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Class Information
Number: 257/916
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Narrow band gap semiconductor material (>>1ev)
Description: Subject matter wherein an active solid-state device material is a semiconductor in which the difference between the energy levels of electrons bound to their nuclei (valence electrons) and the energy levels that allow electrons to migrate freely (conduction electrons) is less than one electron volt.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7002249 |
Microelectronic component with reduced parasitic inductance and method of fabricating |
Feb. 21, 2006 |
| 6919625 |
Surface mount multichip devices |
Jul. 19, 2005 |
| 6781219 |
Semiconductor die assembly having leadframe decoupling characters |
Aug. 24, 2004 |
| 6509640 |
Integral capacitor using embedded enclosure for effective electromagnetic radiation reduction |
Jan. 21, 2003 |
| 6504236 |
Semiconductor die assembly having leadframe decoupling characters and method |
Jan. 7, 2003 |
| 6346743 |
Embedded capacitor assembly in a package |
Feb. 12, 2002 |
| 6310388 |
Semiconductor die assembly having leadframe decoupling characters |
Oct. 30, 2001 |
| 6184574 |
Multi-capacitance lead frame decoupling device |
Feb. 6, 2001 |
| 6114736 |
Controlled dopant diffusion and metal contamination in thin polycide gate conductor of MOSFET device |
Sep. 5, 2000 |
| 6054754 |
Multi-capacitance lead frame decoupling device |
Apr. 25, 2000 |
| 5532486 |
Heterojunction diode with low turn-on voltage |
Jul. 2, 1996 |
| 5373478 |
Non-volatile memory board |
Dec. 13, 1994 |
| 5306943 |
Schottky barrier diode with ohmic portion |
Apr. 26, 1994 |
| 5278443 |
Composite semiconductor device with Schottky and pn junctions |
Jan. 11, 1994 |
| 5262669 |
Semiconductor rectifier having high breakdown voltage and high speed operation |
Nov. 16, 1993 |
| 5103283 |
Packaged integrated circuit with in-cavity decoupling capacitors |
Apr. 7, 1992 |
| 5067006 |
Semiconductor device |
Nov. 19, 1991 |
| 5055966 |
Via capacitors within multi-layer, 3 dimensional structures/substrates |
Oct. 8, 1991 |
| 5049979 |
Combined flat capacitor and tab integrated circuit chip and method |
Sep. 17, 1991 |
| 5043533 |
Chip package capacitor cover |
Aug. 27, 1991 |
| 5031069 |
Integration of ceramic capacitor |
Jul. 9, 1991 |
| 5027253 |
Printed circuit boards and cards having buried thin film capacitors and processing techniques for fabricating said boards and cards |
Jun. 25, 1991 |
| 5016087 |
Integrated circuit package |
May. 14, 1991 |
| 5010390 |
Plastic-molded semiconductor device |
Apr. 23, 1991 |
| 4994936 |
Molded integrated circuit package incorporating decoupling capacitor |
Feb. 19, 1991 |
| 4989117 |
Molded integrated circuit package incorporating thin decoupling capacitor |
Jan. 29, 1991 |
| 4984059 |
Semiconductor device and a method for fabricating the same |
Jan. 8, 1991 |
| 4982311 |
Package for very large scale integrated circuit |
Jan. 1, 1991 |
| 4967258 |
Structure for use in self-biasing and source bypassing a packaged, field-effect transistor and method for making same |
Oct. 30, 1990 |
| 4922324 |
Semiconductor integrated circuit device |
May. 1, 1990 |
| 4819056 |
Hybrid thick film circuit device |
Apr. 4, 1989 |
| 4755910 |
Housing for encapsulating an electronic circuit |
Jul. 5, 1988 |
| 4744008 |
Flexible film chip carrier with decoupling capacitors |
May. 10, 1988 |
| 4639826 |
Radiation-hardened casing for an electronic component |
Jan. 27, 1987 |
| 4636918 |
Decoupled integrated circuit package |
Jan. 13, 1987 |
| 4626958 |
Decoupling capacitor for Pin Grid Array package |
Dec. 2, 1986 |
| 4521828 |
Component module for piggyback mounting on a circuit package having dual-in-line leads |
Jun. 4, 1985 |
| 4506238 |
Hybrid circuit device |
Mar. 19, 1985 |
| 4443830 |
CR Composite part provided with discharge gap |
Apr. 17, 1984 |
| 4298846 |
Semiconductor device |
Nov. 3, 1981 |
| 4010535 |
Method of fabricating a voltage multiplier circuit assembly |
Mar. 8, 1977 |
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