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Class Information
Number: 257/916
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Narrow band gap semiconductor material (>>1ev)
Description: Subject matter wherein an active solid-state device material is a semiconductor in which the difference between the energy levels of electrons bound to their nuclei (valence electrons) and the energy levels that allow electrons to migrate freely (conduction electrons) is less than one electron volt.

Patents under this class:

Patent Number Title Of Patent Date Issued
7525183 Surface mount multichip devices Apr. 28, 2009
7002249 Microelectronic component with reduced parasitic inductance and method of fabricating Feb. 21, 2006
6919625 Surface mount multichip devices Jul. 19, 2005
6781219 Semiconductor die assembly having leadframe decoupling characters Aug. 24, 2004
6509640 Integral capacitor using embedded enclosure for effective electromagnetic radiation reduction Jan. 21, 2003
6504236 Semiconductor die assembly having leadframe decoupling characters and method Jan. 7, 2003
6346743 Embedded capacitor assembly in a package Feb. 12, 2002
6310388 Semiconductor die assembly having leadframe decoupling characters Oct. 30, 2001
6184574 Multi-capacitance lead frame decoupling device Feb. 6, 2001
6114736 Controlled dopant diffusion and metal contamination in thin polycide gate conductor of MOSFET device Sep. 5, 2000
6054754 Multi-capacitance lead frame decoupling device Apr. 25, 2000
5532486 Heterojunction diode with low turn-on voltage Jul. 2, 1996
5373478 Non-volatile memory board Dec. 13, 1994
5306943 Schottky barrier diode with ohmic portion Apr. 26, 1994
5278443 Composite semiconductor device with Schottky and pn junctions Jan. 11, 1994
5262669 Semiconductor rectifier having high breakdown voltage and high speed operation Nov. 16, 1993
5103283 Packaged integrated circuit with in-cavity decoupling capacitors Apr. 7, 1992
5067006 Semiconductor device Nov. 19, 1991
5055966 Via capacitors within multi-layer, 3 dimensional structures/substrates Oct. 8, 1991
5049979 Combined flat capacitor and tab integrated circuit chip and method Sep. 17, 1991
5043533 Chip package capacitor cover Aug. 27, 1991
5031069 Integration of ceramic capacitor Jul. 9, 1991
5027253 Printed circuit boards and cards having buried thin film capacitors and processing techniques for fabricating said boards and cards Jun. 25, 1991
5016087 Integrated circuit package May. 14, 1991
5010390 Plastic-molded semiconductor device Apr. 23, 1991
4994936 Molded integrated circuit package incorporating decoupling capacitor Feb. 19, 1991
4989117 Molded integrated circuit package incorporating thin decoupling capacitor Jan. 29, 1991
4984059 Semiconductor device and a method for fabricating the same Jan. 8, 1991
4982311 Package for very large scale integrated circuit Jan. 1, 1991
4967258 Structure for use in self-biasing and source bypassing a packaged, field-effect transistor and method for making same Oct. 30, 1990
4922324 Semiconductor integrated circuit device May. 1, 1990
4819056 Hybrid thick film circuit device Apr. 4, 1989
4755910 Housing for encapsulating an electronic circuit Jul. 5, 1988
4744008 Flexible film chip carrier with decoupling capacitors May. 10, 1988
4639826 Radiation-hardened casing for an electronic component Jan. 27, 1987
4636918 Decoupled integrated circuit package Jan. 13, 1987
4626958 Decoupling capacitor for Pin Grid Array package Dec. 2, 1986
4521828 Component module for piggyback mounting on a circuit package having dual-in-line leads Jun. 4, 1985
4506238 Hybrid circuit device Mar. 19, 1985
4443830 CR Composite part provided with discharge gap Apr. 17, 1984
4298846 Semiconductor device Nov. 3, 1981
4010535 Method of fabricating a voltage multiplier circuit assembly Mar. 8, 1977

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