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Class Information
Number: 257/E21.076
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Device having semiconductor body comprising selenium (se) or tellurium (te) (epo) > Treatment of complete device, e.g., by electroforming to form barrier (epo)
Description: This subclass is indented under subclass E21.068. This subclass is substantially the same in scope as ECLA classification H01L21/14.










Sub-classes under this class:

Class Number Class Name Patents
257/E21.077 Heat treating (epo) 114


Patents under this class:

Patent Number Title Of Patent Date Issued
7964938 Semiconductor packages having electromagnetic interference-shielding function, manufacturing method thereof and jig Jun. 21, 2011
7605082 Capping before barrier-removal IC fabrication method Oct. 20, 2009
7157371 Barrier layer and a method for suppressing diffusion processes during the production of semiconductor devices Jan. 2, 2007
3940645 Small-sized synchronous motor Feb. 24, 1976











 
 
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