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Class Information
Number: 257/E21.122
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Device having semiconductor body comprising group iv elements or group iii-v compounds with or without impurities, e.g., doping materials (epo) > Deposition of semiconductor material on substrate, e.g., epitaxial growth, solid phase epitaxy (epo) > Characterized by the substrate (epo) > Bonding of semiconductor wafer to insulating substrate or to semic onducting substrate using an intermediate insulating layer (epo)
Description: This subclass is indented under subclass E21.119. This subclass is substantially the same in scope as ECLA classification H01L21/20B2.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7205210 |
Semiconductor structure having strained semiconductor and method therefor |
Apr. 17, 2007 |
| 7192842 |
Method for bonding wafers |
Mar. 20, 2007 |
| 7186628 |
Method of manufacturing an SOI wafer where COP's are eliminated within the base wafer |
Mar. 6, 2007 |
| 7183656 |
Bilayer aluminum last metal for interconnects and wirebond pads |
Feb. 27, 2007 |
| 7176107 |
Hybrid substrate and method for fabricating the same |
Feb. 13, 2007 |
| 7170098 |
Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat |
Jan. 30, 2007 |
| 7160791 |
Batch process and device for forming spacer structures for packaging optical reflection devices |
Jan. 9, 2007 |
| 7151052 |
Multiple etch-stop layer deposition scheme and materials |
Dec. 19, 2006 |
| 7148121 |
Semiconductor on insulator device architecture and method of construction |
Dec. 12, 2006 |
| 7145212 |
Method for manufacturing device substrate with metal back-gate and structure formed thereby |
Dec. 5, 2006 |
| 7122452 |
Method of manufacturing a semiconductor on a silicon on insulator (SOI) substrate using solid epitaxial regrowth (SPER) and semiconductor device made thereby |
Oct. 17, 2006 |
| 7122445 |
Peeling method |
Oct. 17, 2006 |
| 7115481 |
Method for concurrently producing at least a pair of semiconductor structures that each include at least one useful layer on a substrate |
Oct. 3, 2006 |
| 7094664 |
Method for fabricating semiconductor photodetector |
Aug. 22, 2006 |
| 7078262 |
Semiconductor wafer transport method and semiconductor wafer transport apparatus using the same |
Jul. 18, 2006 |
| 7071077 |
Method for preparing a bonding surface of a semiconductor layer of a wafer |
Jul. 4, 2006 |
| 7067393 |
Substrate assembly for stressed systems |
Jun. 27, 2006 |
| 7067394 |
Manufacturing of monolithically integrated pin structures |
Jun. 27, 2006 |
| 7064045 |
Laser based method and device for forming spacer structures for packaging optical reflection devices |
Jun. 20, 2006 |
| 7060591 |
Method for fabricating a semiconductor device by transferring a layer to a support with curvature |
Jun. 13, 2006 |
| 7057247 |
Combined absolute differential transducer |
Jun. 6, 2006 |
| 7052973 |
Bonded substrate for an integrated circuit containing a planar intrinsic gettering zone |
May. 30, 2006 |
| 7046328 |
Apparatuses and methods for flexible displays |
May. 16, 2006 |
| 7041178 |
Method for low temperature bonding and bonded structure |
May. 9, 2006 |
| 7037752 |
Semiconductor device and manufacturing method thereof |
May. 2, 2006 |
| 7029548 |
Method for cutting a block of material and forming a thin film |
Apr. 18, 2006 |
| 7029964 |
Method of manufacturing a strained silicon on a SiGe on SOI substrate |
Apr. 18, 2006 |
| 6995468 |
Semiconductor apparatus utilizing a preparatory stage for a chip assembly |
Feb. 7, 2006 |
| 6995691 |
Bonded structure using reacted borosilicate mixture |
Feb. 7, 2006 |
| 6991944 |
Surface treatment for multi-layer wafers formed from layers of materials chosen from among semiconducting materials |
Jan. 31, 2006 |
| 6987028 |
Method of fabricating a microelectronic die |
Jan. 17, 2006 |
| 6982209 |
Method of transferring devices by lateral etching of a sacrificial layer |
Jan. 3, 2006 |
| 6974760 |
Methods for transferring a useful layer of silicon carbide to a receiving substrate |
Dec. 13, 2005 |
| 6967149 |
Storage structure with cleaved layer |
Nov. 22, 2005 |
| 6955975 |
Method for joining a silicon plate to a second plate |
Oct. 18, 2005 |
| 6953735 |
Method for fabricating a semiconductor device by transferring a layer to a support with curvature |
Oct. 11, 2005 |
| 6951798 |
Method of bonding a stack of layers by electromagnetic induction heating |
Oct. 4, 2005 |
| 6946364 |
Integrated circuit having a device wafer with a diffused doped backside layer |
Sep. 20, 2005 |
| 6939778 |
Method of joining an insulator element to a substrate |
Sep. 6, 2005 |
| 6936497 |
Method of forming electronic dies wherein each die has a layer of solid diamond |
Aug. 30, 2005 |
| 6927144 |
Method for manufacturing buried insulating layer type single crystal silicon carbide substrate |
Aug. 9, 2005 |
| 6927085 |
Web fabrication of devices |
Aug. 9, 2005 |
| 6921706 |
Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat |
Jul. 26, 2005 |
| 6913985 |
Method of manufacturing a semiconductor device |
Jul. 5, 2005 |
| 6909146 |
Bonded wafer with metal silicidation |
Jun. 21, 2005 |
| 6908828 |
Support-integrated donor wafers for repeated thin donor layer separation |
Jun. 21, 2005 |
| 6902987 |
Method for low temperature bonding and bonded structure |
Jun. 7, 2005 |
| 6897123 |
Bonding of parts with dissimilar thermal expansion coefficients |
May. 24, 2005 |
| 6890835 |
Layer transfer of low defect SiGe using an etch-back process |
May. 10, 2005 |
| 6890838 |
Gettering technique for wafers made using a controlled cleaving process |
May. 10, 2005 |
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