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Class Information
Number: 257/E21.122
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Device having semiconductor body comprising group iv elements or group iii-v compounds with or without impurities, e.g., doping materials (epo) > Deposition of semiconductor material on substrate, e.g., epitaxial growth, solid phase epitaxy (epo) > Characterized by the substrate (epo) > Bonding of semiconductor wafer to insulating substrate or to semic onducting substrate using an intermediate insulating layer (epo)
Description: This subclass is indented under subclass E21.119. This subclass is substantially the same in scope as ECLA classification H01L21/20B2.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7410883 |
Glass-based semiconductor on insulator structures and methods of making same |
Aug. 12, 2008 |
| 7410885 |
Method of reducing contamination by removing an interlayer dielectric from the substrate edge |
Aug. 12, 2008 |
| 7411276 |
Photosensitive device |
Aug. 12, 2008 |
| 7407867 |
Method for concurrently producing at least a pair of semiconductor structures that each include at least one useful layer on a substrate |
Aug. 5, 2008 |
| 7407863 |
Adhesive bonding with low temperature grown amorphous or polycrystalline compound semiconductors |
Aug. 5, 2008 |
| 7405108 |
Methods for forming co-planar wafer-scale chip packages |
Jul. 29, 2008 |
| 7402501 |
Method of manufacturing a coaxial trace in a surrounding material, coaxial trace formed thereby, and semiconducting material containing same |
Jul. 22, 2008 |
| 7402446 |
Method of manufacturing an electroluminescence device |
Jul. 22, 2008 |
| 7399680 |
Method and structure for implanting bonded substrates for electrical conductivity |
Jul. 15, 2008 |
| 7399652 |
Method for manufacturing a micro-electro-mechanical device, in particular an optical microswitch, and micro-electro-mechanical device thus obtained |
Jul. 15, 2008 |
| 7381587 |
Method of making circuitized substrate |
Jun. 3, 2008 |
| 7381630 |
Method for integrating MEMS device and interposer |
Jun. 3, 2008 |
| 7375005 |
Method for reclaiming and reusing wafers |
May. 20, 2008 |
| 7364984 |
Method for manufacturing SOI substrate |
Apr. 29, 2008 |
| 7354844 |
Method for manufacturing SOI substrate |
Apr. 8, 2008 |
| 7354806 |
Semiconductor device structure with active regions having different surface directions and methods |
Apr. 8, 2008 |
| 7348259 |
Method of fabricating a semiconductor structure that includes transferring one or more material layers to a substrate and smoothing an exposed surface of at least one of the material layers |
Mar. 25, 2008 |
| 7344977 |
Method of electroplating a substance over a semiconductor substrate |
Mar. 18, 2008 |
| 7344922 |
Methods for forming co-planar wafer-scale chip packages |
Mar. 18, 2008 |
| 7335521 |
Method for the production of multilayer discs |
Feb. 26, 2008 |
| 7332410 |
Method of epitaxial-like wafer bonding at low temperature and bonded structure |
Feb. 19, 2008 |
| 7326591 |
Interconnecting substrates for microelectronic dies, methods for forming vias in such substrates, and methods for packaging microelectronic devices |
Feb. 5, 2008 |
| 7319052 |
Alloying method, and wiring forming method, display device forming method, and image display unit fabricating method |
Jan. 15, 2008 |
| 7316966 |
Method for transferring substrates in a load lock chamber |
Jan. 8, 2008 |
| 7297613 |
Method of fabricating and integrating high quality decoupling capacitors |
Nov. 20, 2007 |
| 7288436 |
Semiconductor chip package manufacturing method including screen printing process |
Oct. 30, 2007 |
| 7288464 |
MEMS packaging structure and methods |
Oct. 30, 2007 |
| 7276427 |
Method for manufacturing SOI wafer |
Oct. 2, 2007 |
| 7276428 |
Methods for forming a semiconductor structure |
Oct. 2, 2007 |
| 7276430 |
Manufacturing method of silicon on insulator wafer |
Oct. 2, 2007 |
| 7273797 |
Methods of forming semiconductor-on-insulator constructions |
Sep. 25, 2007 |
| 7271439 |
Semiconductor device having pad structure for preventing and buffering stress of silicon nitride film |
Sep. 18, 2007 |
| 7271043 |
Method for manufacturing strained silicon directly-on-insulator substrate with hybrid crystalline orientation and different stress levels |
Sep. 18, 2007 |
| 7265028 |
Method for producing dislocation-free strained crystalline films |
Sep. 4, 2007 |
| 7262088 |
Thin film device supply body, method of fabricating thin film device, method of transfer, method of fabricating semiconductor device, and electronic equipment |
Aug. 28, 2007 |
| 7262112 |
Method for producing dislocation-free strained crystalline films |
Aug. 28, 2007 |
| 7256101 |
Methods for preparing a semiconductor assembly |
Aug. 14, 2007 |
| 7256094 |
Method for changing threshold voltage of device in resist asher |
Aug. 14, 2007 |
| 7244636 |
Semiconductor assembly for improved device warpage and solder ball coplanarity |
Jul. 17, 2007 |
| 7241666 |
Method for manufacturing semiconductor device |
Jul. 10, 2007 |
| 7235427 |
Method for treating substrates for microelectronics and substrates obtained by said method |
Jun. 26, 2007 |
| 7214554 |
Monitoring the deposition properties of an OLED |
May. 8, 2007 |
| 7205210 |
Semiconductor structure having strained semiconductor and method therefor |
Apr. 17, 2007 |
| 7192842 |
Method for bonding wafers |
Mar. 20, 2007 |
| 7186628 |
Method of manufacturing an SOI wafer where COP's are eliminated within the base wafer |
Mar. 6, 2007 |
| 7183656 |
Bilayer aluminum last metal for interconnects and wirebond pads |
Feb. 27, 2007 |
| 7176107 |
Hybrid substrate and method for fabricating the same |
Feb. 13, 2007 |
| 7170098 |
Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat |
Jan. 30, 2007 |
| 7160791 |
Batch process and device for forming spacer structures for packaging optical reflection devices |
Jan. 9, 2007 |
| 7151052 |
Multiple etch-stop layer deposition scheme and materials |
Dec. 19, 2006 |
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