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Class Information
Number: 257/E21.122
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Device having semiconductor body comprising group iv elements or group iii-v compounds with or without impurities, e.g., doping materials (epo) > Deposition of semiconductor material on substrate, e.g., epitaxial growth, solid phase epitaxy (epo) > Characterized by the substrate (epo) > Bonding of semiconductor wafer to insulating substrate or to semic onducting substrate using an intermediate insulating layer (epo)
Description: This subclass is indented under subclass E21.119. This subclass is substantially the same in scope as ECLA classification H01L21/20B2.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6004406 |
Silicon on insulating substrate |
Dec. 21, 1999 |
| 6004860 |
SOI substrate and a method for fabricating the same |
Dec. 21, 1999 |
| 5998840 |
Semiconductor-on-insulator field effect transistors with reduced floating body parasitics |
Dec. 7, 1999 |
| 5998281 |
SOI wafer and method for the preparation thereof |
Dec. 7, 1999 |
| 5994204 |
Silicon-glass bonded wafers |
Nov. 30, 1999 |
| 5985739 |
Semiconductor structures having advantageous high-frequency characteristics and processes for producing such semiconductor structures |
Nov. 16, 1999 |
| 5985728 |
Silicon on insulator process with recovery of a device layer from an etch stop layer |
Nov. 16, 1999 |
| 5953622 |
Method for fabricating semiconductor wafers |
Sep. 14, 1999 |
| 5949144 |
Pre-bond cavity air bridge |
Sep. 7, 1999 |
| 5918139 |
Method of manufacturing a bonding substrate |
Jun. 29, 1999 |
| 5911257 |
Device for removing objects adhered to a plate for bonding a semiconductor wafer |
Jun. 15, 1999 |
| 5906951 |
Strained Si/SiGe layers on insulator |
May. 25, 1999 |
| 5897362 |
Bonding silicon wafers |
Apr. 27, 1999 |
| 5872388 |
Semiconductor device and method for fabricating the same |
Feb. 16, 1999 |
| 5869386 |
Method of fabricating a composite silicon-on-insulator substrate |
Feb. 9, 1999 |
| 5863829 |
Process for fabricating SOI substrate |
Jan. 26, 1999 |
| 5855693 |
Wafer of semiconductor material for fabricating integrated devices, and process for its fabrication |
Jan. 5, 1999 |
| 5849627 |
Bonded wafer processing with oxidative bonding |
Dec. 15, 1998 |
| 5843832 |
Method of formation of thin bonded ultra-thin wafers |
Dec. 1, 1998 |
| 5841197 |
Inverted dielectric isolation process |
Nov. 24, 1998 |
| 5841182 |
Capacitor structure in a bonded wafer and method of fabrication |
Nov. 24, 1998 |
| 5840616 |
Method for preparing semiconductor member |
Nov. 24, 1998 |
| 5831309 |
Semiconductor element for an electronic or opto-electronic semiconductor component |
Nov. 3, 1998 |
| 5820648 |
Anodic bonding process |
Oct. 13, 1998 |
| 5810994 |
Method for fabricating silicon-on-insulator device wafer |
Sep. 22, 1998 |
| 5804494 |
Method of fabricating bonded wafer |
Sep. 8, 1998 |
| 5801084 |
Bonded wafer processing |
Sep. 1, 1998 |
| 5780311 |
bonded wafer processing |
Jul. 14, 1998 |
| 5770511 |
Silicon-on-insulator substrate and a method for fabricating the same |
Jun. 23, 1998 |
| 5769991 |
Method and apparatus for wafer bonding |
Jun. 23, 1998 |
| 5763288 |
Method for producing semiconductor substrate by wafer bonding |
Jun. 9, 1998 |
| 5760443 |
Silicon on insulator with active buried regions |
Jun. 2, 1998 |
| 5755914 |
Method for bonding semiconductor substrates |
May. 26, 1998 |
| 5744852 |
Bonded wafer |
Apr. 28, 1998 |
| 5728624 |
Bonded wafer processing |
Mar. 17, 1998 |
| 5726089 |
Semiconductor device and method for fabricating the same |
Mar. 10, 1998 |
| 5709715 |
Silicon or silica substrate with a modified surface, process for producing the same, new orthoesters and process for producing the same |
Jan. 20, 1998 |
| 5691231 |
Method of manufacturing silicon on insulating substrate |
Nov. 25, 1997 |
| 5683594 |
Method for making diaphragm-based sensors and apparatus constructed therewith |
Nov. 4, 1997 |
| 5676752 |
Method of producing sheets of crystalline material and devices made therefrom |
Oct. 14, 1997 |
| 5672240 |
Methods for forming smooth diamond-based mesa structures |
Sep. 30, 1997 |
| 5665631 |
SOI substrate manufacturing method |
Sep. 9, 1997 |
| 5663078 |
Method for fabricating transistors using crystalline silicon devices on glass |
Sep. 2, 1997 |
| 5661082 |
Process for forming a semiconductor device having a bond pad |
Aug. 26, 1997 |
| 5659192 |
SOI substrate fabrication |
Aug. 19, 1997 |
| 5654226 |
Wafer bonding for power devices |
Aug. 5, 1997 |
| 5652436 |
Smooth diamond based mesa structures |
Jul. 29, 1997 |
| 5650042 |
Method for thinning a semiconductor film on an insulating film |
Jul. 22, 1997 |
| 5650353 |
Method for production of SOI substrate |
Jul. 22, 1997 |
| 5646432 |
Semiconductor thin film formed on a supporting substrate |
Jul. 8, 1997 |
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