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Browse by Category: Main > Physics
Class Information
Number: 257/E21.088
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Device having semiconductor body comprising group iv elements or group iii-v compounds with or without impurities, e.g., doping materials (epo) > Joining of semiconductor body for junction formation (epo) > By direct bonding (epo)
Description: This subclass is indented under subclass E21.087. This subclass is substantially the same in scope as ECLA classification H01L21/18B2.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8674382 Semiconductor light emitting device comprising heterojunction Mar. 18, 2014
8669180 Semiconductor device with self aligned end-to-end conductive line structure and method of forming the same Mar. 11, 2014
8664083 Vertical outgassing channels Mar. 4, 2014
8609511 Semiconductor device manufacturing method, semiconductor device, and camera module Dec. 17, 2013
8604334 Photoelectric conversion device Dec. 10, 2013
8575005 Method of manufacturing an electronic device having a plastic substrate and corresponding carrier Nov. 5, 2013
8558285 Method using low temperature wafer bonding to fabricate transistors with heterojunctions of Si(Ge) to III-N materials Oct. 15, 2013
8557678 Method for manufacturing semiconductor substrate of large-power device Oct. 15, 2013
8546875 Vertical transistor having edge termination structure Oct. 1, 2013
8530336 Method for manufacturing semiconductor substrate Sep. 10, 2013
8501518 Method of manufacturing thermoelectric conversion element and thermoelectric conversion element Aug. 6, 2013
8492869 3D integrated circuit device having lower-cost active circuitry layers stacked before higher-cost active circuitry layer Jul. 23, 2013
8486758 Simultaneous wafer bonding and interconnect joining Jul. 16, 2013
8476646 Light emitting device and light emitting device package Jul. 2, 2013
8471385 Method for the connection of two wafers, and a wafer arrangement Jun. 25, 2013
8466039 Pressurized treatment of substrates to enhance cleaving process Jun. 18, 2013
8461018 Treatment for bonding interface stabilization Jun. 11, 2013
8420504 Method for manufacturing semiconductor device Apr. 16, 2013
8420479 Semiconductor device comprising a capacitor formed in the contact level Apr. 16, 2013
8399336 Method for fabricating a 3D integrated circuit device having lower-cost active circuitry layers stacked before higher-cost active circuitry layer Mar. 19, 2013
8361822 Light-emitting device and method for producing light emitting device Jan. 29, 2013
8354330 Method of fabricating SOI super-junction LDMOS structure capable of completely eliminating substrate-assisted depletion effects Jan. 15, 2013
8343851 Wafer temporary bonding method using silicon direct bonding Jan. 1, 2013
8329554 Ultra thin bumped wafer with under-film Dec. 11, 2012
8298916 Process for fabricating a multilayer structure with post-grinding trimming Oct. 30, 2012
8236666 Semiconductor device and process for producing same Aug. 7, 2012
8237296 Selective UV-Ozone dry etching of anti-stiction coatings for MEMS device fabrication Aug. 7, 2012
8227282 Method of manufacturing vertical light emitting diode Jul. 24, 2012
8216916 Treatment for bonding interface stabilization Jul. 10, 2012
8207046 Method for producing semiconductor device and semiconductor device produced by same method Jun. 26, 2012
8193616 Semiconductor device on direct silicon bonded substrate with different layer thickness Jun. 5, 2012
8148728 Method for fabrication of a semiconductor device and structure Apr. 3, 2012
8129257 Vertical outgassing channels Mar. 6, 2012
8076168 Light-emitting device and method for producing light emitting device Dec. 13, 2011
8071454 Method for manufacturing dielectric isolation type semiconductor device Dec. 6, 2011
8062957 Semiconductor substrate surface preparation method Nov. 22, 2011
8062956 Semiconductor on insulator and methods of forming same using temperature gradient in an anodic bonding process Nov. 22, 2011
8058149 Method for fabricating a semiconductor substrate Nov. 15, 2011
8048767 Bonded wafer and method for producing bonded wafer Nov. 1, 2011
8039401 Structure and method for forming hybrid substrate Oct. 18, 2011
8017499 Strained Si MOSFET on tensile-strained SiGe-on-insulator (SGOI) Sep. 13, 2011
8012866 Method of bonding semiconductor devices utilizing solder balls Sep. 6, 2011
7998833 Method for bonding wafers Aug. 16, 2011
7972938 Methods of splitting CdZnTe layers from CdZnTe substrates for the growth of HgCdTe Jul. 5, 2011
7964431 Method to make electrical contact to a bonded face of a photovoltaic cell Jun. 21, 2011
7948062 Semiconductor device and method for manufacturing semiconductor device May. 24, 2011
7879690 Method of fabricating a microelectronic structure of a semiconductor on insulator type with different patterns Feb. 1, 2011
7858494 Laminated substrate manufacturing method and laminated substrate manufactured by the method Dec. 28, 2010
7846814 Semiconductor layer structure and method of making the same Dec. 7, 2010
7842584 Method for manufacturing semiconductor device Nov. 30, 2010

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