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Class Information
Number: 257/E21.122
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Device having semiconductor body comprising group iv elements or group iii-v compounds with or without impurities, e.g., doping materials (epo) > Deposition of semiconductor material on substrate, e.g., epitaxial growth, solid phase epitaxy (epo) > Characterized by the substrate (epo) > Bonding of semiconductor wafer to insulating substrate or to semic onducting substrate using an intermediate insulating layer (epo)
Description: This subclass is indented under subclass E21.119. This subclass is substantially the same in scope as ECLA classification H01L21/20B2.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6607931 |
Method of producing an optically transparent substrate and method of producing a light-emitting semiconductor chip |
Aug. 19, 2003 |
| 6596569 |
Thin film transistors |
Jul. 22, 2003 |
| 6576334 |
Bonding materials |
Jun. 10, 2003 |
| 6569748 |
Substrate and production method thereof |
May. 27, 2003 |
| 6562648 |
Structure and method for separation and transfer of semiconductor thin films onto dissimilar substrate materials |
May. 13, 2003 |
| 6555408 |
Methods for transferring elements from a template to a substrate |
Apr. 29, 2003 |
| 6552408 |
Methods, apparatuses, and substrate assembly structures for fabricating microelectronic components using mechanical and chemical-mechanical planarization processes |
Apr. 22, 2003 |
| 6548382 |
Gettering technique for wafers made using a controlled cleaving process |
Apr. 15, 2003 |
| 6548375 |
Method of preparing silicon-on-insulator substrates particularly suited for microwave applications |
Apr. 15, 2003 |
| 6540827 |
Slicing of single-crystal films using ion implantation |
Apr. 1, 2003 |
| 6537892 |
Glass frit wafer bonding process and packages formed thereby |
Mar. 25, 2003 |
| 6537846 |
Substrate bonding using a selenidation reaction |
Mar. 25, 2003 |
| 6534382 |
Process for producing semiconductor article |
Mar. 18, 2003 |
| 6534385 |
Method of fusion for heteroepitaxial layers and overgrowth thereon |
Mar. 18, 2003 |
| 6534384 |
Method for manufacturing SOI wafer including heat treatment in an oxidizing atmosphere |
Mar. 18, 2003 |
| 6534383 |
Thin film formation process by clearing the implanted layer with laser radiation |
Mar. 18, 2003 |
| 6528387 |
SOI substrate and process for preparing the same, and semiconductor device and process for preparing the same |
Mar. 4, 2003 |
| 6521511 |
Thin film device transfer method, thin film device, thin film integrated circuit device, active matrix board, liquid crystal display, and electronic apparatus |
Feb. 18, 2003 |
| 6503321 |
Slicing of single-crystal films using ion implantation |
Jan. 7, 2003 |
| 6503847 |
Room temperature wafer-to-wafer bonding by polydimethylsiloxane |
Jan. 7, 2003 |
| 6497763 |
Electronic device with composite substrate |
Dec. 24, 2002 |
| 6495928 |
Transfer mark structure for multi-layer interconnecting and method for the manufacture thereof |
Dec. 17, 2002 |
| 6475926 |
Substrate for high frequency integrated circuits |
Nov. 5, 2002 |
| 6476462 |
MOS-type semiconductor device and method for making same |
Nov. 5, 2002 |
| 6472289 |
Dielectrically separated wafer and method of manufacturing the same |
Oct. 29, 2002 |
| 6465327 |
Method for producing a thin membrane and resulting structure with membrane |
Oct. 15, 2002 |
| 6451670 |
Substrate processing apparatus, substrate support apparatus, substrate processing method, and substrate fabrication method |
Sep. 17, 2002 |
| 6448102 |
Method for nitride based laser diode with growth substrate removed |
Sep. 10, 2002 |
| 6429095 |
Semiconductor article and method of manufacturing the same |
Aug. 6, 2002 |
| 6428620 |
Substrate processing method and apparatus and SOI substrate |
Aug. 6, 2002 |
| 6420242 |
Separation of thin films from transparent substrates by selective optical processing |
Jul. 16, 2002 |
| 6417075 |
Method for producing thin substrate layers |
Jul. 9, 2002 |
| 6417108 |
Semiconductor substrate and method of manufacturing the same |
Jul. 9, 2002 |
| 6413874 |
Method and apparatus for etching a semiconductor article and method of preparing a semiconductor article by using the same |
Jul. 2, 2002 |
| 6406636 |
Methods for wafer to wafer bonding using microstructures |
Jun. 18, 2002 |
| 6407367 |
Heat treatment apparatus, heat treatment process employing the same, and process for producing semiconductor article |
Jun. 18, 2002 |
| 6387736 |
Method and structure for bonding layers in a semiconductor device |
May. 14, 2002 |
| 6387829 |
Separation process for silicon-on-insulator wafer fabrication |
May. 14, 2002 |
| 6388290 |
Single crystal silicon on polycrystalline silicon integrated circuits |
May. 14, 2002 |
| 6380099 |
Porous region removing method and semiconductor substrate manufacturing method |
Apr. 30, 2002 |
| 6372600 |
Etch stops and alignment marks for bonded wafers |
Apr. 16, 2002 |
| 6365429 |
Method for nitride based laser diode with growth substrate removed using an intermediate substrate |
Apr. 2, 2002 |
| 6362075 |
Method for making a diffused back-side layer on a bonded-wafer with a thick bond oxide |
Mar. 26, 2002 |
| 6362069 |
Long-wavelength VCSELs and method of manufacturing same |
Mar. 26, 2002 |
| 6346461 |
Electroless epitaxial etching for semiconductor applications |
Feb. 12, 2002 |
| 6344662 |
Thin-film field-effect transistor with organic-inorganic hybrid semiconductor requiring low operating voltages |
Feb. 5, 2002 |
| 6337030 |
Wafer processing apparatus, wafer processing method, and SOI wafer fabrication method |
Jan. 8, 2002 |
| 6329265 |
Method of making a semiconductor device using processing from both sides of a workpiece |
Dec. 11, 2001 |
| 6328841 |
Process for joining inorganic substrates in a permanent manner |
Dec. 11, 2001 |
| 6316332 |
Method for joining wafers at a low temperature and low stress |
Nov. 13, 2001 |
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