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Class Information
Number: 257/E21.122
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Device having semiconductor body comprising group iv elements or group iii-v compounds with or without impurities, e.g., doping materials (epo) > Deposition of semiconductor material on substrate, e.g., epitaxial growth, solid phase epitaxy (epo) > Characterized by the substrate (epo) > Bonding of semiconductor wafer to insulating substrate or to semic onducting substrate using an intermediate insulating layer (epo)
Description: This subclass is indented under subclass E21.119. This subclass is substantially the same in scope as ECLA classification H01L21/20B2.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6888178 |
Method and system for magnetically assisted statistical assembly of wafers |
May. 3, 2005 |
| 6887342 |
Field-assisted fusion bonding |
May. 3, 2005 |
| 6884645 |
Method for preparing a device structure having a wafer structure deposited on a composite substrate having a matched coefficient of thermal expansion |
Apr. 26, 2005 |
| 6884697 |
Process for cleaving a wafer layer from a donor wafer |
Apr. 26, 2005 |
| 6878607 |
Thin film device transfer method, thin film device, thin film integrated circuit device, active matrix board, liquid crystal display, and electronic apparatus |
Apr. 12, 2005 |
| 6879048 |
Glass frit wafer bonding process and packages formed thereby |
Apr. 12, 2005 |
| 6873053 |
Semiconductor device with smoothed pad portion |
Mar. 29, 2005 |
| 6870125 |
Crystal layer separation method, laser irradiation method and method of fabricating devices using the same |
Mar. 22, 2005 |
| 6867426 |
Light emitting diode having a transparent substrate |
Mar. 15, 2005 |
| 6867495 |
Integrated circuit having a device wafer with a diffused doped backside layer |
Mar. 15, 2005 |
| 6858518 |
Method for manufacturing semiconductor integrated circuit |
Feb. 22, 2005 |
| 6853008 |
Semiconductor device and manufacturing method thereof |
Feb. 8, 2005 |
| 6833277 |
Method and system for field assisted statistical assembly of wafers |
Dec. 21, 2004 |
| 6825532 |
Bonded substrate for an integrated circuit containing a planar intrinsic gettering zone |
Nov. 30, 2004 |
| 6825049 |
Method and system for field assisted statistical assembly of wafers |
Nov. 30, 2004 |
| 6815309 |
Support-integrated donor wafers for repeated thin donor layer separation |
Nov. 9, 2004 |
| 6814832 |
Method for transferring element, method for producing element, integrated circuit, circuit board, electro-optical device, IC card, and electronic appliance |
Nov. 9, 2004 |
| 6815774 |
Dielectrically separated wafer and method of the same |
Nov. 9, 2004 |
| 6809044 |
Method for making a thin film using pressurization |
Oct. 26, 2004 |
| 6784021 |
Semiconductor device, method of fabricating the same and semiconductor device fabricating apparatus |
Aug. 31, 2004 |
| 6777312 |
Wafer-level transfer of membranes in semiconductor processing |
Aug. 17, 2004 |
| 6770966 |
Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat |
Aug. 3, 2004 |
| 6770542 |
Method for fabricating semiconductor layers |
Aug. 3, 2004 |
| 6768175 |
Semiconductor substrate and its production method, semiconductor device comprising the same and its production method |
Jul. 27, 2004 |
| 6767840 |
Wafer processing apparatus, wafer processing method, and semiconductor substrate fabrication method |
Jul. 27, 2004 |
| 6759309 |
Micromachined structures including glass vias with internal conductive layers anodically bonded to silicon-containing substrates |
Jul. 6, 2004 |
| 6757314 |
Structure for nitride based laser diode with growth substrate removed |
Jun. 29, 2004 |
| 6756289 |
Method of producing semiconductor member and method of producing solar cell |
Jun. 29, 2004 |
| 6747298 |
Collets for bonding of light emitting diodes having shaped substrates |
Jun. 8, 2004 |
| 6744800 |
Method and structure for nitride based laser diode arrays on an insulating substrate |
Jun. 1, 2004 |
| 6716722 |
Method of producing a bonded wafer and the bonded wafer |
Apr. 6, 2004 |
| 6706618 |
Substrate processing apparatus, substrate support apparatus, substrate processing method, and substrate fabrication method |
Mar. 16, 2004 |
| 6689627 |
Process for manufacturing micromechanical components in a semiconductor material wafer with reduction in the starting wafer thickness |
Feb. 10, 2004 |
| 6686257 |
Method for transferring epitaxy layer |
Feb. 3, 2004 |
| 6683416 |
Device transfer method, and device array method and image display unit production method using the same |
Jan. 27, 2004 |
| 6683663 |
Web fabrication of devices |
Jan. 27, 2004 |
| 6673189 |
Method for producing a stable bond between two wafers |
Jan. 6, 2004 |
| 6670257 |
Method for forming horizontal buried channels or cavities in wafers of monocrystalline semiconductor material |
Dec. 30, 2003 |
| 6665044 |
Apparatuses and methods for forming electronic assemblies |
Dec. 16, 2003 |
| 6663789 |
Bonded substrate structures and method for fabricating bonded substrate structures |
Dec. 16, 2003 |
| 6653207 |
Process for the production of electric part |
Nov. 25, 2003 |
| 6645865 |
Methods, apparatuses and substrate assembly structures for fabricating microelectronic components using mechanical and chemical-mechanical planarization processes |
Nov. 11, 2003 |
| 6641662 |
Method for fabricating ultra thin single-crystal metal oxide wave retarder plates and waveguide polarization mode converter using the same |
Nov. 4, 2003 |
| 6638865 |
Manufacturing method of semiconductor chip with adhesive agent |
Oct. 28, 2003 |
| 6627921 |
Structure and method for separation and transfer of semiconductor thin films onto dissimilar substrate materials |
Sep. 30, 2003 |
| 6616854 |
Method of bonding and transferring a material to form a semiconductor device |
Sep. 9, 2003 |
| 6613678 |
Process for manufacturing a semiconductor substrate as well as a semiconductor thin film, and multilayer structure |
Sep. 2, 2003 |
| 6613675 |
Methods, apparatuses, and substrate assembly structures for fabricating microelectronic components using mechanical and chemical-mechanical planarization processes |
Sep. 2, 2003 |
| 6613610 |
Image display unit and method of producing image display unit |
Sep. 2, 2003 |
| 6610582 |
Field-assisted fusion bonding |
Aug. 26, 2003 |
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