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Class Information
Number: 257/E21.04
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo)
Description: This subclass is indented under subclass E21.002. This subclass is substantially the same in scope as ECLA classification H01L21/04.
Sub-classes under this class:
| Class Number |
Class Name |
Patents |
| 257/E21.041 |
Device having semiconductor body comprising carbon, e.g., diamond, diamond-like carbon (epo) |
26 |
| 257/E21.054 |
Device having semiconductor body comprising silicon carbide (sic) (epo) |
101 |
| 257/E21.068 |
Device having semiconductor body comprising selenium (se) or tellurium (te) (epo) |
16 |
| 257/E21.078 |
Device having semiconductor body comprising cuprous oxide (cu 2 o) or cuprous iodide (cui) (epo) |
3 |
| 257/E21.085 |
Device having semiconductor body comprising group iv elements or group iii-v compounds with or without impurities, e.g., doping materials (epo) |
20 |
| 257/E21.459 |
Device having semiconductor body other than carbon, si, ge, sic, se, te, cu 2 o, cui, and group iii-v compounds with or without impurities, e.g., doping materials (epo) |
8 |
| 257/E21.499 |
Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) |
582 |
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7622351 |
Method of manufacturing semiconductor device and semiconductor device |
Nov. 24, 2009 |
| 7619265 |
Molecular single electron transistor (MSET) detector device |
Nov. 17, 2009 |
| 7588953 |
Method of fabricating porous aluminum oxide mold having sub-micron structure and methods of imprinting to make LEDS using the mold |
Sep. 15, 2009 |
| 7528047 |
Self-aligned split gate memory cell and method of forming |
May. 5, 2009 |
| 7510938 |
Semiconductor superjunction structure |
Mar. 31, 2009 |
| 7510900 |
Methods of forming a double pinned photodiode |
Mar. 31, 2009 |
| 7482068 |
Lightly doped silicon carbide wafer and use thereof in high power devices |
Jan. 27, 2009 |
| 7439175 |
Method for fabricating a thin film and metal line of semiconductor device |
Oct. 21, 2008 |
| 7432193 |
Method for fabricating a thin film and a metal line of a semiconductor device |
Oct. 7, 2008 |
| 7348226 |
Method of forming lattice-matched structure on silicon and structure formed thereby |
Mar. 25, 2008 |
| 7339249 |
Semiconductor device |
Mar. 4, 2008 |
| 7294526 |
Nano optical sensors via molecular self-assembly |
Nov. 13, 2007 |
| 7214575 |
Method and apparatus providing CMOS imager device pixel with transistor having lower threshold voltage than other imager device transistors |
May. 8, 2007 |
| 7205662 |
Dielectric barrier layer films |
Apr. 17, 2007 |
| 7190016 |
Capacitor structure |
Mar. 13, 2007 |
| 7179696 |
Phosphorus activated NMOS using SiC process |
Feb. 20, 2007 |
| 7161220 |
High speed photodiode with a barrier layer for blocking or eliminating slow photonic carriers and method for forming same |
Jan. 9, 2007 |
| 7129580 |
Methods and procedures for engineering of composite conductive films by atomic layer deposition |
Oct. 31, 2006 |
| 7026704 |
Semiconductor device for reducing plasma charging damage |
Apr. 11, 2006 |
| 6773976 |
Semiconductor device and method for manufacturing the same |
Aug. 10, 2004 |
| 5543335 |
Advanced power device process for low drop |
Aug. 6, 1996 |
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