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Class Information
Number: 257/E21.122
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Device having semiconductor body comprising group iv elements or group iii-v compounds with or without impurities, e.g., doping materials (epo) > Deposition of semiconductor material on substrate, e.g., epitaxial growth, solid phase epitaxy (epo) > Characterized by the substrate (epo) > Bonding of semiconductor wafer to insulating substrate or to semic onducting substrate using an intermediate insulating layer (epo)
Description: This subclass is indented under subclass E21.119. This subclass is substantially the same in scope as ECLA classification H01L21/20B2.

Sub-classes under this class:

Class Number Class Name Patents
257/E21.123 Substrate is crystalline semiconductor material, e.g., lattice adaptation, heteroepitaxy (epo) 158

Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13

Patent Number Title Of Patent Date Issued
8704238 Method and structure of monolithically integrated IC-MEMS oscillator using IC foundry-compatible processes Apr. 22, 2014
8685833 Stress reduction means for warp control of substrates through clamping Apr. 1, 2014
8664083 Vertical outgassing channels Mar. 4, 2014
8659157 Adhesive composition for producing semiconductor device and adhesive sheet for producing semiconductor device Feb. 25, 2014
8652935 Void-free wafer bonding using channels Feb. 18, 2014
8652925 Method of fabricating isolated capacitors and structure thereof Feb. 18, 2014
8647964 Temporary wafer bonding method for semiconductor processing Feb. 11, 2014
8648387 Nitride semiconductor template and method of manufacturing the same Feb. 11, 2014
8618639 Semiconductor structure, semiconductor device having a semiconductor structure, and method for manufacturing a semiconductor structure Dec. 31, 2013
8609511 Semiconductor device manufacturing method, semiconductor device, and camera module Dec. 17, 2013
8575001 Methods for directly bonding together semiconductor structures, and bonded semiconductor structures formed using such methods Nov. 5, 2013
8575005 Method of manufacturing an electronic device having a plastic substrate and corresponding carrier Nov. 5, 2013
8563397 Semiconductor device and manufacturing method thereof Oct. 22, 2013
8546244 Method of manufacturing semiconductor device Oct. 1, 2013
8530336 Method for manufacturing semiconductor substrate Sep. 10, 2013
8530331 Process for assembling substrates with low-temperature heat treatments Sep. 10, 2013
8518797 Method of making an SOI substrate by using a separation layer with regions of non-uniform concentration Aug. 27, 2013
8507913 Method of bonding wafers Aug. 13, 2013
8471385 Method for the connection of two wafers, and a wafer arrangement Jun. 25, 2013
8466054 Thermal conduction paths for semiconductor structures Jun. 18, 2013
8460957 Optical semiconductor device, method for manufacturing optical semiconductor device, and method for manufacturing optical semiconductor apparatus Jun. 11, 2013
8450152 Double-side exposed semiconductor device and its manufacturing method May. 28, 2013
8440544 CMOS structure and method of manufacture May. 14, 2013
8440546 Methods and devices for fabricating and assembling printable semiconductor elements May. 14, 2013
8420500 Method of producing a structure by layer transfer Apr. 16, 2013
8421076 Insulating substrate for semiconductor apparatus, semiconductor apparatus, and method for manufacturing semiconductor apparatus Apr. 16, 2013
8394703 Manufacturing method of SOI substrate and manufacturing method of semiconductor device Mar. 12, 2013
8389379 Method for making a stressed structure designed to be dissociated Mar. 5, 2013
8383487 Method for manufacturing SOI substrate Feb. 26, 2013
8338268 Transfer method for thin film nanomembrane structures Dec. 25, 2012
8329561 Method of producing semiconductor device Dec. 11, 2012
8324076 Micro-fluid ejection heads and methods for bonding substrates to supports Dec. 4, 2012
8324075 Methods for recycling substrates and fabricating laminated wafers Dec. 4, 2012
8298916 Process for fabricating a multilayer structure with post-grinding trimming Oct. 30, 2012
8278187 Method for reprocessing semiconductor substrate by stepwise etching with at least two etching treatments Oct. 2, 2012
8278659 Uniform large-grained and grain boundary location manipulated polycrystalline thin film semiconductors formed using sequential lateral solidification and devices formed thereon Oct. 2, 2012
8279615 Encapsulation module method for production and use thereof Oct. 2, 2012
8273593 Method for production of a radiation-emitting semiconductor chip Sep. 25, 2012
8247308 Method for manufacturing SOI substrate Aug. 21, 2012
8241932 Methods of fabricating light emitting diode packages Aug. 14, 2012
8236577 Foundry compatible process for manufacturing a magneto meter using lorentz force for integrated systems Aug. 7, 2012
8232192 Process of bonding circuitry components Jul. 31, 2012
8227282 Method of manufacturing vertical light emitting diode Jul. 24, 2012
8211780 Method for manufacturing SOI substrate Jul. 3, 2012
8207046 Method for producing semiconductor device and semiconductor device produced by same method Jun. 26, 2012
8202785 Surface treatment for molecular bonding Jun. 19, 2012
8193550 Method for manufacturing a micro-electro-mechanical device, in particular an optical microswitch, and micro-electro-mechanical device thus obtained Jun. 5, 2012
8193587 Manufacturing method of semiconductor device, manufacturing method of display device, semiconductor device, display device, and electronic device Jun. 5, 2012
8183133 Method for producing semiconductor substrate May. 22, 2012
8173534 Method for producing a semiconductor wafer with rear side identification May. 8, 2012

1 2 3 4 5 6 7 8 9 10 11 12 13

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