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Class Information
Number: 257/E21.021
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Manufacture of two-terminal component for integrated circuit (epo) > Of capacitor (epo) > Formation of electrode (epo) > With increased surface area, e.g., by roughening, texturing (epo) > Having multilayers, e.g., comprising barrier layer and metal layer (epo)
Description: This subclass is indented under subclass E21.012. This subclass is substantially the same in scope as ECLA classification H01L21/02B3C4.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7459318 |
Ferroelectric and high dielectric constant integrated circuit capacitors with three-dimensional orientation for high-density memories, and method of making the same |
Dec. 2, 2008 |
| 7452783 |
Capacitor for a semiconductor device and method of forming the same |
Nov. 18, 2008 |
| 7442633 |
Decoupling capacitor for high frequency noise immunity |
Oct. 28, 2008 |
| 7435678 |
Method of depositing noble metal electrode using oxidation-reduction reaction |
Oct. 14, 2008 |
| 7435670 |
Bit line barrier metal layer for semiconductor device and process for preparing the same |
Oct. 14, 2008 |
| 7422977 |
Copper adhesion improvement device and method |
Sep. 9, 2008 |
| 7414296 |
Method of manufacturing a metal-insulator-metal capacitor |
Aug. 19, 2008 |
| 7390678 |
Method for fabricating semiconductor device |
Jun. 24, 2008 |
| 7361590 |
Semiconductor device and manufacturing method thereof |
Apr. 22, 2008 |
| 7358174 |
Methods of forming solder bumps on exposed metal pads |
Apr. 15, 2008 |
| 7341908 |
Semiconductor device and method of manufacturing the same |
Mar. 11, 2008 |
| 7335611 |
Copper conductor annealing process employing high speed optical annealing with a low temperature-deposited optical absorber layer |
Feb. 26, 2008 |
| 7332433 |
Methods of modulating the work functions of film layers |
Feb. 19, 2008 |
| 7314806 |
Methods of forming metal-insulator-metal (MIM) capacitors with separate seed |
Jan. 1, 2008 |
| 7309885 |
PRAMs having a plurality of active regions located vertically in sequence and methods of forming the same |
Dec. 18, 2007 |
| 7303983 |
ALD gate electrode |
Dec. 4, 2007 |
| 7300840 |
MIM capacitor structure and fabricating method thereof |
Nov. 27, 2007 |
| 7297616 |
Methods, photoresists and substrates for ion-implant lithography |
Nov. 20, 2007 |
| 7279421 |
Method and deposition system for increasing deposition rates of metal layers from metal-carbonyl precursors |
Oct. 9, 2007 |
| 7276453 |
Methods for forming an undercut region and electronic devices incorporating the same |
Oct. 2, 2007 |
| 7276436 |
Manufacturing method for electronic component module and electromagnetically readable data carrier |
Oct. 2, 2007 |
| 7268413 |
Bipolar transistors with low-resistance emitter contacts |
Sep. 11, 2007 |
| 7239017 |
Low-k B-doped SiC copper diffusion barrier films |
Jul. 3, 2007 |
| 7235454 |
MIM capacitor structure and method of fabrication |
Jun. 26, 2007 |
| 7232736 |
Semiconductor devices with capacitors of metal/insulator/metal structure and methods for forming the same |
Jun. 19, 2007 |
| 7164203 |
Methods and procedures for engineering of composite conductive by atomic layer deposition |
Jan. 16, 2007 |
| 7112507 |
MIM capacitor structure and method of fabrication |
Sep. 26, 2006 |
| 7074669 |
Semiconductor integrated circuit device with capacitor of crown structure and method of manufacturing the same |
Jul. 11, 2006 |
| 7067861 |
Device and method for protecting against oxidation of a conductive layer in said device |
Jun. 27, 2006 |
| 7064365 |
Ferroelectric capacitors including a seed conductive film |
Jun. 20, 2006 |
| 7057874 |
Ferroelectric capacitor |
Jun. 6, 2006 |
| 7049191 |
Method for protecting against oxidation of a conductive layer in said device |
May. 23, 2006 |
| 7049646 |
Capacitor for semiconductor integrated devices |
May. 23, 2006 |
| 7041550 |
Device and method for protecting against oxidation of a conductive layer in said device |
May. 9, 2006 |
| 7038263 |
Integrated circuits with rhodium-rich structures |
May. 2, 2006 |
| 7033933 |
Manufacturing method of semiconductor device |
Apr. 25, 2006 |
| 7033882 |
Method of forming on-chip decoupling capacitor by selectively etching grain boundaries in electrode |
Apr. 25, 2006 |
| 7030015 |
Method for forming a titanium nitride layer |
Apr. 18, 2006 |
| 7029972 |
Method of manufacturing a metal-insulator-metal capacitor |
Apr. 18, 2006 |
| 7029983 |
Methods of forming MIM type capacitors by forming upper and lower electrode layers in a recess that exposes a source/drain region of a transistor and MIM capacitors so formed |
Apr. 18, 2006 |
| 7015049 |
Fence-free etching of iridium barrier having a steep taper angle |
Mar. 21, 2006 |
| 7015532 |
Capacitor compatible with high dielectric constant materials having a low contact resistance layer and the method for forming same |
Mar. 21, 2006 |
| 7015527 |
Metal oxynitride capacitor barrier layer |
Mar. 21, 2006 |
| 7015523 |
Ferroelectric memory structure and fabrication method thereof |
Mar. 21, 2006 |
| 7012001 |
Method for manufacturing a semiconductor device for use in a memory cell that includes forming a composite layer of tantalum oxide and titanium oxide over a bottom capacitor electrode |
Mar. 14, 2006 |
| 7009230 |
Barrier stack with improved barrier properties |
Mar. 7, 2006 |
| 7001781 |
Method for producing a ferroelectric capacitor that includes etching with hardmasks |
Feb. 21, 2006 |
| 7001821 |
Method of forming and using a hardmask for forming ferroelectric capacitors in a semiconductor device |
Feb. 21, 2006 |
| 7002193 |
Ferroelectric capacitor and method of manufacturing the same |
Feb. 21, 2006 |
| 7002202 |
Metal oxynitride capacitor barrier layer |
Feb. 21, 2006 |
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