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Class Information
Number: 257/E21.084
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Device having semiconductor body comprising cuprous oxide (cu 2 o) or cuprous iodide (cui) (epo) > Treatment of complete device, e.g., electroforming, heat treating (epo)
Description: This subclass is indented under subclass E21.078. This subclass is substantially the same in scope as ECLA classification H01L21/16C.










Patents under this class:

Patent Number Title Of Patent Date Issued
8669135 System and method for fabricating a 3D image sensor structure Mar. 11, 2014
8383513 Asymmetric rapid thermal annealing to reduce pattern effect Feb. 26, 2013
8247860 Nonvolatile semiconductor memory device and method for manufacturing same Aug. 21, 2012
8222087 Seed layer for a heat spreader in a magnetic recording head Jul. 17, 2012
7824955 Hybrid beam deposition system and methods for fabricating metal oxide-ZnO films, p-type ZnO films, and ZnO-based II-VI compound semiconductor devices Nov. 2, 2010
7820532 Methods for simultaneously forming doped regions having different conductivity-determining type element profiles Oct. 26, 2010
7759715 Memory cell comprising dynamic random access memory (DRAM) nanoparticles and nonvolatile memory (NVM) nanoparticle Jul. 20, 2010
7508017 Solid-state image sensor using junction gate type field-effect transistor as pixel Mar. 24, 2009
7452800 Bonding a non-metal body to a metal surface using inductive heating Nov. 18, 2008
7348234 Methods of forming capacitor constructions Mar. 25, 2008
7316969 Method and apparatus for thermally treating substrates Jan. 8, 2008
7276438 Method of manufacturing wiring substrate Oct. 2, 2007











 
 
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