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Class Information
Number: 257/E21.074
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Device having semiconductor body comprising selenium (se) or tellurium (te) (epo) > Preliminary treatment of se or te, its application to substrate, or the subsequent treatment of combination (epo) > Provision of discrete insulating layer, i.e., specified barrier layer material (epo)
Description: This subclass is indented under subclass E21.07. This subclass is substantially the same in scope as ECLA classification H01L21/108.

Patents under this class:

Patent Number Title Of Patent Date Issued
7566661 Electroless treatment of noble metal barrier and adhesion layer Jul. 28, 2009

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