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Class Information
Number: 257/E21.025
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Making mask on semicond uctor body for further photolithographic processing (epo) > Comprising organic layer (epo) > For lift-off process (epo)
Description: This subclass is indented under subclass E21.024. This subclass is substantially the same in scope as ECLA classification H01L21/027B2.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7439144 |
CMOS gate structures fabricated by selective oxidation |
Oct. 21, 2008 |
| 7316784 |
Method of patterning transparent conductive film, thin film transistor substrate using the same and fabricating method thereof |
Jan. 8, 2008 |
| 7220612 |
Liquid crystal display device and fabricating method thereof |
May. 22, 2007 |
| 7183224 |
Liftoff process for thin photoresist |
Feb. 27, 2007 |
| 7071088 |
Method for fabricating bulbous-shaped vias |
Jul. 4, 2006 |
| 7008810 |
Method for fabricating at least one mesa or ridge structure or at least one electrically pumped region in a layer or layer sequence |
Mar. 7, 2006 |
| 6933099 |
Method of forming a patterned metal layer |
Aug. 23, 2005 |
| 6924230 |
Method for forming a conductive layer |
Aug. 2, 2005 |
| 6881656 |
Production process for semiconductor apparatus |
Apr. 19, 2005 |
| 6835635 |
Electrode forming method and field effect transistor |
Dec. 28, 2004 |
| 6825122 |
Method for fabricating a patterned thin film and a micro device |
Nov. 30, 2004 |
| 6737202 |
Method of fabricating a tiered structure using a multi-layered resist stack and use |
May. 18, 2004 |
| 6727126 |
Masking member for forming fine electrode and manufacturing method therefor, method for forming electrode, and field effect transistor |
Apr. 27, 2004 |
| 6569763 |
Method to separate a metal film from an insulating film in a semiconductor device using adhesive tape |
May. 27, 2003 |
| 6458682 |
Method of manufacturing a bump electrode semiconductor device using photosensitive resin |
Oct. 1, 2002 |
| 6440846 |
Method for forming semiconductor device |
Aug. 27, 2002 |
| 6420252 |
Methods of forming robust metal contacts on compound semiconductors |
Jul. 16, 2002 |
| 6340626 |
Method for making a metallic pattern by photolithography |
Jan. 22, 2002 |
| 6340635 |
Resist pattern, process for the formation of the same, and process for the formation of wiring pattern |
Jan. 22, 2002 |
| 6207499 |
Semiconductor device, method of fabricating the same, and sputtering apparatus |
Mar. 27, 2001 |
| 6156672 |
Method of forming dielectric thin film pattern and method of forming laminate pattern comprising dielectric thin film and conductive thin film |
Dec. 5, 2000 |
| 6156665 |
Trilayer lift-off process for semiconductor device metallization |
Dec. 5, 2000 |
| 6080514 |
Fabrication method of mask for semiconductor device |
Jun. 27, 2000 |
| 5981319 |
Method of forming a T-shaped gate |
Nov. 9, 1999 |
| 5953595 |
Method of manufacturing thin film transistor |
Sep. 14, 1999 |
| 5903023 |
Semiconductor device, method of fabricating the same, and sputtering apparatus |
May. 11, 1999 |
| 5895271 |
Metal film forming method |
Apr. 20, 1999 |
| 5891804 |
Process for conductors with selective deposition |
Apr. 6, 1999 |
| 5888892 |
Metal layer pattern forming method |
Mar. 30, 1999 |
| 5856067 |
Contact photolithographic process for realizing metal lines on a substrate by varying exposure energy |
Jan. 5, 1999 |
| 5804474 |
Method for forming a V-shaped gate electrode in a semiconductor device, and the structure of the electrode |
Sep. 8, 1998 |
| 5773333 |
Method for manufacturing self-aligned T-type gate |
Jun. 30, 1998 |
| 5766808 |
Process for forming multilayer lift-off structures |
Jun. 16, 1998 |
| 5712175 |
Method of making semiconductor device having a schottky gate electrode |
Jan. 27, 1998 |
| 5705432 |
Process for providing clean lift-off of sputtered thin film layers |
Jan. 6, 1998 |
| 5652179 |
Method of fabricating sub-micron gate electrode by angle and direct evaporation |
Jul. 29, 1997 |
| 5587328 |
Method for manufacturing semiconductor device |
Dec. 24, 1996 |
| 5563079 |
Method of making a field effect transistor |
Oct. 8, 1996 |
| 5541139 |
Method of manufacturing a radiation-emitting semiconductor diode |
Jul. 30, 1996 |
| 5539222 |
High yield sub-micron gate FETs |
Jul. 23, 1996 |
| 5503961 |
Process for forming multilayer lift-off structures |
Apr. 2, 1996 |
| 5432119 |
High yield electron-beam gate fabrication method for sub-micron gate FETS |
Jul. 11, 1995 |
| 5426071 |
Polyimide copolymer film for lift-off metallization |
Jun. 20, 1995 |
| 5360697 |
Forming self-aligned diffusion barriers in solid state devices using lift-off process |
Nov. 1, 1994 |
| 5334542 |
Method of forming T-shaped electrode |
Aug. 2, 1994 |
| 5277749 |
Methods and apparatus for relieving stress and resisting stencil delamination when performing lift-off processes that utilize high stress metals and/or multiple evaporation steps |
Jan. 11, 1994 |
| 5240878 |
Method for forming patterned films on a substrate |
Aug. 31, 1993 |
| 5234539 |
Mechanical lift-off process of a metal layer on a polymer |
Aug. 10, 1993 |
| 5212117 |
Method of manufacturing a semiconductor device contact structure using lift |
May. 18, 1993 |
| 5209815 |
Method for forming patterned films on a substrate |
May. 11, 1993 |
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