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Class Information
Number: 257/E21.029
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Making mask on semicond uctor body for further photolithographic processing (epo) > Comprising organic layer (epo) > Characterized by treatment of photoresist layer (epo) > Photolith ographic process (epo) > Using anti-reflective coating (epo)
Description: This subclass is indented under subclass E21.027. This subclass is substantially the same in scope as ECLA classification H01L21/027B6B4.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7416992 |
Method of patterning a low-k dielectric using a hard mask |
Aug. 26, 2008 |
| 7390738 |
Fabrication of semiconductor devices using anti-reflective coatings |
Jun. 24, 2008 |
| 7368331 |
Manufacturing method of thin-film transistor, thin-film transistor sheet, and electric circuit |
May. 6, 2008 |
| 7365408 |
Structure for photolithographic applications using a multi-layer anti-reflection coating |
Apr. 29, 2008 |
| 7344990 |
Method of manufacturing micro-structure element by utilizing molding glass |
Mar. 18, 2008 |
| 7345002 |
Replication and transfer of microstructures and nanostructures |
Mar. 18, 2008 |
| 7335585 |
Method for preventing the formation of a void in a bottom anti-reflective coating filling a via hole |
Feb. 26, 2008 |
| 7326646 |
Nitrogen-free ARC layer and a method of manufacturing the same |
Feb. 5, 2008 |
| 7314824 |
Nitrogen-free ARC/capping layer and method of manufacturing the same |
Jan. 1, 2008 |
| 7314813 |
Methods of forming planarized multilevel metallization in an integrated circuit |
Jan. 1, 2008 |
| 7291552 |
Multi-layer film stack for extinction of substrate reflections during patterning |
Nov. 6, 2007 |
| 7285503 |
Hermetic cap layers formed on low-k films by plasma enhanced chemical vapor deposition |
Oct. 23, 2007 |
| 7265021 |
Alignment method, method for manufacturing a semiconductor device, substrate for a semiconductor device, electronic equipment |
Sep. 4, 2007 |
| 7235479 |
Organic solvents having ozone dissolved therein for semiconductor processing utilizing sacrificial materials |
Jun. 26, 2007 |
| 7172964 |
Method of preventing photoresist poisoning of a low-dielectric-constant insulator |
Feb. 6, 2007 |
| 7163879 |
Hard mask etch for gate polyetch |
Jan. 16, 2007 |
| 7071509 |
Method of improving the top plate electrode stress inducting voids for 1T-RAM process |
Jul. 4, 2006 |
| 7067894 |
Semiconductor devices using anti-reflective coatings |
Jun. 27, 2006 |
| 7064078 |
Techniques for the use of amorphous carbon (APF) for various etch and litho integration scheme |
Jun. 20, 2006 |
| 7064080 |
Semiconductor processing method using photoresist and an antireflective coating |
Jun. 20, 2006 |
| 7053003 |
Photoresist conditioning with hydrogen ramping |
May. 30, 2006 |
| 7052988 |
Applications and methods of making nitrogen-free anti-reflective layers for semiconductor processing |
May. 30, 2006 |
| 7045467 |
Method for determining endpoint of etch layer and etching process implementing said method in semiconductor element fabrication |
May. 16, 2006 |
| 7030008 |
Techniques for patterning features in semiconductor devices |
Apr. 18, 2006 |
| 7030044 |
Method of forming a cap layer having anti-reflective characteristics on top of a low-k dielectric |
Apr. 18, 2006 |
| 7012125 |
Spin-on-glass anti-reflective coatings for photolithography |
Mar. 14, 2006 |
| 7008870 |
Structure applied to a photolithographic process and method for fabricating a semiconductor device |
Mar. 7, 2006 |
| 7001838 |
Method of wet etching an inorganic antireflection layer |
Feb. 21, 2006 |
| 7001710 |
Method for forming ultra fine contact holes in semiconductor devices |
Feb. 21, 2006 |
| 7001847 |
Micro pattern forming method and semiconductor device manufacturing method |
Feb. 21, 2006 |
| 6998348 |
Method for manufacturing electronic circuits integrated on a semiconductor substrate |
Feb. 14, 2006 |
| 6974766 |
In situ deposition of a low .kappa. dielectric layer, barrier layer, etch stop, and anti-reflective coating for damascene application |
Dec. 13, 2005 |
| 6972255 |
Semiconductor device having an organic anti-reflective coating (ARC) and method therefor |
Dec. 6, 2005 |
| 6969753 |
Spin-on-glass anti-reflective coatings for photolithography |
Nov. 29, 2005 |
| 6967072 |
Photolithography scheme using a silicon containing resist |
Nov. 22, 2005 |
| 6960804 |
Semiconductor device having a gate structure surrounding a fin |
Nov. 1, 2005 |
| 6956097 |
Spin-on-glass anti-reflective coatings for photolithography |
Oct. 18, 2005 |
| 6951826 |
Silicon carbide deposition for use as a low dielectric constant anti-reflective coating |
Oct. 4, 2005 |
| 6943432 |
Semiconductor constructions |
Sep. 13, 2005 |
| 6936539 |
Antireflective coating for use during the manufacture of a semiconductor device |
Aug. 30, 2005 |
| 6929902 |
Method of preventing repeated collapse in a reworked photoresist layer |
Aug. 16, 2005 |
| 6927178 |
Nitrogen-free dielectric anti-reflective coating and hardmask |
Aug. 9, 2005 |
| 6916697 |
Etch back process using nitrous oxide |
Jul. 12, 2005 |
| 6916749 |
Method of manufacturing semiconductor device |
Jul. 12, 2005 |
| 6905973 |
Methods of forming semiconductor constructions |
Jun. 14, 2005 |
| 6903007 |
Process for forming bottom anti-reflection coating for semiconductor fabrication photolithography which inhibits photoresist footing |
Jun. 7, 2005 |
| 6900123 |
BARC etch comprising a selective etch chemistry and a high polymerizing gas for CD control |
May. 31, 2005 |
| 6900134 |
Method for forming openings in a substrate using bottom antireflective coatings |
May. 31, 2005 |
| 6890865 |
Low k film application for interlevel dielectric and method of cleaning etched features |
May. 10, 2005 |
| 6887796 |
Method of wet etching a silicon and nitrogen containing material |
May. 3, 2005 |
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