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Class Information
Number: 257/E21.087
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Device having semiconductor body comprising group iv elements or group iii-v compounds with or without impurities, e.g., doping materials (epo) > Joining of semiconductor body for junction formation (epo)
Description: This subclass is indented under subclass E21.085. This subclass is substantially the same in scope as ECLA classification H01L21/18B.

Sub-classes under this class:

Class Number Class Name Patents
257/E21.088 By direct bonding (epo) 209

Patents under this class:

Patent Number Title Of Patent Date Issued
8703623 Fabrication technique for gallium nitride substrates Apr. 22, 2014
8648387 Nitride semiconductor template and method of manufacturing the same Feb. 11, 2014
8642443 Process for the realization of islands of at least partially relaxed strained material Feb. 4, 2014
8558285 Method using low temperature wafer bonding to fabricate transistors with heterojunctions of Si(Ge) to III-N materials Oct. 15, 2013
8530256 Production process for semiconductor device Sep. 10, 2013
8486758 Simultaneous wafer bonding and interconnect joining Jul. 16, 2013
8455297 Method to fabricate high performance carbon nanotube transistor integrated circuits by three-dimensional integration technology Jun. 4, 2013
8378465 Method and apparatus for optical modulation Feb. 19, 2013
8367520 Methods and structures for altering strain in III-nitride materials Feb. 5, 2013
8314007 Process for fabricating a heterostructure with minimized stress Nov. 20, 2012
8236672 Semiconductor device and method for manufacturing semiconductor device Aug. 7, 2012
8216871 Method for thin film thermoelectric module fabrication Jul. 10, 2012
8080842 Nonvolatile memory device Dec. 20, 2011
8048700 Semiconductor light emitting element and manufacturing method thereof Nov. 1, 2011
8039360 Method of assembling integrated circuit components Oct. 18, 2011
7994506 Semiconductor device and method of manufacturing the same Aug. 9, 2011
7804100 Polarization-reversed III-nitride light emitting device Sep. 28, 2010
7781247 Method for producing Group III-Group V vertical light-emitting diodes Aug. 24, 2010
7586155 Apparatus and method for improving drive-strength and leakage of deep submicron MOS transistors Sep. 8, 2009
7544584 Localized compressive strained semiconductor Jun. 9, 2009
7276431 Method of fabricating isolated semiconductor devices in epi-less substrate Oct. 2, 2007
7037804 Wafer bonding using a flexible bladder press for three dimensional (3D) vertical stack integration May. 2, 2006
6975016 Wafer bonding using a flexible bladder press and thinned wafers for three-dimensional (3D) wafer-to-wafer vertical stack integration, and application thereof Dec. 13, 2005
6756285 Multilayer structure with controlled internal stresses and making same Jun. 29, 2004
6316332 Method for joining wafers at a low temperature and low stress Nov. 13, 2001
6261928 Producing microstructures or nanostructures on a support Jul. 17, 2001
5872388 Semiconductor device and method for fabricating the same Feb. 16, 1999
5726089 Semiconductor device and method for fabricating the same Mar. 10, 1998
4075038 Deep diode devices and method and apparatus Feb. 21, 1978
4031607 Minority carrier isolation barriers for semiconductor devices Jun. 28, 1977
4024566 Deep diode device May. 17, 1977
3988766 Multiple P-N junction formation with an alloy droplet Oct. 26, 1976
3988771 Spatial control of lifetime in semiconductor device Oct. 26, 1976
3988762 Minority carrier isolation barriers for semiconductor devices Oct. 26, 1976
3977910 Deep finger diodes Aug. 31, 1976
3956023 Process for making a deep power diode by thermal migration of dopant May. 11, 1976
3956026 Making a deep diode varactor by thermal migration May. 11, 1976
3956024 Process for making a semiconductor varistor embodying a lamellar structure May. 11, 1976

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