell electrode and conductive paste Mar. 5, 2013
8383512 Method for making multilayer connection structure Feb. 26, 2013

1 2 3 4










 
 
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