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Class Information
Number: 257/E21.083
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Device having semiconductor body comprising cuprous oxide (cu 2 o) or cuprous iodide (cui) (epo) > Preparation of substrate, preliminary treatment oxidation of substrate, reduction treatment (epo) > Application of specified conductive layer (epo)
Description: This subclass is indented under subclass E21.079. This subclass is substantially the same in scope as ECLA classification H01L21/16B5.

Patents under this class:

Patent Number Title Of Patent Date Issued
7629203 Thermal interface material for combined reflow Dec. 8, 2009

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