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Class Information
Number: 257/81
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Incoherent light emitter structure > In combination with or also constituting light responsive device > With specific housing or contact structure
Description: Subject matter wherein the combined light emitting and light responsive device is provided with a particular housing or electrical contact structure.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6867795 |
Optical array with improved contact structure |
Mar. 15, 2005 |
| 6867542 |
Floating chip photonic device and method of manufacture |
Mar. 15, 2005 |
| 6864510 |
Nitride semiconductor field effect transistor (FET) and method of fabricating the same |
Mar. 8, 2005 |
| 6864513 |
Light emitting diode bulb having high heat dissipating efficiency |
Mar. 8, 2005 |
| 6864511 |
Optical transmission module and the production method of the same |
Mar. 8, 2005 |
| 6864509 |
Packaging optically coupled integrated circuits using flip-chip methods |
Mar. 8, 2005 |
| 6861675 |
Optically coupled semiconductor device and method for manufacturing the same |
Mar. 1, 2005 |
| 6861674 |
Electroluminescent device |
Mar. 1, 2005 |
| 6858874 |
Package structure of organic electroluminescence panel |
Feb. 22, 2005 |
| 6858873 |
Semiconductor diode having a semiconductor die with a substrate and multiple films applied thereover |
Feb. 22, 2005 |
| 6858872 |
Optical interconnection integrated circuit, method of manufacturing optical interconnection integrated circuit, electro-optical apparatus, and electronic apparatus |
Feb. 22, 2005 |
| 6858871 |
Semiconductor device and manufacturing method therefor |
Feb. 22, 2005 |
| 6853011 |
Light emitting diode and method of making the same |
Feb. 8, 2005 |
| 6849876 |
Light emitting device |
Feb. 1, 2005 |
| 6849869 |
Long lifetime polymer light-emitting devices with improved luminous efficiency and improved radiance |
Feb. 1, 2005 |
| 6849878 |
Method for fabricating a radiation-emitting semiconductor chip based on III-V nitride semiconductor, and radiation-emitting semiconductor chip |
Feb. 1, 2005 |
| 6846687 |
Process of packaging organic electroluminescent panel |
Jan. 25, 2005 |
| 6844571 |
III-nitride light-emitting device with increased light generating capability |
Jan. 18, 2005 |
| 6844570 |
Component of a radiation detector comprising a substrate with positioning structure for a photoelectric element array |
Jan. 18, 2005 |
| 6841802 |
Thin film light emitting diode |
Jan. 11, 2005 |
| 6841799 |
Optoelectronic package |
Jan. 11, 2005 |
| 6838702 |
Light emitting diode |
Jan. 4, 2005 |
| 6835960 |
Light emitting diode package structure |
Dec. 28, 2004 |
| 6835958 |
Light-emitting device |
Dec. 28, 2004 |
| 6833563 |
Multi-stack surface mount light emitting diodes |
Dec. 21, 2004 |
| 6831301 |
Method and system for electrically coupling a chip to chip package |
Dec. 14, 2004 |
| 6828589 |
Optical semiconductor device and method for manufacturing the same |
Dec. 7, 2004 |
| 6828583 |
Injection lasers fabricated from semiconducting polymers |
Dec. 7, 2004 |
| 6822258 |
Self-organized nanometer interface structure and its applications in electronic and opto-electronic devices |
Nov. 23, 2004 |
| 6822265 |
Light emitting diode |
Nov. 23, 2004 |
| 6812502 |
Flip-chip light-emitting device |
Nov. 2, 2004 |
| 6809475 |
Led lamp with light-emitting junctions arranged in a three-dimensional array |
Oct. 26, 2004 |
| 6806571 |
III nitride compound semiconductor element an electrode forming method |
Oct. 19, 2004 |
| 6803608 |
Light emitting diode used as an illuminant of an image sensor |
Oct. 12, 2004 |
| 6797989 |
Package for opto-electrical components |
Sep. 28, 2004 |
| 6797987 |
High efficiency light emitting diode and method of making the same |
Sep. 28, 2004 |
| 6794725 |
Amorphous silicon sensor with micro-spring interconnects for achieving high uniformity in integrated light-emitting sources |
Sep. 21, 2004 |
| 6787890 |
Optical package structure |
Sep. 7, 2004 |
| 6787470 |
Sacrificial feature for corrosion prevention during CMP |
Sep. 7, 2004 |
| 6787383 |
Light-emitting device and method for manufacturing the same |
Sep. 7, 2004 |
| 6784460 |
Chip shaping for flip-chip light emitting diode |
Aug. 31, 2004 |
| 6781209 |
Optoelectronic component with thermally conductive auxiliary carrier |
Aug. 24, 2004 |
| 6780750 |
Photodiode for ultra high speed optical communication and fabrication method therefor |
Aug. 24, 2004 |
| 6777715 |
Integrated circuits using optical waveguide interconnects formed through a semiconductor wafer and methods for forming same |
Aug. 17, 2004 |
| 6777805 |
Group-III nitride compound semiconductor device |
Aug. 17, 2004 |
| 6774401 |
Light emitting diode |
Aug. 10, 2004 |
| 6773943 |
Display unit and method of fabricating the same |
Aug. 10, 2004 |
| 6774447 |
Package having an opening in a surface thereof for mounting a solid state image sensor |
Aug. 10, 2004 |
| 6765275 |
Two-layer electrical substrate for optical devices |
Jul. 20, 2004 |
| 6758606 |
Modular optoelectronic connector |
Jul. 6, 2004 |
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