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Class Information
Number: 257/E21.029
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Making mask on semicond uctor body for further photolithographic processing (epo) > Comprising organic layer (epo) > Characterized by treatment of photoresist layer (epo) > Photolith ographic process (epo) > Using anti-reflective coating (epo)
Description: This subclass is indented under subclass E21.027. This subclass is substantially the same in scope as ECLA classification H01L21/027B6B4.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6686272 |
Anti-reflective coatings for use at 248 nm and 193 nm |
Feb. 3, 2004 |
| 6686129 |
Partial photoresist etching |
Feb. 3, 2004 |
| 6680252 |
Method for planarizing barc layer in dual damascene process |
Jan. 20, 2004 |
| 6677661 |
Semiconductive wafer assemblies |
Jan. 13, 2004 |
| 6673713 |
Anti-reflective coatings and methods for forming and using same |
Jan. 6, 2004 |
| 6669995 |
Method of treating an anti-reflective coating on a substrate |
Dec. 30, 2003 |
| 6670284 |
Method of decontaminating process chambers, methods of reducing defects in anti-reflective coatings, and resulting semiconductor structures |
Dec. 30, 2003 |
| 6670695 |
Method of manufacturing anti-reflection layer |
Dec. 30, 2003 |
| 6670288 |
Methods of forming a layer of silicon nitride in a semiconductor fabrication process |
Dec. 30, 2003 |
| 6664180 |
Method of forming smaller trench line width using a spacer hard mask |
Dec. 16, 2003 |
| 6664177 |
Dielectric ARC scheme to improve photo window in dual damascene process |
Dec. 16, 2003 |
| 6664201 |
Method of manufacturing anti-reflection layer |
Dec. 16, 2003 |
| 6653735 |
CVD silicon carbide layer as a BARC and hard mask for gate patterning |
Nov. 25, 2003 |
| 6649519 |
Reducing reflectivity on a semiconductor wafer by annealing titanium and aluminum |
Nov. 18, 2003 |
| 6642152 |
Method for ultra thin resist linewidth reduction using implantation |
Nov. 4, 2003 |
| 6638441 |
Method for pitch reduction |
Oct. 28, 2003 |
| 6635583 |
Silicon carbide deposition for use as a low-dielectric constant anti-reflective coating |
Oct. 21, 2003 |
| 6630397 |
Method to improve surface uniformity of a layer of arc used for the creation of contact plugs |
Oct. 7, 2003 |
| 6624068 |
Polysilicon processing using an anti-reflective dual layer hardmask for 193 nm lithography |
Sep. 23, 2003 |
| 6613665 |
Process for forming integrated circuit structure comprising layer of low k dielectric material having antireflective properties in an upper surface |
Sep. 2, 2003 |
| 6613682 |
Method for in situ removal of a dielectric antireflective coating during a gate etch process |
Sep. 2, 2003 |
| 6607984 |
Removable inorganic anti-reflection coating process |
Aug. 19, 2003 |
| 6605540 |
Process for forming a dual damascene structure |
Aug. 12, 2003 |
| 6605863 |
Low k film application for interlevel dielectric and method of cleaning etched features |
Aug. 12, 2003 |
| 6605502 |
Isolation using an antireflective coating |
Aug. 12, 2003 |
| 6599437 |
Method of etching organic antireflection coating (ARC) layers |
Jul. 29, 2003 |
| 6590702 |
Multilayer antireflection film, optical member, and reduction projection exposure apparatus |
Jul. 8, 2003 |
| 6589888 |
Dual frequency plasma enhanced chemical vapor deposition of silicon carbide layers |
Jul. 8, 2003 |
| 6586339 |
Silicon barrier layer to prevent resist poisoning |
Jul. 1, 2003 |
| 6586820 |
Treatment for film surface to reduce photo footing |
Jul. 1, 2003 |
| 6573196 |
Method of depositing organosilicate layers |
Jun. 3, 2003 |
| 6573189 |
Manufacture method of metal bottom ARC |
Jun. 3, 2003 |
| 6573030 |
Method for depositing an amorphous carbon layer |
Jun. 3, 2003 |
| 6573175 |
Dry low k film application for interlevel dielectric and method of cleaning etched features |
Jun. 3, 2003 |
| 6562544 |
Method and apparatus for improving accuracy in photolithographic processing of substrates |
May. 13, 2003 |
| 6559067 |
Method for patterning an organic antireflection layer |
May. 6, 2003 |
| 6555472 |
Method of producing a semiconductor device using feature trimming |
Apr. 29, 2003 |
| 6548423 |
Multilayer anti-reflective coating process for integrated circuit fabrication |
Apr. 15, 2003 |
| 6548405 |
Batch processing for semiconductor wafers to form aluminum nitride and titanium aluminum nitride |
Apr. 15, 2003 |
| 6541843 |
Anti-reflective coatings and methods for forming and using same |
Apr. 1, 2003 |
| 6541164 |
Method for etching an anti-reflective coating |
Apr. 1, 2003 |
| 6537918 |
Method for etching silicon oxynitride and dielectric antireflection coatings |
Mar. 25, 2003 |
| 6537733 |
Method of depositing low dielectric constant silicon carbide layers |
Mar. 25, 2003 |
| 6534398 |
Method of forming metal layer(s) and/or antireflective coating layer(s) on an integrated circuit |
Mar. 18, 2003 |
| 6531406 |
Method of fabricating a shallow trench isolation |
Mar. 11, 2003 |
| 6528341 |
Method of forming a sion antireflection film which is noncontaminating with respect to deep-uv photoresists |
Mar. 4, 2003 |
| 6527867 |
Method for enhancing anti-reflective coatings used in photolithography of electronic devices |
Mar. 4, 2003 |
| 6527966 |
Pattern forming method |
Mar. 4, 2003 |
| 6524945 |
Method of making an anti-reflection structure for a conductive layer in a semiconductor device |
Feb. 25, 2003 |
| 6525353 |
Anti-reflection structure for a conductive layer in a semiconductor device |
Feb. 25, 2003 |
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